公开(公告)号：US20070215448A1

公开(公告)日：2007-09-20

申请号：US11378340

申请日：2006-03-20

Applicant: Alok Paranjpye ,  Jeffery Summers

Inventor： Alok Paranjpye ,  Jeffery Summers

IPC: H01H1/00 ,  H01H11/00

CPC classification number: B81B3/0024 ,  B81B2201/018 ,  B81B2201/0278 ,  H01H2037/008 ,  H01H2061/008 ,  Y10T29/49105 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/53248

Abstract: A MEMS thermal switch is disclosed which couples a hot, expanding beam to a cool flexor beam using a slideably engaged tether, and bends the cool, flexor beam by the expansion of the hot beam. A rigidly engaged tether ties the distal ends of the hot, expanding beam and the cool, flexor beam together, whereas the slideably engaged tether allows the hot, expanding beam to elongate with respect to the cool, flexor beam, without loading the slideably engaged tether with a large shear force. As a result, the material of the tether can be made stiffer, and therefore transmit the bending force of the hot, expanding beam more efficiently to the cool, flexor beam.

Abstract translation: 公开了一种MEMS热开关，其使用可滑动接合的系绳将热膨胀梁耦合到冷弯头梁，并且通过热梁的膨胀来弯曲冷弯曲梁。 刚性接合的系绳将热的，扩张的梁和冷的弯曲梁的远端连接在一起，而可滑动地接合的系绳允许热的，膨胀的梁相对于冷的屈肌梁而伸长，而不加载可滑动地接合的系绳 具有很大的剪切力。 结果，系链的材料可以变得更硬，并且因此将热膨胀梁的弯曲力更有效地传递到凉爽的弯曲梁。

公开(公告)号：US06653239B2

公开(公告)日：2003-11-25

申请号：US09682894

申请日：2001-10-30

Applicant: Kyle Lebouitz

Inventor： Kyle Lebouitz

IPC: H01L21306

CPC classification number: G01J5/40 ,  B81B3/0081 ,  B81B2201/0278 ,  B81B2201/032 ,  B81B2203/0118 ,  G01J5/02 ,  G01J5/0225 ,  G01J5/023 ,  G01J5/06

Abstract: This invention relates to the construction of microfabricated devices and, in particular, to types of microfabricated devices requiring thermal isolation from the substrates upon which they are built. This invention discloses vertical thermal isolators and methods of fabricating the vertical thermal isolators. Vertical thermal isolators offer an advantage over thermal isolators of the prior art, which were substantially horizontal in nature, in that less wafer real estate is required for the use of the vertical thermal isolators, thereby allowing a greater density per unit area of the microfabricated devices.

公开(公告)号：US20020153486A1

公开(公告)日：2002-10-24

申请号：US10129338

申请日：2002-05-03

Inventor： Tohru Ishizuya ,  Junji Suzuki

IPC: G01J005/00

CPC classification number: B81B3/0081 ,  B81B2201/0278 ,  B81B2201/042 ,  B81B2203/0109 ,  G01J5/40 ,  H01L27/14812 ,  H01L27/14818 ,  H01L27/14875

Abstract: A thermal displacement element comprises a substrate, and a supported member supported on the substrate. The supported member includes first and second displacement portions, a heat separating portion exhibiting a high thermal resistance and a radiation absorbing portion receiving the radiation and converting it into heat. Each of the first and second displacement portions has at least two layers of different materials having different expansion coefficients and stacked on each other. The first displacement portion is mechanically continuous to the substrate without through the heat separating portion. The radiation absorbing portion and the second displacement portion are mechanically continuous to the substrate through the heat separating portion and the first displacement portion. The second displacement portion is thermally connected to the radiation absorbing portion. A radiation detecting device comprises a thermal displacement element and a displacement reading member fixed to the second displacement portion of the thermal displacement element and used for obtaining a predetermined change corresponding to a displacement in the second displacement portion.

