公开(公告)号：US20140160704A1

公开(公告)日：2014-06-12

申请号：US14179811

申请日：2014-02-13

Applicant: SMA Solar Technology AG

Inventor： Eberhard Janssen ,  Volker Marschang ,  Burkhard Roecher

IPC: H05K7/14 ,  H01G2/10

CPC classification number: H05K7/1417 ,  H01G2/06 ,  H01G2/106 ,  H01G2/14 ,  H02M7/003 ,  H05K1/0201 ,  H05K1/0215 ,  H05K1/0231 ,  H05K1/0254 ,  H05K1/0268 ,  H05K3/222 ,  H05K3/301 ,  H05K3/325 ,  H05K7/14 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/10454 ,  H05K2201/10492 ,  Y10T29/49004

Abstract: An electronic device includes a housing, a circuit board, a plurality of holders having mechanical connectors to the housing and to the circuit board and mechanically fixing the circuit board within the housing, and at least one capacitor having a first electrode, a second electrode and a dielectric arranged between the first and second electrodes. The first electrode is electrically connected to a contact on the circuit board, and the second electrode is electrically connected to the housing. The at least one capacitor is part of one of the plurality of holders; and the dielectric of the capacitor is part of a thermal insulation between the connectors to the circuit board and to the housing.

Abstract translation: 电子设备包括壳体，电路板，多个保持器，其具有到外壳和电路板的机械连接器，并将电路板机械地固定在壳体内;以及至少一个电容器，其具有第一电极，第二电极和 布置在第一和第二电极之间的电介质。 第一电极电连接到电路板上的触点，并且第二电极电连接到壳体。 所述至少一个电容器是所述多个保持器之一的一部分; 并且电容器的电介质是到电路板的连接器和壳体之间的绝热的一部分。

公开(公告)号：US08598466B2

公开(公告)日：2013-12-03

申请号：US13016744

申请日：2011-01-28

Applicant: Brian S. Mantel ,  David T. Engquist

Inventor： Brian S. Mantel ,  David T. Engquist

IPC: H01K3/10 ,  H05K1/03

CPC classification number: H05K1/0222 ,  G01R1/07378 ,  H05K3/4046 ,  H05K2201/09809 ,  H05K2201/10242 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49165

Abstract: A shielded signal pass-through or via structure integral with an electronic circuit board is described. The structure includes a rigid inner generally cylindrical conductor; at least a semi-rigid intermediate annular dielectric surrounding the conductor; and a rigid outer annular conductor surrounding the dielectric material. Also described is an interconnect device that presents a contact array in a boss region of a unitary embossed printed circuit board (PCB) optionally equipped with one or more such shielded vias.

Abstract translation: 描述了与电子电路板集成的屏蔽信号通过或通孔结构。 该结构包括刚性内部大致圆柱形导体; 至少围绕导体的半刚性中间环形电介质; 以及围绕电介质材料的刚性外环形导体。 还描述了一种互连装置，其在可选地配备有一个或多个这样的屏蔽通孔的单一压纹印刷电路板（PCB）的凸起区域中呈现接触阵列。

公开(公告)号：US20120307466A1

公开(公告)日：2012-12-06

申请号：US13585920

申请日：2012-08-15

Applicant: Masanori FUJIDAI ,  Isamu FUJIMOTO

Inventor： Masanori FUJIDAI ,  Isamu FUJIMOTO

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/186 ,  H05K3/4046 ,  H05K2201/09509 ,  H05K2201/10242 ,  H05K2201/10416 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors.

Abstract translation: 在部件嵌入式基板中，将部件和接线块单元嵌入在部件嵌入层中; 导电层位于布线块单元的所有表面上; 所述部件和所述布线块单元布置成使得所述布线块单元的下表面侧导电层和所述元件的电极接触下表面侧布线层; 通孔导体相对于布线块单元的上表面侧导电层和部件的电极位于相应的上部位置; 因此，元件嵌入层的上表面侧配线层与布线块单元的上表面侧导电层电连接，通过通孔导体电连接。

公开(公告)号：US08165645B2

公开(公告)日：2012-04-24

申请号：US12332244

申请日：2008-12-10

Applicant: Byung Hwa Lee ,  Yong Won Yu ,  Hyun Sam Mun ,  Young Suk Kim

Inventor： Byung Hwa Lee ,  Yong Won Yu ,  Hyun Sam Mun ,  Young Suk Kim

IPC: H04M1/00

CPC classification number: H01Q1/243 ,  H05K1/0284 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/0999 ,  H05K2201/10242

Abstract: There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.

Abstract translation: 提供了一种移动通信终端壳体，包括：具有第一表面和与第一表面相对的第二表面的移动通信终端的壳体，以及穿过第一表面和第二表面形成的通孔; 设置在壳体的第一表面上的导电图案; 载体膜，设置在所述壳体的所述第一表面上以覆盖所述导电图案; 和导电环氧树脂填充通孔并且其一端与导电图案接触。

公开(公告)号：US08164192B2

公开(公告)日：2012-04-24

申请号：US12984707

申请日：2011-01-05

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H01L25/488

CPC classification number: H01L21/6835 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10734 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.

Abstract translation: 一种电气结构和形成方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构和第一焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 非焊接金属芯结构的第二部分被热压接合到第二导电焊盘。

公开(公告)号：US20110048786A1

公开(公告)日：2011-03-03

申请号：US12870137

申请日：2010-08-27

Applicant: Suk Hyeon Cho ,  Jin Yong Ahn ,  Soon Oh Jung ,  Dong Ju Jeon ,  Ki Hwan Kim ,  Byung Moon Kim

Inventor： Suk Hyeon Cho ,  Jin Yong Ahn ,  Soon Oh Jung ,  Dong Ju Jeon ,  Ki Hwan Kim ,  Byung Moon Kim

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/4015 ,  H05K3/007 ,  H05K3/20 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10242 ,  H05K2203/0338 ,  Y10T29/49155

Abstract: Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.

