公开(公告)号：US20230167581A1

公开(公告)日：2023-06-01

申请号：US17919896

申请日：2021-07-16

Applicant: Applied Materials, Inc.

Inventor： Kartik Bhupendra SHAH ,  Schubert S. CHU ,  Adel George TANNOUS ,  Ala MORADIAN ,  Nyi Oo MYO ,  Surajit KUMAR ,  Zuoming ZHU ,  Brian Hayes BURROWS ,  Vishwas Kumar PANDEY ,  Shu-Kwan LAU ,  Srinivasa RANGAPPA

IPC: C30B25/10 ,  H01L21/687 ,  H01L21/67 ,  C30B25/18 ,  C30B25/08 ,  C23C16/02

CPC classification number: C30B25/105 ,  H01L21/68771 ,  H01L21/68764 ,  H01L21/67248 ,  H01L21/68757 ,  C30B25/186 ,  C30B25/08 ,  C23C16/0209 ,  C23C16/0227

Abstract: A process kit for use in a processing chamber includes an outer liner, an inner liner configured to be in fluid communication with a gas injection assembly and a gas exhaust assembly of a processing chamber, a first ring reflector disposed between the outer liner and the inner liner, a top plate and a bottom plate attached to an inner surface of the inner liner, the top plate and the bottom plate forming an enclosure together with the inner liner, a cassette disposed within the enclosure, the cassette comprising a plurality of shelves configured to retain a plurality of substrates thereon, and an edge temperature correcting element disposed between the inner liner and the first ring reflector.

公开(公告)号：US20210262093A1

公开(公告)日：2021-08-26

申请号：US17317418

申请日：2021-05-11

Applicant: Applied Materials, Inc.

Inventor： Kartik SHAH ,  Vishwas Kumar PANDEY ,  Kailash PRADHAN ,  Sairaju TALLAVARJULA ,  Rene GEORGE ,  Eric Kihara SHONO ,  Philip A. BOTTINI ,  Roger CURTIS

IPC: C23C16/455 ,  C23C16/44 ,  H01L21/67 ,  C23C14/56

Abstract: A gas supply member includes a first side opposite a second side and an inner surface defining a first opening extending between the first and second sides. The gas supply member includes a third side orthogonal to the first side, the third side includes a first extension that has a face partially defining the second side, and the first extension includes a first plurality of holes extending through the first extension to the face. The gas supply member includes a fourth side opposite the third side, the fourth side includes a protrusion that has a face partially defining the second side. The gas supply member also includes a baffle disposed adjacent to the inner surface, the baffle includes a first portion extending from the inner surface and a second portion attached to the first portion, and the second portion orthogonal to the first portion and parallel to the third side.

公开(公告)号：US20210074505A1

公开(公告)日：2021-03-11

申请号：US17102051

申请日：2020-11-23

Applicant: Applied Materials, Inc.

Inventor： Eric Kihara SHONO ,  Vishwas Kumar PANDEY ,  Christopher S. OLSEN ,  Hansel LO ,  Agus Sofian TJANDRA ,  Taewan KIM ,  Tobin KAUFMAN-OSBORN

IPC: H01J37/04 ,  H01L21/67 ,  H01J37/20

Abstract: In one example, a chamber inlet assembly includes a chamber inlet, an outer coupling for a delivery line, and an inner coupling for a processing region of a processing chamber. The inner coupling and the outer coupling are on inner and outer ends, respectively, of the chamber inlet, wherein a cross-sectional area of the inner coupling is larger than a cross-sectional area of the outer coupling. The chamber inlet assembly also includes a longitudinal profile including the inner and outer ends and a first side and a second side, the first and second sides being on opposite sides of the chamber inlet, wherein a shape of the longitudinal profile comprises at least one of triangular, modified triangular, trapezoidal, modified trapezoidal, rectangular, modified rectangular, rhomboidal, and modified rhomboidal. The chamber inlet assembly also includes cassette including the chamber inlet and configured to set into a side wall of the processing chamber.

公开(公告)号：US20190228951A1

公开(公告)日：2019-07-25

申请号：US16230917

申请日：2018-12-21

Applicant: Applied Materials, Inc.

Inventor： Vishwas Kumar PANDEY ,  Kartik SHAH ,  Christopher S. OLSEN ,  Agus Sofian TJANDRA ,  Hansel LO ,  Eric Kihara SHONO ,  Hemantha RAJU

IPC: H01J37/32 ,  C23C16/455

Abstract: Embodiments of the present disclosure generally relate to a processing chamber for conformal oxidation of high aspect ratio structures. The processing chamber includes a chamber body with a first side and a second side opposite the first side, and a flow assembly disposed in the first side. The flow assembly includes a flow divider to direct fluid flow away from a center of a substrate disposed in a processing region of the processing chamber. The flow divider includes a crescent shaped first side, a top, and a bottom. The processing chamber also includes a distributed pumping structure located adjacent to the second side. The flow assembly is designed to reduce flow constriction of the radicals, leading to increased radical concentration and flux.

公开(公告)号：US20250163607A1

公开(公告)日：2025-05-22

申请号：US18516728

申请日：2023-11-21

Applicant: Applied Materials, Inc.

