公开(公告)号：US09883589B2

公开(公告)日：2018-01-30

申请号：US14764795

申请日：2014-07-30

Applicant: KYOCERA Corporation

Inventor： Kouichi Kawasaki

IPC: H05K7/10 ,  H05K1/11 ,  H01L23/13 ,  H01L23/498 ,  H01L23/24 ,  H01L23/00 ,  H05K3/34 ,  H05K1/18 ,  H05K1/02 ,  H01R9/00 ,  H01L23/48 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49838 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/4629 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09663 ,  H05K2201/097 ,  H05K2201/098 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/2054 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.

公开(公告)号：US20180020550A1

公开(公告)日：2018-01-18

申请号：US15467004

申请日：2017-03-23

Applicant: Samsung Display Co., Ltd.

Inventor： Sehui JANG ,  Sung-dong PARK ,  Chongguk LEE ,  Byoungdoo JEONG

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/189 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10128

Abstract: A flexible film includes a base film including an edge portion which extends in a first direction, a plurality of wirings disposed on the base film, and a plurality of pads which is disposed in the edge portion of the base film and connected to the plurality of wirings. The plurality of pads disposed in the edge portion include a plurality of horizontal pads horizontally arranged in the first direction to define a pad row extended in the first direction; and a vertical pad including a plurality of vertically arranged pads arranged in a second direction perpendicular to the first direction, within a same pad row in which the plurality of horizontal pads are horizontally arranged.

公开(公告)号：US09872383B1

公开(公告)日：2018-01-16

申请号：US14266636

申请日：2014-04-30

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/00 ,  H05K1/03 ,  H01R4/00 ,  D05B17/00 ,  H01R4/02 ,  H01R43/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.

公开(公告)号：US20160242295A1

公开(公告)日：2016-08-18

申请号：US14862549

申请日：2015-09-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dong-Ho KIM

IPC: H05K1/18 ,  H01L27/32 ,  H05K1/11 ,  H01L51/52 ,  H05K1/14

CPC classification number: H05K1/189 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/147 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10128 ,  Y02P70/611

Abstract: A display device including a flexible circuit board including an insulation film, the insulation film including an input pad part and an output pad part on a first side thereof; a printed circuit board including a first pad part, the first pad part being connected to the input pad part; and a display panel including a second pad part, the second pad part being connected to the output pad part, wherein the input pad part includes a plurality of input pads that are arranged in at least two pad columns, and the flexible circuit board includes a plurality of dummy layers aligned with the plurality of input pads on a second side of the insulation film, the second side being an opposite side to the first side.

Abstract translation: 一种显示装置，包括：包括绝缘膜的柔性电路板，所述绝缘膜包括输入焊盘部分和在其第一侧上的输出焊盘部分; 印刷电路板，包括第一焊盘部分，所述第一焊盘部分连接到所述输入焊盘部分; 以及包括第二焊盘部分的显示面板，所述第二焊盘部分连接到所述输出焊盘部分，其中所述输入焊盘部分包括布置在至少两个焊盘列中的多个输入焊盘，并且所述柔性电路板包括： 多个虚设层与绝缘膜的第二侧上的多个输入焊盘对准，第二侧与第一侧相反。

公开(公告)号：US20160172622A1

公开(公告)日：2016-06-16

申请号：US14904875

申请日：2014-07-24

Applicant: LG CHEM, LTD.

Inventor： Ducksu OH ,  Minsoo KANG

IPC: H01L51/52 ,  H01L51/00

CPC classification number: H01L51/5246 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/5203 ,  H05K1/028 ,  H05K1/11 ,  H05K1/118 ,  H05K1/14 ,  H05K1/147 ,  H05K1/189 ,  H05K3/32 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/049

Abstract: An organic light emitting diode including a structure of a flexible printed circuit board installed on a substrate is provided.

Abstract translation: 提供一种包括安装在基板上的柔性印刷电路板的结构的有机发光二极管。

公开(公告)号：US09355981B2

公开(公告)日：2016-05-31

申请号：US13596322

申请日：2012-08-28

Applicant: Min Jae Lee ,  You Shin Chung ,  Hoon Jung

Inventor： Min Jae Lee ,  You Shin Chung ,  Hoon Jung

IPC: H01L21/00 ,  H01L23/00 ,  H05K3/34 ,  H05K3/30 ,  H01L23/498

CPC classification number: H01L24/17 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05567 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1412 ,  H01L2224/14133 ,  H01L2224/16105 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/09418 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/166 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: Provided is a semiconductor device in which misalignment between a semiconductor die and a substrate (e.g., a circuit board) can be prevented or substantially reduced when the semiconductor die is attached to the circuit board. In a non-limiting example, the semiconductor device includes: a semiconductor die comprising at least one bump; and a circuit board comprising at least one circuit pattern to which the bump is electrically connected. In a non-limiting example, the circuit board comprises: an insulation layer comprising a center region and peripheral regions around the center region; a plurality of center circuit patterns formed in the center region of the insulation layer; and a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer. The center circuit patterns may be formed wider than the peripheral circuit patterns, formed in a zigzag pattern, and/or may be formed in a crossed shape.

