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31.发明申请公开(公告)号：US20170286353A1
公开(公告)日：2017-10-05
申请号：US15621825
申请日：2017-06-13
Applicant: Intel Corporation
Inventor： Vladimir Tamarkin , Wayne Genetti , David Schweitzer
CPC classification number: G06F13/4282 , G06F1/16 , G06F1/185 , G06F1/186 , G06F13/4022 , G06F13/409 , G06F2213/0026 , H01R12/716 , H01R12/721 , H01R12/722 , H01R12/727 , H01R12/73 , H01R12/737 , H05K1/0296 , H05K1/145 , H05K3/308 , H05K5/0286 , H05K7/1422 , H05K2201/10
Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.
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公开(公告)号：US09723718B2
公开(公告)日：2017-08-01
申请号：US14452785
申请日：2014-08-06
Applicant: Mitsubishi Electric Corporation
Inventor： Taichi Obara , Rei Yoneyama , Takami Otsuki , Eiju Shitama
IPC: H05K1/18 , H05K1/11 , H01L23/15 , H05K3/34 , H05K7/12 , H05K7/00 , H01L23/13 , H01L23/373 , H01L23/498
CPC classification number: H05K1/183 , H01L23/13 , H01L23/15 , H01L23/3735 , H01L23/49827 , H01L23/49838 , H01L23/49844 , H01L2224/32225 , H01L2924/19105 , H05K1/11 , H05K1/111 , H05K1/186 , H05K1/188 , H05K3/3442 , H05K2201/09072 , H05K2201/09745 , H05K2201/10 , H05K2201/10174 , H05K2201/1059 , H05K2201/10636 , H05K2201/10651 , H05K2201/10674 , H05K2201/10689 , Y02P70/611 , Y02P70/613
Abstract: An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.
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公开(公告)号：US09674960B2
公开(公告)日：2017-06-06
申请号：US14700204
申请日：2015-04-30
Inventor： Johannes Stahr , Markus Leitgeb
CPC classification number: H05K1/185 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K1/144 , H05K1/181 , H05K1/186 , H05K3/4623 , H05K3/4697 , H05K2201/041 , H05K2201/042 , H05K2201/043 , H05K2201/045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09072 , H05K2201/09618 , H05K2201/10 , H05K2201/10083 , H05K2201/10151 , Y10T29/49126 , Y10T29/49144
Abstract: A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.
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公开(公告)号：US20170118842A1
公开(公告)日：2017-04-27
申请号：US14918678
申请日：2015-10-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. CHAMBERLIN , Andreas HUBER , Harald HUELS , Thomas STRACH , Thomas-Michael WINKEL
CPC classification number: H05K1/184 , B23K1/0016 , H05K1/0298 , H05K1/092 , H05K1/111 , H05K1/113 , H05K1/116 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K1/186 , H05K3/0047 , H05K3/3447 , H05K3/429 , H05K3/46 , H05K3/4644 , H05K3/4697 , H05K2201/093 , H05K2201/09309 , H05K2201/09327 , H05K2201/09345 , H05K2201/09381 , H05K2201/09518 , H05K2201/09545 , H05K2201/096 , H05K2201/09845 , H05K2201/10 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10174
Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.
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公开(公告)号：US09585256B2
公开(公告)日：2017-02-28
申请号：US14565532
申请日：2014-12-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoki Gouchi
IPC: H05K1/18 , H05K3/46 , B32B37/18 , H05K1/02 , H05K1/03 , H05K1/11 , H01L23/00 , B32B37/04 , B32B37/14 , H05K7/10 , H05K7/12
CPC classification number: H05K1/185 , B32B37/04 , B32B37/142 , B32B37/18 , B32B2305/342 , H01L24/19 , H01L24/25 , H01L2224/04105 , H01L2224/2518 , H01L2924/12042 , H05K1/0298 , H05K1/0313 , H05K1/115 , H05K1/181 , H05K1/186 , H05K3/4632 , H05K2201/0129 , H05K2201/0141 , H05K2201/0154 , H05K2201/09781 , H05K2201/10 , H05K2201/1006 , H05K2201/10204 , H05K2203/063 , H01L2924/00
Abstract: A component-embedded substrate includes a multilayer body formed by stacking up a plurality of resin layers in a predetermined direction, a component embedded in the multilayer body, the component having a plurality of terminal electrodes, a plurality of joining conductors provided in the multilayer body and joined to the plurality of terminal electrodes, a plurality of wiring conductors provided in the multilayer body and electrically coupled to the plurality of joining conductors and at least one auxiliary member enclosed within an outer boundary of the component provided in the multilayer body. The auxiliary member may be electrically insulated from each of the plurality of wiring conductors and arranged to balance pressures acting on the plurality of terminal electrodes when pressure is applied on the multilayer body.
Abstract translation: 部件嵌入式基板包括通过沿预定方向堆叠多个树脂层而形成的多层体，嵌入在多层体中的部件，具有多个端子电极的部件，设置在多层体中的多个接合导体 并且与所述多个端子电极接合，设置在所述多层体中并电耦合到所述多个接合导体的多个布线导体和包围在设置在所述多层体中的所述部件的外边界内的至少一个辅助构件。 辅助构件可以与多个布线导体中的每一个电绝缘，并且被布置为当在多层体上施加压力时平衡作用在多个端子电极上的压力。
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Patent Agency Ranking
36.发明授权公开(公告)号：US09055706B2
公开(公告)日：2015-06-09
申请号：US13635364
申请日：2011-04-11
Applicant: Johannes Stahr , Markus Leitgeb
Inventor： Johannes Stahr , Markus Leitgeb
CPC classification number: H05K1/185 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K1/144 , H05K1/181 , H05K1/186 , H05K3/4623 , H05K3/4697 , H05K2201/041 , H05K2201/042 , H05K2201/043 , H05K2201/045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09072 , H05K2201/09618 , H05K2201/10 , H05K2201/10083 , H05K2201/10151 , Y10T29/49126 , Y10T29/49144
Abstract: A method for integrating a component into a printed circuit board includes the following steps: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression, arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component integrated therein is provided.