Abstract translation: 这里公开了具有凹凸的印刷电路板及其制造方法。 具有凸块的印刷电路板包括绝缘层，内部电路层被浸渍到该绝缘层中; 形成在所述绝缘层之下并具有暴露所述内部电路层的焊盘单元的开口的保护层; 以及与所述垫单元一体形成并从所述保护层的内侧通过所述开口突出到所述保护层的外侧的凸块。 凸块与焊盘单元一体地形成，从而提高凸块和印刷电路板之间的接合强度，并且凸块的表面积形成为宽，从而提高焊球和印刷电路板之间的接合强度。

公开(公告)号：US07868457B2

公开(公告)日：2011-01-11

申请号：US11855290

申请日：2007-09-14

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H01L23/488

CPC classification number: H01L21/6835 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10734 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.

Abstract translation: 一种电气结构和形成方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构和第一焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 非焊接金属芯结构的第二部分被热压接合到第二导电焊盘。

公开(公告)号：US20100089612A1

公开(公告)日：2010-04-15

申请号：US12285815

申请日：2008-10-15

Applicant: Shih-Ping Hsu

Inventor： Shih-Ping Hsu

IPC: H01B5/00

CPC classification number: H01L23/49816 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/4015 ,  H05K2201/10242 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical connection element of packaging substrate is disclosed. Wherein a plurality of conductive pads and a solder mask are formed on the surface of the packaging substrate, and a plurality of openings is formed in the solder mask to expose the conductive pads covered there beneath. The electrical connection element formed on the conductive pad comprises a core layer, a first covering layer and a second covering layer. The first covering layer covers the core layer, and the density of the first covering layer is higher than the density of the core layer. The second covering layer covers the first covering layer.

Abstract translation: 公开了一种封装基板的电连接元件。 其中在封装基板的表面上形成多个导电焊盘和焊接掩模，并且在焊接掩模中形成多个开口以露出其下面覆盖的导电焊盘。 形成在导电焊盘上的电连接元件包括芯层，第一覆盖层和第二覆盖层。 第一覆盖层覆盖芯层，第一覆盖层的密度高于芯层的密度。 第二覆盖层覆盖第一覆盖层。

公开(公告)号：US20090120677A1

公开(公告)日：2009-05-14

申请号：US12205453

申请日：2008-09-05

Applicant: Toshihiro NOMURA ,  Hiroshi SEGAWA ,  Yoshifumi MIYAZAWA ,  Katsuya OKUMURA

Inventor： Toshihiro NOMURA ,  Hiroshi SEGAWA ,  Yoshifumi MIYAZAWA ,  Katsuya OKUMURA

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/4046 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/033 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A wiring substrate for mounting electronic parts and a method for manufacturing the same are provided. The wiring substrate includes a substrate that includes a first surface, a second surface and a plurality of through-holes that extend through the substrate from the first surface to the second surface so as to define a plurality of inner walls respectively. The wiring substrate further includes an external conductor that is formed on at least one of the first surface or the second surface of the substrate. A through-hole conductor is formed on one of the plurality of inner walls so as to define a through-hole conductor space and so as to be electrically connected to the external conductor. Also included is a conductive post with first and second post ends, the first post end being positioned in the through-hole conductor space such that the first post end is in contact with and is electrically connected to the through-hole conductor, and the second post end projects out of the conductor space.

Abstract translation: 提供了一种用于安装电子部件的布线基板及其制造方法。 布线基板包括基板，其包括第一表面，第二表面和多个通孔，所述多个通孔分别从第一表面延伸到第二表面以限定多个内壁。 布线基板还包括形成在基板的第一表面或第二表面中的至少一个上的外部导体。 在多个内壁之一上形成通孔导体，以便限定通孔导体空间，并与外部导体电连接。 还包括具有第一和第二端部的导电柱，所述第一柱端位于所述通孔导体空间中，使得所述第一柱端与所述通孔导体接触并与所述通孔导体电连接，并且所述第二端 后端项目脱离导体空间。

公开(公告)号：US20090051004A1

公开(公告)日：2009-02-26

申请号：US11844672

申请日：2007-08-24

Applicant: Weston C. Roth ,  James D. Jackson ,  Damion Searls ,  Kevin Byrd

Inventor： Weston C. Roth ,  James D. Jackson ,  Damion Searls ,  Kevin Byrd

IPC: H01L29/00 ,  H01L21/00 ,  H01L23/48

CPC classification number: H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/145 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A microelectronic package and a method of forming the package. The package includes a first level package mounted to a carrier. The first level package includes a package substrate having a die side and a carrier side; and a microelectronic die mounted on the package substrate at the die side thereof. The carrier has a substrate side, and the first level package is mounted on the carrier at the substrate side thereof. A rigid body is attached to the carrier side of the substrate at an attachment location of the substrate and to the substrate side of the carrier at an attachment location of the carrier, the attachment location of the carrier being electrically unconnected, the rigid body being configured and disposed to provide structural support between the substrate and the carrier.

Abstract translation: 微电子封装和形成封装的方法。 该包装包括安装在载体上的第一级封装。 第一级封装包括具有裸片侧和载体侧的封装基板; 以及在其芯片侧安装在封装基板上的微电子管芯。 载体具有基板侧，并且第一级封装在其基板侧安装在载体上。 刚性体在基板的安装位置和载体的安装位置处附着到基板的载体侧，载体的附接位置电连接，刚体被构造成 并设置成在基板和载体之间提供结构支撑。