Inventor： Justin GAU ,  Shekhar ATHANI ,  Rahul KOZHIKKALKANDI ,  Nithin ALEX ,  Adib KHAN ,  Qiwei LIANG ,  Lancelot HUANG ,  Junghoon KIM ,  Hyunjun KIM ,  Douglas A. BUCHBERGER, JR. ,  Vishwas Kumar PANDEY ,  Srinivas D. NEMANI ,  Ellie Y. YIEH ,  Dmitry LUBOMIRSKY

IPC: C30B25/08 ,  C30B25/12 ,  C30B25/14

Abstract: Disclosed herein is a processing chamber for a low temperature epitaxy deposition and components of the same. The processing chamber includes a dome lid coupled with a lid liner via a lid liner separator; a remote plasma source disposed outside the dome lid and operable to energize a process gas; a gas ring disposed under the dome lid and coupled with a gas ring liner via a gas ring liner separator; a showerhead disposed under the gas ring; a susceptor disposed below the showerhead and operable to heat a substrate by conduction; and a side wall disposed under the gas ring and coupled with a wall liner via a wall liner separator. The cleaning method of the processing chamber is also disclosed.

公开(公告)号：US20250129477A1

公开(公告)日：2025-04-24

申请号：US18916299

申请日：2024-10-15

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Vinh N. TRAN ,  Yong ZHENG ,  Vishwas Kumar PANDEY ,  Ala MORADIAN ,  Rajeev CHAVAN ,  Abraham PALATY

IPC: C23C16/455 ,  C23C16/44

Abstract: In one or more embodiments, a semiconductor processing kit includes a reflector assembly. The reflector assembly configured to support one or more sensing devices therein. The reflector assembly includes a body having a top surface and a volume at least partially defined by an inner surface and an outer surface. The reflector assembly further includes a baffle and a fluid channel disposed within the baffle. The fluid channel is configured to flow a fluid to adjust a temperature of the one or more sensing devices. A ring is disposed on the top surface. The ring is configured to reduce a flow of a fluid into the volume. A reflector is concentrically disposed radially outward of the outer surface and creates a gap that allows the fluid to partially flow between the inner surface of the reflector and the outer surface.

公开(公告)号：US20250003112A1

公开(公告)日：2025-01-02

申请号：US18634248

申请日：2024-04-12

Applicant: Applied Materials, Inc.

Inventor： Ala MORADIAN ,  Zhepeng CONG ,  Vishwas Kumar PANDEY ,  Tao SHENG ,  Nimrod SMITH ,  Karthik RAMANATHAN ,  Manjunath SUBBANNA

IPC: C30B25/16 ,  C30B25/10 ,  G01K1/02 ,  G01K3/08

Abstract: A method and apparatus for virtually sensing a temperature of a hardware component of semiconductor processing chamber are disclosed. In one or more embodiments, a method of operation for a processing chamber suitable for use in semiconductor manufacturing includes receiving a process recipe for a manufacturing process and monitoring a first temperature of a first hardware component of the processing chamber using a sensor. The method further includes synthesizing, using a model of the processing chamber, a first virtual temperature of a second hardware component of the processing chamber based on the received process recipe and the first temperature of the first hardware component.

公开(公告)号：US20240412954A1

公开(公告)日：2024-12-12

申请号：US18208736

申请日：2023-06-12

Applicant: Applied Materials, Inc.

Inventor： Dinkesh HUDERI SOMANNA ,  Dan DEYO ,  Vishwas Kumar PANDEY ,  Ala MORADIAN

IPC: H01J37/32 ,  C23C14/00 ,  C23C14/35 ,  C23C14/50 ,  C23C14/54

Abstract: Embodiments of process chambers having cooling plate are provided herein. In some embodiments, a process chamber includes: a chamber body defining an interior volume therein, the chamber body having a view port side having an opening configured as a view port, a pump side having a pump port, and a shutter side opposite the view port side, wherein the port view side, the pump side, and the shutter side are all different sides of the chamber body; a first cooling plate coupled to the view port side and having one or more first coolant channels; a second cooling plate coupled to the pump side and having one or more second coolant channels; and a third cooling plate coupled to the shutter side and having one or more third coolant channels.

公开(公告)号：US20230128611A1

公开(公告)日：2023-04-27

申请号：US17508493

申请日：2021-10-22

Applicant: Applied Materials, Inc.

Inventor： Vishwas Kumar PANDEY ,  Colin John DICKINSON ,  Dinkesh HUDERI SOMANNA ,  Ala MORADIAN ,  Kartik Bhupendra SHAH

IPC: H01J37/34 ,  H01J37/32 ,  C23C14/50 ,  C23C14/34

Abstract: An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The adapter body has a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side. At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface.

公开(公告)号：US20210322934A1

公开(公告)日：2021-10-21

申请号：US17365791

申请日：2021-07-01

Applicant: Applied Materials, Inc.

Inventor： Vishwas Kumar PANDEY ,  Lara HAWRYLCHAK ,  Eric Kihara SHONO ,  Kartik SHAH ,  Christopher S. OLSEN ,  Sairaju TALLAVARJULA ,  Kailash PRADHAN ,  Rene GEORGE ,  Johanes F. SWENBERG ,  Stephen MOFFATT

IPC: B01F3/02 ,  B01J8/22 ,  H01L21/67 ,  B01J4/00 ,  C23C16/455

Abstract: Gas injectors for providing uniform flow of fluid are provided herein. The gas injector includes a plenum body. The plenum body includes a recess, a protrusion adjacent to the recess and extending laterally away from the plenum body, and a plurality of nozzles extending laterally from an exterior surface of the plenum body. The plenum body has a plurality of holes in an exterior wall of the plenum body. Each nozzle is in fluid communication with an interior volume of the plenum body. By directing the flow of fluid, the gas injector provides for a uniform deposition.