公开(公告)号：US20150373846A1

公开(公告)日：2015-12-24

申请号：US14764795

申请日：2014-07-30

Applicant: KYOCERA CORPORATION

Inventor： Kouichi KAWASAKI

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49838 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/4629 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09663 ,  H05K2201/097 ,  H05K2201/098 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/2054 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.

Abstract translation: 布线板具有绝缘基板和在绝缘基板上的平面图中彼此相邻设置的多个电极，电极在外周具有开口，并且具有从外周到内部的狭缝，以及 在彼此相邻的两个电极中，一个电极中的狭缝具有与另一个电极的外周相交的中心线。

公开(公告)号：US20150366049A1

公开(公告)日：2015-12-17

申请号：US14526182

申请日：2014-10-28

Applicant: Samsung Display Co., Ltd.

Inventor： Dae Geun LEE

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01L27/124 ,  G02F1/13458 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H01L27/3276 ,  H01L2224/05552 ,  H01L2224/06152 ,  H01L2224/81132 ,  H01L2924/3511 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49005

Abstract: An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

Abstract translation: 阵列基板，包括显示区域和围绕显示区域的非显示区域。 非显示区域包括包括一个或多个每个具有平行四边形形状的第一焊盘的焊盘部分。

公开(公告)号：US20150354999A1

公开(公告)日：2015-12-10

申请号：US14299563

申请日：2014-06-09

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01D11/30

CPC classification number: G01R33/09 ,  G01D5/142 ,  G01D5/24442 ,  G01D11/305 ,  G01R33/0023 ,  G01R33/0047 ,  H01L43/02 ,  H01L43/08 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48245 ,  H01L2924/00014 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10151 ,  H05K2201/10522 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A sensor arrangement according to an embodiment includes a board with a plurality of conductive lines of a first type, and a plurality of conductive lines of a second type different from the conductive lines of the first type, and a recess. The sensor arrangement further includes a plurality of sensor devices mechanically accommodated on a main surface of the board and arranged around the recess, each sensor device being electrically coupled to the conductive lines of the first type and at least to one of the conductive lines of the second type, wherein each conductive line of the second type electrically couples a sensor device with at least one other item different from the sensor devices of the plurality of sensor devices. A projection of the conductive lines of the first and second types perpendicular to the main surface is crossing-free. Each conductive line of the first type electrically couples at least all of the plurality of sensor devices.

Abstract translation: 根据实施例的传感器装置包括具有第一类型的多条导电线的多个导线和与第一类型的导电线不同的第二类型的多条导线，以及一个凹部。 所述传感器装置还包括机械地容纳在所述板的主表面上并且布置在所述凹部周围的多个传感器装置，每个传感器装置电耦合到所述第一类型的导线和至少一个所述导线 第二类型，其中第二类型的每条导线将传感器装置与不同于多个传感器装置的传感器装置的至少一个其它物品电耦合。 垂直于主表面的第一和第二类型的导线的突出是无交叉的。 第一类型的每个导电线至少电连接多个传感器装置的全部。

公开(公告)号：US20150334259A1

公开(公告)日：2015-11-19

申请号：US14698238

申请日：2015-04-28

Applicant: CANON COMPONENTS, INC

Inventor： Akio MIHARA

IPC: H04N1/00 ,  H05K1/18 ,  H05K1/03 ,  H04N1/191 ,  H05K1/11

CPC classification number: H05K3/284 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H04N1/00557 ,  H04N1/00559 ,  H04N1/191 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/181 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09418 ,  H05K2201/10151 ,  H05K2201/10636 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A circuit board includes: a printed board including SWB pads for wire bonding and lands; image sensor ICs mounted on the printed board by a thermosetting adhesive and including FWB pads for wire bonding to be electrically connected to the SWB pads by wire bonding; and surface-mount elements mounted on the lands by soldering, wherein the surface-mount elements and the lands are connected by solders including bromine-containing flux, and coating films are formed on surfaces of the solders to prevent attachment of bromine to the SWB pads and the FWB pads.

Abstract translation: 电路板包括：印刷板，其包括用于引线接合和焊盘的SWB焊盘; 图像传感器IC通过热固性粘合剂安装在印刷板上，并且包括用于引线接合的FWB焊盘，以通过引线接合电连接到SWB焊盘; 和通过焊接安装在焊盘上的表面安装元件，其中表面安装元件和焊盘由包括含溴助焊剂的焊料连接，并且在焊料的表面上形成涂膜以防止溴附着到SWB焊盘 和FWB垫。