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公开(公告)号：US09710421B2
公开(公告)日：2017-07-18
申请号：US14569041
申请日：2014-12-12
Applicant: Intel Corporation
Inventor： Vladimir Tamarkin , Wayne Genetti , David Schweitzer
CPC classification number: G06F13/4282 , G06F1/16 , G06F1/185 , G06F1/186 , G06F13/4022 , G06F13/409 , G06F2213/0026 , H01R12/716 , H01R12/721 , H01R12/722 , H01R12/727 , H01R12/73 , H01R12/737 , H05K1/0296 , H05K1/145 , H05K3/308 , H05K5/0286 , H05K7/1422 , H05K2201/10
Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.
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公开(公告)号：US20170118844A1
公开(公告)日：2017-04-27
申请号：US15175378
申请日：2016-06-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. CHAMBERLIN , Andreas HUBER , Harald HUELS , Thomas STRACH , Thomas-Michael WINKEL
CPC classification number: H05K1/184 , B23K1/0016 , H05K1/0298 , H05K1/092 , H05K1/111 , H05K1/113 , H05K1/116 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K1/186 , H05K3/0047 , H05K3/3447 , H05K3/429 , H05K3/46 , H05K3/4644 , H05K3/4697 , H05K2201/093 , H05K2201/09309 , H05K2201/09327 , H05K2201/09345 , H05K2201/09381 , H05K2201/09518 , H05K2201/09545 , H05K2201/096 , H05K2201/09845 , H05K2201/10 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10174
Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.
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公开(公告)号：US20170079143A1
公开(公告)日：2017-03-16
申请号：US15082020
申请日：2016-03-28
Applicant: Samsung Electro-Mechanic Co., Ltd.
Inventor： Hyung-Gi HA , Jong-Myeon LEE , Jong-Rip KIM
CPC classification number: H05K1/0271 , H05K1/185 , H05K3/0052 , H05K3/0097 , H05K2201/09136 , H05K2201/09781 , H05K2201/10
Abstract: A printed circuit board includes: a strip substrate sectioned into unit areas; electronic components respectively installed in each of the unit areas; and a separation space disposed between the unit areas.
Abstract translation: 印刷电路板包括：条状基板，分成单元区域; 电子元件分别安装在每个单位区域; 以及设置在单元区域之间的分离空间。
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公开(公告)号：US20160205780A1
公开(公告)日：2016-07-14
申请号：US14989558
申请日：2016-01-06
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae-Ean Lee , Jee-Soo Mok , Young-Gwan Ko , Kyung-Hwan Ko , Yong-Ho Baek
CPC classification number: H05K3/4697 , H01L2224/16227 , H01L2924/15153 , H05K1/113 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/0011 , H05K3/3436 , H05K3/4007 , H05K3/4038 , H05K2201/10
Abstract: A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via.
Abstract translation: 印刷电路板包括：芯板，在其第一表面上包括元件安装部分和元件非安装部分; 设置在所述元件非安装部上的绝缘层; 设置在所述绝缘层上的覆铜层压板; 通过穿透绝缘层和覆铜层压板的第一穿透; 以及设置在所述芯板中并连接到所述第一穿透通孔的第二穿透通孔。
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公开(公告)号：US20150092369A1
公开(公告)日：2015-04-02
申请号：US14565532
申请日：2014-12-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoki Gouchi
CPC classification number: H05K1/185 , B32B37/04 , B32B37/142 , B32B37/18 , B32B2305/342 , H01L24/19 , H01L24/25 , H01L2224/04105 , H01L2224/2518 , H01L2924/12042 , H05K1/0298 , H05K1/0313 , H05K1/115 , H05K1/181 , H05K1/186 , H05K3/4632 , H05K2201/0129 , H05K2201/0141 , H05K2201/0154 , H05K2201/09781 , H05K2201/10 , H05K2201/1006 , H05K2201/10204 , H05K2203/063 , H01L2924/00
Abstract: A component-embedded substrate includes a multilayer body formed by stacking up a plurality of resin layers in a predetermined direction, a component embedded in the multilayer body, the component having a plurality of terminal electrodes, a plurality of joining conductors provided in the multilayer body and joined to the plurality of terminal electrodes, a plurality of wiring conductors provided in the multilayer body and electrically coupled to the plurality of joining conductors and at least one auxiliary member enclosed within an outer boundary of the component provided in the multilayer body. The auxiliary member may be electrically insulated from each of the plurality of wiring conductors and arranged to balance pressures acting on the plurality of terminal electrodes when pressure is applied on the multilayer body.