Abstract translation: 热位移元件包括衬底和支撑在衬底上的支撑构件。 被支撑构件包括第一和第二位移部分，表现出高热阻的热分离部分和接收辐射并将其转换成热量的辐射吸收部分。 第一和第二位移部分中的每一个具有至少两层具有不同膨胀系数并且彼此堆叠的不同材料。 第一位移部分在不通过热分离部分的情况下机械地连接到基板。 辐射吸收部分和第二位移部分通过热分离部分和第一位移部分机械地连接到基底。 第二位移部分热连接到辐射吸收部分。 放射线检测装置包括热位移元件和固定到热位移元件的第二位移部分的位移读取构件，用于获得与第二位移部分中的位移相对应的预定变化。

公开(公告)号：US5830372A

公开(公告)日：1998-11-03

申请号：US732885

申请日：1996-10-17

Applicant: Christofer Hierold

Inventor： Christofer Hierold

IPC: H01L27/04 ,  B81B3/00 ,  B81C1/00 ,  G01F1/684 ,  G01F1/688 ,  G01K7/01 ,  G01P15/08 ,  H01L21/822 ,  H01L27/16 ,  H01L49/00 ,  H01L21/302

CPC classification number: H01L27/16 ,  B81B3/0081 ,  B81C1/00246 ,  B81C1/0069 ,  G01F1/6845 ,  G01F1/6888 ,  G01K7/015 ,  G01P15/0802 ,  B81B2201/0278 ,  B81B2203/0315 ,  B81C2201/053 ,  B81C2203/0136 ,  B81C2203/0735

Abstract: Semiconductor component with monolithically integrated electronic circuits and monolithically integrated sensor/actuator, whereby the sensor/actuator is manufactured with methods of surface micromachining in a sensor layer (3) of polysilicon that is structured, for example, with sensor webs (6), and these sensor webs (6) are thermally insulated from a silicon substrate (1) by a cavity (4) that is produced in a sacrificial layer (2) and is closed gas-tight toward the outside with a closure layer (5).

Abstract translation: 具有单片集成电子电路和单片集成传感器/致动器的半导体部件，由此传感器/致动器由例如由传感器网（6）构成的多晶硅传感器层（3）中的表面微加工的方法制造，以及 这些传感器网（6）通过在牺牲层（2）中制造的空腔（4）与硅衬底（1）热绝缘，并且用封闭层（5）朝向外部气密地封闭。

公开(公告)号：US20240327201A1

公开(公告)日：2024-10-03

申请号：US18192576

申请日：2023-03-29

Applicant: Intel Corporation

Inventor： Numair Ahmed ,  Mohammad Mamunur Rahman ,  Suddhasattwa Nad ,  Sashi Kandanur ,  Darko Grujicic ,  Benjamin Duong ,  Srinivas Pietambaram ,  Tarek Ibrahim ,  Whitney Bryks

IPC: B81B7/00 ,  B81C1/00 ,  G02B6/12

CPC classification number: B81B7/0048 ,  B81C1/00325 ,  G02B6/12004 ,  B81B2201/0228 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0278 ,  B81B2201/03 ,  B81B2201/045 ,  B81B2207/07 ,  B81B2207/096 ,  B81B2207/097

Abstract: MEMS dies embedded in glass cores of integrated circuit (IC) package substrates are disclosed. An example integrated circuit (IC) package includes a package substrate including a glass core, the example integrated circuit (IC) package also includes a micro electromechanical system (MEMS) die positioned in a cavity of the glass core.

公开(公告)号：US20240272004A1

公开(公告)日：2024-08-15

申请号：US18108154

申请日：2023-02-10

Applicant: STMicroelectronics International N.V.

Inventor： Enri DUQI ,  Giorgio ALLEGATO

IPC: G01J5/10 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01J5/10 ,  B81B7/0038 ,  B81B7/007 ,  B81C1/00285 ,  B81C1/00301 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/097 ,  B81C2203/0109 ,  B81C2203/0792 ,  G01J2005/106

Abstract: Disclosed herein is a method of forming a thermal sensor, including patterning an active layer on a first face of a handle substrate to form a frame, a mass carrying at least one thermally isolated MOS (TMOS) transistor, and a spring structure connecting the mass to the frame while thermally isolating the mass from the frame. The frame is then bonded to pads on a first face of an integrated circuit substrate. The handle substrate is removed, and a top cap is bonded to the first face of the integrated circuit substrate to enclose at least the mass and spring within the sealed cavity.

公开(公告)号：US20230251621A1

公开(公告)日：2023-08-10

申请号：US18301002

申请日：2023-04-14

Applicant: STMicroelectronics S.r.l.

