公开(公告)号：US20240040702A1

公开(公告)日：2024-02-01

申请号：US18268364

申请日：2021-09-30

Applicant: HITACHI,ASTEMO, LTD.

Inventor： Takeshi TOKUYAMA ,  Takahiro ARAKI ,  Shigehise AOYAGI

IPC: H05K1/18 ,  H01L25/18 ,  H02M7/00 ,  H01L23/495 ,  H02M7/537 ,  H01L23/00

CPC classification number: H05K1/186 ,  H01L25/18 ,  H02M7/003 ,  H05K2201/10787 ,  H05K2201/10931 ,  H05K2201/09072 ,  H05K2201/10901 ,  H01L2224/40225 ,  H01L23/49524 ,  H05K2201/10946 ,  H05K2201/10174 ,  H02M7/537 ,  H01L24/40 ,  H05K2201/10166

Abstract: A power semiconductor device includes: a circuit body having a pair of conductor parts and a power semiconductor element sandwiched between the pair of conductor parts; a substrate in which a through hole is formed; and a sealing material that seals at least a part of each of the circuit body and the substrate, in which the circuit body is inserted into the through hole and has first and second exposed surfaces exposed from the sealing material, and the substrate has, in the through hole, a first protrusion and a second protrusion that protrude toward a center of the through hole and are connected to the circuit body, the first protrusion and the second protrusion being formed at positions opposed to each other in the through hole, and at least one of the first protrusion and the second protrusion being a terminal that transmits power to the power semiconductor element.

公开(公告)号：US11889614B2

公开(公告)日：2024-01-30

申请号：US17382526

申请日：2021-07-22

Applicant: BorgWarner Inc.

Inventor： Lathom Alexander Louco

IPC: H05K1/02 ,  H05K7/20 ,  H05K5/00

CPC classification number: H05K1/0209 ,  H05K5/003 ,  H05K7/20845 ,  H05K2201/042 ,  H05K2201/10166 ,  H05K2201/10212

Abstract: An electronics assembly used in a vehicle included a printed circuit board (PCB) having a first side and a second side; a plurality of electrical components mounted on the first side of the PCB; a heat sink, configured to receive cooling fluid from a source, positioned adjacent to the second side of the PCB; and a cooling fluid conduit, configured to communicate the cooling fluid from a fluid inlet to a fluid outlet, wherein the cooling fluid conduit is positioned adjacent to the first side of the PCB and directly contacts an outer surface of the electrical components.

公开(公告)号：US20230412070A1

公开(公告)日：2023-12-21

申请号：US18241836

申请日：2023-09-01

Applicant: ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP

Inventor： Ziwei Yu ,  Lin Chen ,  Zhiqiang Niu

IPC: H02M1/44 ,  H05K7/20 ,  H05K1/18 ,  H05K1/11

CPC classification number: H02M1/44 ,  H05K7/209 ,  H05K1/181 ,  H05K1/111 ,  H05K2201/10166

Abstract: A power semiconductor package comprises a lead frame, a semiconductor chip, and a molding encapsulation. The lead frame comprises an elevated section comprising a source section; a drain section; and a plurality of leads. The semiconductor chip includes a metal-oxide-semiconductor field-effect transistor (MOSFET) disposed over the lead frame. The semiconductor chip comprises a source electrode, a drain electrode, and a gate electrode. The source electrode of the semiconductor chip is electrically and mechanically connected to the source section of the elevated section of the lead frame. The semiconductor chip is served as a low side field-effect transistor as a flipped-chip connected to a heat sink by a first thermal interface material. A high side field-effect transistor is connected to the heat sink by a second thermal interface material. The low side field-effect transistor and the high side field-effect transistor are mounted on a printed circuit board.

公开(公告)号：US11824429B2

公开(公告)日：2023-11-21

申请号：US17283738

申请日：2019-10-18

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kazuki Sasao ,  Masanori Hayashibara ,  Hideki Ito

IPC: H02M3/158 ,  H02M1/084 ,  H05K1/02

CPC classification number: H02M3/1584 ,  H02M1/084 ,  H05K1/0231 ,  H05K2201/10166 ,  H05K2201/10507

Abstract: A DC/DC converter includes N inductors and N power modules which correspond to N phases. The N inductors each include a plurality of inductor chips that are electrically connected in parallel to each other. The plurality of inductor chips are mounted separately on a main mounting surface and a sub-mounting surface of a printed circuit board. The sub-mounting surface is opposite to the main mounting surface.

公开(公告)号：US20230371182A1

公开(公告)日：2023-11-16

申请号：US18359074

申请日：2023-07-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiki TOBITA ,  Issei YAMAMOTO

IPC: H05K1/16 ,  H01L23/498 ,  H05K1/18 ,  H01F27/28 ,  H05K1/11

CPC classification number: H05K1/165 ,  H01L23/49838 ,  H05K1/181 ,  H01F27/2804 ,  H05K1/111 ,  H05K2201/10166 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10234 ,  H05K2201/10522 ,  H01L24/16

Abstract: To provide wiring board capable of reducing influence of variation in size of conductive member on coil conductor. Wiring board according to present disclosure includes insulating layer, plurality of land electrodes formed on lower surface of insulating layer, solder ball formed on surface of at least one of plurality of land electrodes, and coil conductor provided inside insulating layer and having winding axis intersecting lower surface. Plurality of land electrodes includes electrode at a position overlapped opening of coil conductor in plan view seen at the wiring board from lower surface side, and second electrode at a position deviated from opening of coil conductor in plan view. Area of first electrode is larger than area of second electrode in plan view.

