公开(公告)号：US11764137B2

公开(公告)日：2023-09-19

申请号：US17140926

申请日：2021-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Cheng Yuan Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49838 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

公开(公告)号：US20230141357A1

公开(公告)日：2023-05-11

申请号：US18083033

申请日：2022-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gidae KIM

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/145 ,  H05K1/114 ,  H05K1/181 ,  H05K2201/09409 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10325 ,  H05K2201/10446

Abstract: An electronic device includes a first printed circuit board; a second printed circuit board spaced apart from the first printed circuit board; a connection member electrically connecting the first printed circuit board and the second printed circuit board, the connection member including a first connection part connected to the first printed circuit board and a second connection part connected to the second printed circuit board; and a first intermediate member including: a first connector provided on a first surface of the first intermediate member facing the first printed circuit board and electrically connected to the first printed circuit board; and a second connector provided on a second surface of the first intermediate member opposite to the first surface and electrically connected to the connection member and the first connector, wherein the first connector and the second connector are separated from each other in a first direction.

公开(公告)号：US20190246505A1

公开(公告)日：2019-08-08

申请号：US16112759

申请日：2018-08-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyuk-jin LEE ,  Kyu-deuk KIM ,  Jae-young HONG

IPC: H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3405 ,  H01R12/7041 ,  H01R12/707 ,  H01R12/725 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/3415 ,  H05K3/3452 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10992 ,  H05K2203/1484 ,  H05K2203/163

Abstract: A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.

公开(公告)号：US20180233860A1

公开(公告)日：2018-08-16

申请号：US15892743

申请日：2018-02-09

Applicant: LOTES CO., LTD

Inventor： Chin Chi Lin ,  Cheng Wei Lo

IPC: H01R13/66 ,  H01R13/506 ,  H01R12/57 ,  H01R12/53 ,  H01R13/516 ,  H05K1/02

CPC classification number: H01R13/6591 ,  H01L23/3675 ,  H01R12/53 ,  H01R12/57 ,  H01R12/716 ,  H01R12/725 ,  H01R12/732 ,  H01R13/405 ,  H01R13/506 ,  H01R13/516 ,  H01R13/5213 ,  H01R13/5216 ,  H01R13/6581 ,  H01R13/6594 ,  H01R13/665 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20154 ,  H05K7/2039 ,  H05K2201/0215 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446

Abstract: An electrical connector assembly includes: a circuit board; a connector, located in front of the circuit board and electrically connected to the circuit board; a chip, provided on the circuit board, and electrically connected to the circuit board; a metal shell, covering the connector and the circuit board; and an inner film, made of a high heat conductive material, and wrapping the chip and the circuit board. At least a part of the inner film is located between the metal shell and the circuit board. When the chip generates a great amount of heat, the inner film, serving as a medium, can absorb the heat rapidly and conduct the heat to the metal shell so as to dissipate the heat outside.

公开(公告)号：US20180213647A1

公开(公告)日：2018-07-26

申请号：US15880393

申请日：2018-01-25

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Marco GAVAGNIN ,  Thomas KRIVEC

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/25 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2924/18162 ,  H05K1/185 ,  H05K3/30 ,  H05K2201/10446 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/1469

Abstract: An auxiliary structure for embedding a component in a component carrier is disclosed. The auxiliary structure has a solid state transition piece for at least partially, in particular substantially fully circumferentially, enclosing the component, wherein the solid-state transition piece consists of a material being or becoming adhesive in a liquid state and being liquefiable by heat and/or pressure so as to fill a gap between the component and surrounding component carrier material by applying heat and/or pressure.

公开(公告)号：US09748718B2

公开(公告)日：2017-08-29

申请号：US14865969

申请日：2015-09-25

Applicant: Quanta Computer Inc.

Inventor： Kuo-Chun Huang

IPC: H01R12/00 ,  H01R27/02 ,  H01R12/72

CPC classification number: H01R27/02 ,  H01R12/716 ,  H01R12/721 ,  H01R12/724 ,  H01R31/06 ,  H05K1/0215 ,  H05K3/4015 ,  H05K2201/09027 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A connection adapter is provided. In certain configurations, the connection adapter includes an input portion with a plurality of sets of input connectors, a first output portion extending from the input portion in a first direction and including a first set of output connectors, and a second output portion extending from the input portion in a second direction and including a second set of output connectors. In the connection adapter, the sets of input connectors are electrically coupled to each of the first set of output connectors and the second set of output connectors. Further, the first and second directions are substantially perpendicular to each other, while the input portion extends in a third direction that is not substantially perpendicular to the first direction or the second direction.

公开(公告)号：US09705204B2

公开(公告)日：2017-07-11

申请号：US13657476

申请日：2012-10-22

Applicant: Keyssa, Inc.