Inventor： Luca FONTANELLA ,  Andrea LABOMBARDA ,  Marco BIANCO ,  Davide GHEZZI ,  Christian RAINERI ,  Paolo GATTI

IPC: G05B19/406 ,  G05B23/02

CPC classification number: G05B19/406 ,  G05B23/0218 ,  B81B2201/02 ,  B81B2201/0228 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/01 ,  G05B2219/34351

Abstract: A system for detecting and evaluating environmental quantities and events is formed by a detection and evaluation device and a mobile phone, connected through a wireless connection. The device is enclosed in a containment casing housing a support carrying a plurality of inertial sensors and environmental sensors. A processing unit is coupled to the inertial sensors and to the environmental sensors. A wireless connection unit, is coupled to the processing unit and a wired connection port, is coupled to the processing unit. A programming connector is coupled to the processing unit and is configured to couple to an external programming unit to receive programming instructions of the processing unit. A storage structure is coupled to the processing unit and a power-supply unit supplied power in the detection and evaluation device. The mobile phone stores an application, which enables a basicuse mode, an expert use mode, and an advanced use mode.

公开(公告)号：US20230213389A1

公开(公告)日：2023-07-06

申请号：US17996125

申请日：2021-04-14

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Geoffroy DUMONT ,  Jean-Jacques YON

IPC: G01J5/04 ,  G01J5/10 ,  G01J5/02 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01J5/045 ,  G01J5/10 ,  G01J5/046 ,  G01J5/0225 ,  B81B7/0051 ,  B81C1/00325 ,  G01J2005/106 ,  B81B2201/0278 ,  B81B2203/0127 ,  B81C2201/0109 ,  B81C2201/0133

Abstract: The invention relates to a method for fabricating a detection device, comprising the following steps: producing thermal detectors and an encapsulating structure by way of mineral sacrificial layers; partially removing the mineral sacrificial layers, by wet chemical etching in an acid medium, so as to free the thermal detectors and to obtain a peripheral wall, and to free an upper portion of the encapsulating thin layer; the peripheral wall then having a lateral recess resulting in a vertical enlargement of the cavity, between the readout substrate and the upper portion, this lateral recess defining an intermediate area; producing reinforcing pillars, arranged in the intermediate area around the matrix-array of thermal detectors.

公开(公告)号：US11686637B2

公开(公告)日：2023-06-27

申请号：US17583392

申请日：2022-01-25

Applicant: XI'AN JIAOTONG UNIVERSITY

Inventor： Xudong Fang ,  Ziyan Fang ,  Chen Wu ,  Hao Sun ,  Libo Zhao ,  Bian Tian ,  Zhuangde Jiang ,  Wubin Deng ,  Bonan Gao ,  Junxia Wu ,  Songli Wang ,  Nan Zhu

IPC: G01L9/00 ,  B81B7/02

CPC classification number: G01L9/005 ,  B81B7/02 ,  G01L9/0054 ,  B81B2201/0264 ,  B81B2201/0278

Abstract: A silicon carbide-based micro-electro-mechanical system (MEMS) combined temperature-pressure sensor chip and a preparation thereof. The chip includes a peripheric pressure-measuring unit and a center temperature-measuring unit. The pressure-measuring unit includes a silicon carbide substrate with a raised island and a pressure sensitive diaphragm formed by etching the back of the substrate. The raised island and the pressure-sensitive diaphragm constitute a membrane-island structure. Four piezoresistive strips are arranged symmetrically along a circumferential direction of a root of the pressure-sensitive diaphragm and between the raised island and the pressure-sensitive diaphragm. The temperature-measuring unit includes the raised island and a thin-film thermocouple arranged thereon.

公开(公告)号：US20190194013A1

公开(公告)日：2019-06-27

申请号：US16312324

申请日：2017-06-09

Applicant: Knowles Electronics, LLC

Inventor： Venkataraman Chandrasekaran ,  John Szczech ,  Josh Watson ,  Claus Furst

IPC: B81B7/00 ,  H04R19/04 ,  H04R1/04

CPC classification number: B81B7/0061 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0278 ,  B81B2207/012 ,  H04R1/04 ,  H04R19/04 ,  H04R2201/003

Abstract: Systems and apparatuses for a microelectromechanical system (MEMS) device. The MEMS device includes a housing, a transducer, and a sensor. The housing includes a substrate defining a port and a cover. The substrate and the cover cooperatively form an internal cavity. The port fluidly couples the internal cavity to an external environment. The transducer is disposed within the internal cavity and positioned to receive acoustic energy through the port. The transducer is configured to convert the acoustic energy into an electrical signal. The sensor is disposed within the internal cavity and positioned to receive a gas through the port. The sensor is configured to facilitate detecting at least one of an offensive odor, smoke, a volatile organic compound, carbon monoxide, carbon dioxide, a nitrogen oxide, methane, and ozone.