公开(公告)号：US07955089B2

公开(公告)日：2011-06-07

申请号：US12793359

申请日：2010-06-03

Applicant: Chih-Cheng Chen

Inventor： Chih-Cheng Chen

IPC: H01R12/00

CPC classification number: H01R12/62 ,  H01R12/58 ,  H01R12/65 ,  H05K1/118 ,  H05K3/0058 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/10303 ,  H05K2201/1059

Abstract: A three-dimensional connector, which is used by a coordinate input device of a touch pad has a flat conductor cable with an end being connected to the touch pad and another end having multiple conductive lines. Each of the conductive lines is attached with a vertical guiding conductor pin. The guide conductor pin has a head section to press-fit with the flat conductor cable, and extends through a support to transmit electronic signals in a direction perpendicular to said flat conductor cable.

Abstract translation: 由触摸板的坐标输入装置使用的三维连接器具有扁平导体电缆，其端部连接到触摸板，另一端具有多条导线。 每个导线与一个垂直的引导导体引脚相连。 引导导体销具有头部部分以与扁平导体电缆压配合，并且延伸穿过支撑件以沿垂直于所述扁平导体电缆的方向传输电子信号。

公开(公告)号：US20110120756A1

公开(公告)日：2011-05-26

申请号：US13006122

申请日：2011-01-13

Applicant: Tsugio AMBO ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

Inventor： Tsugio AMBO ,  Satoru Fujiwara ,  Yoshikatsu Hasegawa ,  Chihiro Nakagawa ,  Takeshi Ono ,  Atsushi Urushidani ,  Tooru Kashioka ,  Katsuji Shimazawa

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K3/202 ,  H01R9/2466 ,  H01R12/523 ,  H05K3/041 ,  H05K3/222 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/4611 ,  H05K13/0061 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T428/24917

Abstract: A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.

公开(公告)号：US20110107596A1

公开(公告)日：2011-05-12

申请号：US13008832

申请日：2011-01-18

Applicant: Min-Chieh Chou ,  Tung-Chuan Wu ,  Jen-Hui Tsai ,  Hung-Yi Lin

Inventor： Min-Chieh Chou ,  Tung-Chuan Wu ,  Jen-Hui Tsai ,  Hung-Yi Lin

IPC: H05K3/10

CPC classification number: G01R1/06755 ,  G01R1/06733 ,  G01R3/00 ,  H05K1/028 ,  H05K1/118 ,  H05K3/46 ,  H05K2201/0397 ,  H05K2201/051 ,  H05K2201/055 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.

公开(公告)号：US07877872B2

公开(公告)日：2011-02-01

申请号：US11967004

申请日：2007-12-29

Applicant: Hsiao-Chun Huang ,  Meng-Hung Wu ,  Cheng-Hsien Lin

Inventor： Hsiao-Chun Huang ,  Meng-Hung Wu ,  Cheng-Hsien Lin

IPC: H01K3/10

CPC classification number: H05K3/4092 ,  H05K3/061 ,  H05K3/281 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening.

Abstract translation: 一种中空印刷电路板的制造方法，包括以下步骤：提供导电层; 层压具有限定在其中的第一通孔的第一电介质层在导电层的第一表面上; 在第一开口中的导电层的第一表面上形成保护层; 在导电层中形成导电图案; 去除保护层; 并且以使得所述第一通孔与所述第二通孔对准的方式层压具有限定在其中的第二通孔的第二介电层，所述第二介电层在所述导电层的相对的第二表面上，从而一部分所述导电层暴露于 外部通过第一通孔和第二通孔。

公开(公告)号：US20100240247A1

公开(公告)日：2010-09-23

申请号：US12793359

申请日：2010-06-03

Applicant: Chih-Cheng CHEN

Inventor： Chih-Cheng CHEN

IPC: H01R12/24

CPC classification number: H01R12/62 ,  H01R12/58 ,  H01R12/65 ,  H05K1/118 ,  H05K3/0058 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/10303 ,  H05K2201/1059

Abstract: A three-dimensional connector, which is used by a coordinate input device of a touch pad has a flat conductor cable with an end being connected to the touch pad and another end having multiple conductive lines. Each of the conductive lines is attached with a vertical guiding conductor pin. The guide conductor pin has a head section to press-fit with the flat conductor cable, and extends through a support to transmit electronic signals in a direction perpendicular to said flat conductor cable.

