公开(公告)号：US09516750B2

公开(公告)日：2016-12-06

申请号：US14363541

申请日：2012-11-20

Applicant: Robert Bosch GmbH

Inventor： Uwe Liskow

IPC: F16H61/02 ,  H05K1/11 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/11 ,  F16H61/0251 ,  H05K1/021 ,  H05K1/0296 ,  H05K1/112 ,  H05K1/181 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/10424 ,  H05K2201/2018 ,  Y02P70/613

Abstract: A control unit for a motor vehicle has an electrical SMD (surface mounted device) component having at least one corresponding connection pin and a circuit board. The circuit board has at least one soldering surface. The soldering surface is permanently connected to the circuit board. The soldering surface and the connection pin are connectable to each other in an electrically conductive and firmly bonded manner by a soldering process. According to the disclosure, a contact hold-down piece is permanently connected to the circuit board. The connection pin is positioned in such a manner by the contact hold-down piece that, when the connection pin is connected to the soldering surface in an integrally bonded manner, the connection pin and the circuit board have a predetermined distance from each other.

Abstract translation: 用于机动车辆的控制单元具有至少一个对应的连接销和电路板的电子SMD（表面安装装置）部件。 电路板具有至少一个焊接表面。 焊接表面永久连接到电路板。 焊接表面和连接销可以通过焊接工艺以导电和牢固结合的方式彼此连接。 根据本公开，触点压紧件永久地连接到电路板。 连接销以这样的方式被接触压紧件定位，当连接销以整体连接的方式连接到焊接表面时，连接销和电路板彼此具有预定的距离。

公开(公告)号：US20160329903A1

公开(公告)日：2016-11-10

申请号：US15109857

申请日：2015-01-26

Applicant: Kazuhiko ADACHI ,  Kazuhiro HARASAKA ,  Akihiro ITOH

Inventor： Kazuhiko ADACHI ,  Kazuhiro HARASAKA ,  Akihiro ITOH

IPC: H03L7/26 ,  H01S5/00 ,  H01S5/183 ,  H01S5/024 ,  H05K1/02 ,  H05K1/11

CPC classification number: H03L7/26 ,  G04F5/14 ,  H01L23/345 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02453 ,  H01S5/183 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/10075 ,  H05K2201/10174 ,  H05K2201/2018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An atomic oscillator includes a gas cell and a plurality of components. The plurality of components includes a temperature control device for the gas cell; an excitation light source that emits excitation light to excite atoms enclosed in the gas cell; a temperature control device for the excitation light source; and a light receiving element that detects the excitation light that passes through the gas cell. The plurality of components is mounted on an insulating film having wiring.

Abstract translation: 原子振荡器包括气室和多个部件。 多个部件包括用于气室的温度控制装置; 激发光源，其发射激发光以激发包围在气室中的原子; 用于激发光源的温度控制装置; 以及检测通过气室的激发光的受光元件。 多个部件安装在具有布线的绝缘膜上。

公开(公告)号：US20160305642A1

公开(公告)日：2016-10-20

申请号：US14706056

申请日：2015-05-07

Applicant: TRUE STAR, INC.

Inventor： Wone-Hee CHOI

IPC: F21V29/70 ,  F21K99/00

CPC classification number: F21V29/70 ,  F21V29/503 ,  F21V29/89 ,  F21Y2105/16 ,  H01L33/486 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/0097 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/10106 ,  H05K2201/2018

Abstract: Disclosed is a flexible liquid emitting diode (LED) module. The flexible LED module is improved for the dissipation characteristics of heat generated in a LED chip, and in addition, is separable to cut and use the desired LED chips according to output power of a lamp by arranging the LED chips in series or in parallel. In addition, the flexible LED module is applicable to various types of lamps because the flexible LED module is flexibly used according to the structures of the lamps.

Abstract translation: 公开了一种柔性液体发光二极管（LED）模块。 针对LED芯片产生的热耗散特性，灵活的LED模块得到改​​进，并且通过串联或并联布置LED芯片，可以根据灯的输出功率切割和使用期望的LED芯片。 另外，柔性LED模块可应用于各种类型的灯，因为柔性LED模块根据灯的结构灵活使用。

公开(公告)号：US09462694B2

公开(公告)日：2016-10-04

申请号：US14561768

申请日：2014-12-05

Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.