公开(公告)号：US20230371165A1

公开(公告)日：2023-11-16

申请号：US17742442

申请日：2022-05-12

Applicant: Infineon Technologies Austria AG

Inventor： Gerald Deboy ,  Kok Yau Chua ,  Angela Kessler ,  Kennith Kin Leong ,  Chee Yang Ng ,  Luca Peluso

IPC: H05K1/02 ,  H05K1/18 ,  H01F27/24 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/182 ,  H05K1/0216 ,  H01F27/24 ,  H05K7/2039 ,  H05K2201/1003 ,  H05K2201/10166

Abstract: A voltage regulator module includes: power input and output terminals at a same side of the voltage regulator module; a first power stage configured to receive an input voltage from the power input terminal and output a phase current at a switch node of the first power stage, the first power stage including an inductor having a vertical conductor embedded in a magnetic core, the vertical conductor having a first end which is electrically connected to the switch node and a second end opposite the first end; and a first metal clip which electrically connects the second end of the vertical conductor to the power output terminal such that power is delivered to and from the voltage regulator module at the same side of the voltage regulator module. A method of producing the voltage regulator module and electronic assembly that includes the voltage regulator module are also described.

公开(公告)号：US20230337353A1

公开(公告)日：2023-10-19

申请号：US17720685

申请日：2022-04-14

Applicant: Hamilton Sundstrand Corporation

Inventor： John Dickey ,  Kevin Kilroy

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/10

CPC classification number: H05K1/0207 ,  H05K1/021 ,  H05K1/09 ,  H05K1/181 ,  H05K3/107 ,  H05K2201/0302 ,  H05K2201/032 ,  H05K2201/10166

Abstract: Circuit board assemblies include a circuit board portion having a recess formed therein, an electrically and thermally conductive insert, shaped to fit in the recess formed in the circuit board portion, an electrically and thermally conductive layer adapted and configured to interface with an external chassis, and a thermally conductive electrically insulative portion interposed between the electrically and thermally conductive insert and the electrically and thermally conductive layer, adapted and configured to conduct heat from the electrically and thermally conductive insert to the electrically and thermally conductive layer without conducting electricity.

公开(公告)号：US20230282632A1

公开(公告)日：2023-09-07

申请号：US18158430

申请日：2023-01-23

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Ryo NOMAGUCHI ,  Takahito HARADA

IPC: H01L25/18 ,  H01L23/00 ,  H05K1/02

CPC classification number: H01L25/18 ,  H01L24/48 ,  H01L24/49 ,  H05K1/0296 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1203 ,  H05K2201/10174 ,  H05K2201/10166

Abstract: A semiconductor module, including a first main wiring line connecting portion and a second main wiring line connecting portion, and a main output wiring line connecting portion is provided. The circuit board includes a circuit region in which the first circuit and the second circuit are arranged alongside each other in the first direction, and a first connecting region and a second connecting region arranged sandwiching the circuit region in a second direction orthogonal to the first direction. The first main wiring line connecting portion and the second main wiring line connecting portion are provided in the first connecting region, and the main output wiring line connecting portion is provided in the second connecting region.

公开(公告)号：US11744018B2

公开(公告)日：2023-08-29

申请号：US17147908

申请日：2021-01-13

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Peter Alexandre Blais ,  James A. Burk ,  Galen W. Miller ,  Hunter Hayes ,  Allen Templeton ,  Lonnie G. Jones ,  Mark R. Laps

IPC: H05K1/18 ,  H01G4/38 ,  H05K1/14 ,  H05K1/02 ,  H05K3/32 ,  H01L29/20 ,  H01G4/30 ,  H01L25/07 ,  H01L29/16

CPC classification number: H05K1/181 ,  H01G4/38 ,  H05K1/0272 ,  H05K1/145 ,  H05K3/328 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：US20230225044A1

公开(公告)日：2023-07-13

申请号：US18154303

申请日：2023-01-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Oseob JEON ,  Seungwon IM ,  Roveendra PAUL ,  Jerome TEYSSEYRE

IPC: H05K1/02 ,  H05K1/18 ,  H03K17/687

CPC classification number: H05K1/0216 ,  H05K1/181 ,  H03K17/6871 ,  H05K2201/10166 ,  H03K2217/0063 ,  H03K2217/0072

Abstract: In general aspect, a module can include a substrate having a semiconductor circuit implemented thereon, and a negative power supply terminal electrically coupled with the semiconductor circuit via the substrate. The negative power supply terminal includes a connection tab arranged in a first plane. The module also includes a first positive power supply terminal electrically and a second positive power supply terminal that are coupled with the semiconductor circuit via the substrate. The first positive power supply terminal being laterally disposed from the negative power supply terminal, and including a connection tab arranged in the first plane. The second positive power supply terminal is laterally disposed from the negative power supply terminal and arranged in the first plane, such that the negative power supply terminal is disposed between the first positive power supply terminal and the second positive power supply terminal.