Inventor： Gary D. McCormack ,  Ian A. Kyles

IPC: H01Q21/24 ,  H01Q1/36 ,  H04B5/00 ,  H05K1/02 ,  H01L23/66 ,  H01L23/495 ,  H05K1/14

CPC classification number: H01Q21/24 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01Q1/36 ,  H04B5/0031 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/142 ,  H05K2201/10098 ,  H05K2201/10446 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device may include a PCB having a substantially planar surface and one or more electronic components mounted thereon. A first EHF communication unit may be mounted on the substantially planar surface of the PCB. The first EHF communication unit may include a first planar die containing a first communication circuit, the first die extending along the substantially planar surface of the PCB in a die plane. A first antenna may be operatively connected to the first circuit by interconnecting conductors, the first antenna being configured to at least one of transmit and receive electromagnetic radiation along a plane of the substantially planar surface of the PCB. The first EHF communication unit may have an uppermost surface having a height from the substantially planar surface of the PCB, the first EHF communication unit height being determined by an uppermost surface of the die, the first antenna, and the interconnecting conductors.

公开(公告)号：US09478888B2

公开(公告)日：2016-10-25

申请号：US14594640

申请日：2015-01-12

Applicant: Hubbell Incorporated

Inventor： Shadi Alex AbuGhazaleh ,  Joseph Edgar Dupuis ,  Christopher Wayne Gribble ,  Naved Shah Khan ,  Douglas Paul O'Connor

IPC: H01R13/24 ,  H05K3/32 ,  H01R24/64 ,  H01R13/6466 ,  H01R24/62 ,  H01R43/20 ,  H01R13/405 ,  H01R13/66 ,  H01R107/00 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01R24/64 ,  H01R13/24 ,  H01R13/2442 ,  H01R13/405 ,  H01R13/6466 ,  H01R13/6625 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H01R43/205 ,  H01R2107/00 ,  H05K1/18 ,  H05K1/182 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10424 ,  H05K2201/10446 ,  Y02P70/611 ,  Y10S439/941 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151

Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.

Abstract translation: 适于接收配合插头的电连接器利用能够在其PCB固定的基座部分上弯曲的低轮廓的插座端子触头，其基本上平行于PCB。 每个末端接触件的远端连接部分或中间过渡部分中的任何弯曲是渐进的并且形成钝角，从而最小化应力集中。 触点优选地布置在两个相互面对的和交叉的四行触点中。 在一个实施例中，端子触头通过接触支架锚固到PCB，该接触支架将两个间隔开的锚固位置限制每个端子触头的基部，从而允许基部在其间弯曲。 在另一个实施例中，端子触点的基部嵌入至少一个弹性体构件中，该弹性构件安装到PCB上。

公开(公告)号：US20160308330A1

公开(公告)日：2016-10-20

申请号：US14782980

申请日：2014-04-10

Applicant: Florent LIFFRAN ,  Olivier RABOT

Inventor： Florent LIFFRAN ,  Olivier RABOT

IPC: H01S5/042 ,  H03K3/57

CPC classification number: H01S5/0428 ,  H03K3/57 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10446 ,  H05K2201/10545 ,  Y02P70/611

Abstract: The invention concerns a device for controlling at least one diode 2, the control device comprising an electrical card 4 comprising a printed circuit 5 on which the following are mounted: a diode 2, a front component 7 and a storage capacitor 9 connected in such a way as to form a circuit loop 17 extending substantially in a thickness of the electrical card 4.

Abstract translation: 本发明涉及一种用于控制至少一个二极管2的装置，该控制装置包括一个电子卡4，该电子卡包括印刷电路5，其上安装有以下装置：二极管2，前部组件7和存储电容器9， 以形成基本上以电卡4的厚度延伸的电路回路17。

公开(公告)号：US20160294086A1

公开(公告)日：2016-10-06

申请号：US15037612

申请日：2015-06-18

Applicant: SAMSUNG ELECTRONICS., LTD.

Inventor： Yeon Woo KIM ,  Kyung Gu KIM ,  Gyu Sub KIM ,  Se Hyun PARK ,  Jin Woo JUNG ,  Jae Bong CHUN

IPC: H01R12/70 ,  H05K1/02

CPC classification number: H01R12/7076 ,  H05K1/02 ,  H05K3/325 ,  H05K2201/09163 ,  H05K2201/09209 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10446

Abstract: A connecting member for electrically connecting a circuit board and a component in an electronic device is provided. The connecting member includes at least one bending part configured to comprise elasticity, a pad part connected to the bending part and configured to be attached to one surface of the circuit board, and a fixing part extending from the pad part and configured to fix the connecting member to the circuit board.

Abstract translation: 提供了用于电连接电路板和电子设备中的部件的连接构件。 连接构件包括构造成包括弹性的至少一个弯曲部分，连接到弯曲部分并且被构造成附接到电路板的一个表面的焊盘部分，以及从焊盘部分延伸的固定部分， 成员到电路板。