Abstract translation: 由触摸板的坐标输入装置使用的三维连接器具有扁平导体电缆，其端部连接到触摸板，另一端具有多条导线。 每个导线与一个垂直的引导导体引脚相连。 引导导体销具有头部部分以与扁平导体电缆压配合，并且延伸穿过支撑件以沿垂直于所述扁平导体电缆的方向传输电子信号。

公开(公告)号：US07773388B2

公开(公告)日：2010-08-10

申请号：US11566912

申请日：2006-12-05

Applicant: Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

Inventor： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC: H01R9/00

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/28 ,  H05K3/341 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0397 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semiconductor apparatus is mounted thereon and an electronic device using the same. An electronic device (4) according to the present invention includes a printed wiring board (1) with a component mounting pin (18) and a surface-mounting type semiconductor apparatus (2) with an electrode pad (3), wherein the component mounting pin (18) has elasticity and is urged against the electrode pad (3) to maintain electric connection.

Abstract translation: 本发明是提供一种印刷电路板，其中即使在高度集成的半导体装置安装在其上时也能够降低由半导体芯片和印刷电路板的热膨胀系数之间的差异引起的故障连接或断开，并且电子 设备使用相同。 根据本发明的电子设备（4）包括具有元件安装销（18）的印刷电路板（1）和具有电极焊盘（3）的表面安装型半导体设备（2），其中元件安装 销（18）具有弹性并且被推靠在电极焊盘（3）上以保持电连接。

公开(公告)号：US07748991B2

公开(公告)日：2010-07-06

申请号：US11781018

申请日：2007-07-20

Applicant: Shinichi Nikaido ,  Haruo Miyazawa ,  Katsuya Yamagami

Inventor： Shinichi Nikaido ,  Haruo Miyazawa ,  Katsuya Yamagami

IPC: H01R12/00

CPC classification number: H05K7/1069 ,  H01R12/52 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10378 ,  H05K2201/10719

Abstract: An aspect of the present invention inheres in an IC socket includes a plate-like socket base body which includes through hole forming portions having a plurality of contact housing holes formed so as to penetrate the plate-like socket base in a front-to-back direction, and having through holes formed around the respective contact housing holes so as to penetrate the plate-like socket base in the front-to-back direction, and a plated layer formed continuously on an inner wall of the through hole, on the front and back surfaces of the through hole forming portion, and on a surface of the contact piece.

Abstract translation: 本发明的集成电路插座的一个方面包括一个板状插座底座本体，它包括通孔形成部分，该通孔形成部分具有多个接触容纳孔，该多个接触容纳孔形成为以前后方式穿过该板状插座底座 方向，并且具有围绕各个接触容纳孔形成的通孔，以便沿着前后方向穿透板状插座基座，以及在前面的通孔的内壁上连续形成的镀层 和通孔形成部分的后表面以及接触片的表面上。

公开(公告)号：US07732919B2

公开(公告)日：2010-06-08

申请号：US12362354

申请日：2009-01-29

Applicant: Ichio Shimizu ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

Inventor： Ichio Shimizu ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

IPC: H01L23/34

CPC classification number: H05K7/04 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/28 ,  H01L24/29 ,  H01L24/36 ,  H01L24/39 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/202 ,  H05K3/321 ,  H05K3/3442 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/1003 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members. As a result, thermal stress applied to jointing materials such as solder can be reduced, improving the reliability of the semiconductor device (semiconductor package).

Abstract translation: 改善了无源部件的耦合可靠性，以提高半导体器件的可靠性。 第一通孔形成在第一板状引线的第一电极部分中，第二通孔形成在第二板状引线的第二电极部分中。 结果，在第一板状引线的第一电极部分，无源部件的一个外部端子可以被连接到第一通孔的两侧的第一电极部分，同时跨过第一通孔。 此外，在第二板状引线的第二电极部分，无源部件的另一个外部端子可以在跨过第二通孔而被布置在第二通孔的两侧上的第二电极部件上。 因此，在无源部件的纵向和宽度方向的中心部分处，被动部件被密封部件包围。 结果，可以减少施加到诸如焊料的接合材料的热应力，从而提高半导体器件（半导体封装）的可靠性。

公开(公告)号：US20100112829A1

公开(公告)日：2010-05-06

申请号：US12651970

申请日：2010-01-04

Applicant: Gary Yasamura ,  Joseph C. Fjelstad ,  Kevin P. Grundy ,  William F. Wiedemann ,  Matthew J. Stepovich

Inventor： Gary Yasamura ,  Joseph C. Fjelstad ,  Kevin P. Grundy ,  William F. Wiedemann ,  Matthew J. Stepovich

IPC: H01R12/00 ,  H01R4/48

CPC classification number: H01R13/2407 ,  H01R12/714 ,  H01R12/79 ,  H01R13/658 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/0979

Abstract: An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.

Abstract translation: 一种电互连装置，用于在要配合的两个导电元件的端部之间建立冗余触点，产生不具有电容短截线的电互连。

公开(公告)号：US20100012357A1

公开(公告)日：2010-01-21

申请号：US12548933

申请日：2009-08-27

Applicant: Alan E. Wang ,  Kevin C. Olson

Inventor： Alan E. Wang ,  Kevin C. Olson

IPC: H05K1/03 ,  H05K1/11

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。