Abstract translation: 部件嵌入式基板包括通过沿预定方向堆叠多个树脂层而形成的多层体，嵌入在多层体中的部件，具有多个端子电极的部件，设置在多层体中的多个接合导体 并且与所述多个端子电极接合，设置在所述多层体中并电耦合到所述多个接合导体的多个布线导体和包围在设置在所述多层体中的所述部件的外边界内的至少一个辅助构件。 辅助构件可以与多个布线导体中的每一个电绝缘，并且被布置为当在多层体上施加压力时平衡作用在多个端子电极上的压力。
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Patent Agency Ranking
公开(公告)号：US20140153266A1
公开(公告)日：2014-06-05
申请号：US13919033
申请日：2013-06-17
Applicant: Hyeong-Gwon KIM
Inventor： Hyeong-Gwon KIM
IPC: H05K7/02
CPC classification number: H04M1/0268 , G09F9/301 , H04M1/0277 , H05K1/118 , H05K1/147 , H05K1/185 , H05K3/4691 , H05K2201/05 , H05K2201/10 , H05K2201/10681
Abstract: A display device includes a flexible display panel for displaying an image, and a printed circuit board electrically connected with the flexible display panel through a circuit film. The printed circuit board may include a plurality of boards in a stack, the boards being respectively provided with integrated circuits, driving chips, and circuit wires, and a conducting portion connecting circuit wires of at least two boards among the plurality of boards.
Abstract translation: 显示装置包括用于显示图像的柔性显示面板和通过电路膜与柔性显示面板电连接的印刷电路板。 印刷电路板可以包括堆叠中的多个板，所述板分别设置有集成电路，驱动芯片和电路线，以及连接多个板中的至少两个板的电路线的导电部分。
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公开(公告)号：US20240164021A1
公开(公告)日：2024-05-16
申请号：US18420528
申请日：2024-01-23
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chien-Fan CHEN , Chien-Hao WANG
IPC: H05K1/18 , H01L21/48 , H01L21/56 , H01L23/538
CPC classification number: H05K1/183 , H01L21/4857 , H01L21/486 , H01L21/568 , H01L23/5383 , H01L23/5386 , H01L2224/04105 , H01L2924/11 , H01L2924/15153 , H05K2201/10
Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.
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18.发明授权公开(公告)号：US09999131B2
公开(公告)日：2018-06-12
申请号：US14991608
申请日：2016-01-08
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Kyung-Hwan Ko , Young-Gwan Ko , Jae-Ean Lee , Jee-Soo Mok , Yong-Ho Baek
CPC classification number: H05K1/183 , H01L24/14 , H01L24/17 , H01L24/49 , H01L2224/14 , H01L2224/16225 , H01L2224/17 , H01L2224/48091 , H01L2224/49109 , H01L2224/73257 , H01L2924/00014 , H05K1/115 , H05K1/162 , H05K1/182 , H05K1/185 , H05K3/284 , H05K3/4697 , H05K2201/0919 , H05K2201/09381 , H05K2201/10 , H05K2201/10007 , H05K2201/10022 , H05K2201/1003 , H01L2224/45099
Abstract: A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.
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公开(公告)号：US09913381B2
公开(公告)日：2018-03-06
申请号：US14460587
申请日：2014-08-15
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park , Kyoung Ja Yun
CPC classification number: H05K3/0052 , H01L33/48 , H01L33/62 , H01L2924/0002 , H05K1/183 , H05K2201/09718 , H05K2201/09827 , H05K2201/09845 , H05K2201/09854 , H05K2201/09863 , H05K2201/10 , H05K2201/10106 , H05K2201/10121 , Y10T29/49155 , H01L2924/00
Abstract: A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole.
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公开(公告)号：US09839131B2
公开(公告)日：2017-12-05
申请号：US14918678
申请日：2015-10-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. Chamberlin , Andreas Huber , Harald Huels , Thomas Strach , Thomas-Michael Winkel
CPC classification number: H05K1/184 , B23K1/0016 , H05K1/0298 , H05K1/092 , H05K1/111 , H05K1/113 , H05K1/116 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K1/186 , H05K3/0047 , H05K3/3447 , H05K3/429 , H05K3/46 , H05K3/4644 , H05K3/4697 , H05K2201/093 , H05K2201/09309 , H05K2201/09327 , H05K2201/09345 , H05K2201/09381 , H05K2201/09518 , H05K2201/09545 , H05K2201/096 , H05K2201/09845 , H05K2201/10 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10174
Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.
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