Inventor： Junrong Yan ,  Weili Wang ,  Li Wang ,  Pradeep Rai ,  Xin Lu ,  Jianbin Gu ,  Peng Lu

IPC: G11C16/02 ,  H05K1/18 ,  H01L25/065

CPC classification number: H05K1/181 ,  H01L25/065 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/181 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/2018 ,  Y02P70/611 ,  Y10T428/24273 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.

Abstract translation: 公开了一种半导体器件及其制造方法。 半导体器件包括安装在基板的表面上的诸如控制器管芯的半导体管芯。 间隔层也安装到基底上，其中半导体管芯配合在通过间隔层的第一和第二主要相对表面形成的孔或凹口内。 另外的半导体管芯，例如闪速存储器管芯，可以安装在间隔层顶上。

公开(公告)号：US20160174377A1

公开(公告)日：2016-06-16

申请号：US14571369

申请日：2014-12-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： SENG HUAN CHUAH ,  FRIEDRICH JOSEF BOLLMANN ,  KHAI JIN CHOO ,  WENG KONG HOR ,  SIH HAU TAN

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/0224 ,  H05K1/14 ,  H05K5/064 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

Abstract translation: 用于本质安全的便携式设备的方法和电路板装置包括两个或更多个具有围绕电路板之间的空间形成连续边界的框架结构的电路板。 在这个空间中，有两个电路板上安装的电路元件和连接两个电路板的连接器。 密封剂材料填充由电路板之间的框架结构限定的空间，以排除空气传播材料与封装的电路部件接触。

公开(公告)号：US20160106002A1

公开(公告)日：2016-04-14

申请号：US14787057

申请日：2013-08-19

Applicant: ZTE CORPORATION

Inventor： Fangxi Hou

IPC: H05K7/20

CPC classification number: H05K7/20436 ,  H05K1/0203 ,  H05K2201/2018

Abstract: The disclosure provides an internal heat-dissipation terminal, wherein the terminal comprises at least one cavity in which heat-storage material is arranged. The cavity is located in an area without a device in the terminal. The technical solution of the disclosure can be applied to substantially enhance the heat storage capability of the terminal.

Abstract translation: 本公开内容提供了一种内部散热端子，其中端子包括至少一个空腔，其中布置有蓄热材料。 空腔位于终端中没有设备的区域。 本公开的技术方案可以用于大大增强终端的蓄热能力。

公开(公告)号：US09282642B2

公开(公告)日：2016-03-08

申请号：US14040358

申请日：2013-09-27

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Keizou Sakurai

IPC: H01L23/12 ,  H01L23/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/46 ,  H01L23/538

CPC classification number: H05K1/186 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/1461 ,  H05K3/3452 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/0588 ,  H05K2203/061 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A wiring board includes a base wiring board 10 and a frame wiring board 20. The base wiring board 10 has an element mounting portion 1a and a frame-shaped frame joining portion 1b on the upper surface and a solder resist layer 4 deposited in a portion between the element mounting portion 1a and the frame joining portion 1b. In the wiring board 10, a first joining pad 6 provided in the frame joining portion 1b and a second joining pad 16 provided in a lower surface of the frame wiring board 20 are joined together via a solder bump H so that a gap may be formed between the frame joining portion 1b and the frame wiring board 20. The base wiring board 10 has a resin injection hole 8 penetrating through the base wiring board 10 in the frame joining portion 1b, and the gap is filled with a sealing resin 18.

Abstract translation: 布线基板包括基底布线板10和框架布线板20.基布线板10具有在上表面上的元件安装部分1a和框架形框架接合部分1b以及沉积在部分上的阻焊层4 在元件安装部分1a和框架接合部分1b之间。 在布线板10中，设置在框架接合部分1b中的第一接合焊盘6和设置在框架接线板20的下表面中的第二接合焊盘16通过焊料凸块H接合在一起，从而可以形成间隙 框架接合部分1b和框架接线板20之间。底部布线板10具有穿过框架接合部分1b中的基底布线板10的树脂注入孔8，并且间隙填充有密封树脂18。

公开(公告)号：US20160044787A1

公开(公告)日：2016-02-11

申请号：US14818048

申请日：2015-08-04

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Kazushige AKITA

IPC: H05K1/11

CPC classification number: H05K1/113 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49827 ,  H05K2201/09563 ,  H05K2201/2018

Abstract: A wiring substrate includes an insulating substrate having a quadrangular planar outline; a quadrangular frame positioned on the surface of the insulating substrate along the periphery, and including an upper surface, a corner portion, and an adjacent portion, the corner portion including a width-expanded portion defining a via hole extending through the frame, the width-expanded portion including an inner wall surface having a rectilinear edge in a plan view, the adjacent portion including an inner wall surface, the inner wall surface of the width-expanded portion forming an obtuse angle with the inner wall surface of the adjacent portion; a via conductor filling the via hole and not exposed from the inner wall surface of the width-expanded portion; and a sealing metallization layer formed on the upper surface of the frame and electrically connected to the via conductor.

Abstract translation: 布线基板包括具有四边形平面轮廓的绝缘基板; 所述四边形框架沿着所述周边定位在所述绝缘基板的表面上，并且包括上表面，角部和相邻部分，所述角部包括限定穿过所述框架的通孔的宽度扩展部，所述宽度 其包括在俯视图中具有直线边缘的内壁面，相邻部分包括内壁面，宽度扩大部分的内壁面与相邻部分的内壁面形成钝角; 通孔导体，其填充所述通孔并且不从所述宽度扩展部的内壁表面露出; 以及形成在框架的上表面上并且电连接到通孔导体的密封金属化层。

公开(公告)号：US20150292716A1

公开(公告)日：2015-10-15

申请号：US14681444

申请日：2015-04-08

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Daiki Nakamura ,  Hisao Ikeda

IPC: F21V17/06 ,  H05K1/18 ,  F21V17/02 ,  F21V1/08 ,  F21V23/06

CPC classification number: H01L51/0097 ,  F21Y2103/00 ,  F21Y2115/20 ,  H01L2251/5338 ,  H01L2251/5361 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/2018 ,  Y02E10/549 ,  Y02P70/521

Abstract: A novel light-emitting device that is highly convenient or reliable is provided. The light-emitting device includes a framework, a flexible first light-emitting panel supported by the framework so as to form a first developable surface, and a flexible second light-emitting panel supported by the framework so as to form a second developable surface.

Abstract translation: 提供了一种非常方便或可靠的新型发光装置。 发光装置包括框架，由框架支撑以形成第一可显影表面的柔性第一发光面板和由框架支撑以形成第二可显影表面的柔性第二发光面板。

公开(公告)号：US20150264805A1

公开(公告)日：2015-09-17

申请号：US14656387

申请日：2015-03-12

Applicant: InnoLux Corporation

Inventor： Hung-Kun CHEN ,  Po-Hung SHEN ,  Hui- Min HUANG ,  Shih-Hsiung WU ,  Jui-Chu LAI ,  Huan-Kuang PENG ,  Hong-Kang CHANG ,  Yu-Chien KAO ,  Li-Wei SUNG

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K3/0052 ,  G02F1/133351 ,  G02F1/1339 ,  G02F1/13394 ,  G02F2001/133388 ,  H01L51/5246 ,  H01L51/525 ,  H05K1/144 ,  H05K2201/09154 ,  H05K2201/10128 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y10T428/24355

Abstract: The disclosure provides a display device including a first substrate, a display region disposed above the first substrate; a second substrate; a sealant disposed between the first substrate and the second substrate and outside the display region; and, a plurality of spacers disposed within the sealant. In particular, the first substrate and the second substrate are bonded together via the sealant. Further, the first substrate has a side wall including a first cutting crack surface and a first median crack surface, wherein a roughness of the first cutting crack surface is different from that of the first median crack surface.

Abstract translation: 本发明提供了一种显示装置，包括第一基板，设置在第一基板上方的显示区域; 第二基板; 密封剂，设置在所述第一基板和所述第二基板之间并且在所述显示区域的外部; 以及设置在密封剂内的多个间隔物。 特别地，第一基板和第二基板经由密封剂粘结在一起。 此外，第一基板具有包括第一切削裂纹表面和第一中间裂纹表面的侧壁，其中第一切削裂纹表面的粗糙度与第一中间裂纹表面的粗糙度不同。