Abstract translation: 一种用于将部件集成到印刷电路板中的方法包括以下步骤：提供两个完整的印刷电路板元件，其更具体地由多个互连的层或层组成，其中至少一个印刷电路板元件具有切口或凹陷 将要被集成在所述印刷电路板元件之一或所述至少一个印刷电路板元件的所述切口中的部件布置，并且将所述印刷电路板元件与容纳在所述切口中的部件连接，结果， 可以在印刷电路板中获得组件或传感器的安全可靠的适应。 此外，提供一种包括集成在其中的电子部件的这种类型的印刷电路板。
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37.发明申请EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE 有权嵌入式电子元件和制造电子元件嵌入式基板的方法公开(公告)号：US20150049446A1
公开(公告)日：2015-02-19
申请号：US14453953
申请日：2014-08-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Doo Hwan LEE
CPC classification number: H05K1/185 , H01L21/568 , H01L2224/04105 , H05K1/114 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/4007 , H05K2201/10 , H05K2201/10022 , H05K2201/1003 , Y10T29/49146
Abstract: Disclosed is an embedded electronic component which can improve reliability of connection with external wiring and efficiency of an embedding process by including: a contact pad provided on at least one surface of a body portion and made of a conductive material; a first insulating layer for covering the at least one surface of the body portion; a first pad in contact with a surface of the contact pad and made of a conductive material; a rearrangement portion provided on a surface of the first insulating layer to be in contact with the first pad; a second pad provided on the surface of the first insulating layer to be in contact with the rearrangement portion; and a second insulating layer having an opening to expose a portion of the second pad while covering the first insulating layer, the first pad, the rearrangement portion, and the second pad.
Abstract translation: 公开了一种能够提高与外部布线的连接可靠性和嵌入处理效率的嵌入式电子部件，其包括：设置在主体部分的至少一个表面上并由导电材料制成的接触焊盘; 用于覆盖主体部分的至少一个表面的第一绝缘层; 与所述接触垫的表面接触并由导电材料制成的第一焊盘; 设置在所述第一绝缘层的与所述第一焊盘接触的表面上的重排部; 第二垫，设置在与所述重排部接触的所述第一绝缘层的表面上; 以及第二绝缘层，其具有用于在覆盖第一绝缘层，第一焊盘，重新布置部分和第二焊盘的同时露出第二焊盘的一部分的开口。
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38.发明申请公开(公告)号：US20130008703A1
公开(公告)日：2013-01-10
申请号：US13635364
申请日：2011-04-11
Applicant: Johannes Stahr , Markus Leitgeb
Inventor： Johannes Stahr , Markus Leitgeb
CPC classification number: H05K1/185 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K1/144 , H05K1/181 , H05K1/186 , H05K3/4623 , H05K3/4697 , H05K2201/041 , H05K2201/042 , H05K2201/043 , H05K2201/045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09072 , H05K2201/09618 , H05K2201/10 , H05K2201/10083 , H05K2201/10151 , Y10T29/49126 , Y10T29/49144
Abstract: In a method for integrating a component (3) into a printed circuit board, the following steps are provided: providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.
Abstract translation: 在将组件（3）集成到印刷电路板中的方法中，提供以下步骤：提供两个完整的印刷电路板元件（1,4），其更特别地由多个相互连接的层或层（6， 其中至少一个印刷电路板元件（4）具有切口或凹陷（10），将组件（3）布置成集成在一个印刷电路板元件（1）上或者在 所述至少一个印刷电路板元件，并且将所述印刷电路板元件（1,4）与所述部件（3）连接在所述切口（10）中，结果可以获得安全可靠的住宿 在印刷电路板中的部件或传感器（3）。 此外，提供一种包括集成在其中的电子部件（3）的这种类型的印刷电路板。
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公开(公告)号：US20180235076A1
公开(公告)日：2018-08-16
申请号：US15737876
申请日：2016-07-04
Applicant: NEC Corporation
Inventor： Kazuhiro KASHIWAKURA , Ayako UEMURA
CPC classification number: H05K1/0216 , H05K1/0218 , H05K1/0243 , H05K1/11 , H05K3/46 , H05K9/0064 , H05K2201/09309 , H05K2201/09327 , H05K2201/09609 , H05K2201/10
Abstract: An objective of the present invention is to provide a printed board being capable of suppressing EMI emissions from power supply wirings. To accomplish the objective, a printed board of the present invention includes a plurality of ground layers disposed in a printed board, a power supply layer put between the plurality of the ground layers, and through holes disposed along at least periphery of the printed board and connecting the plurality of the ground layers, wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.Further, a printed board of the present invention includes a power supply layer disposed in a printed board and put between ground layers above and below the power supply layers, and a plurality of through holes connecting the ground layers above and below the power supply layers, wherein the plurality of the through holes are disposed at and near the power supply layer and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.
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公开(公告)号：US09961767B2
公开(公告)日：2018-05-01
申请号：US14990978
申请日：2016-01-08
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Kazuhiro Oshima , Hiroharu Yanagisawa , Kazuhiro Kobayashi , Katsuya Fukase , Ken Miyairi
IPC: H05K1/18 , H05K1/03 , H05K3/00 , H05K3/46 , H05K7/12 , H05K7/00 , H05K1/02 , H05K1/11 , H05K3/34
CPC classification number: H05K1/036 , H05K1/02 , H05K1/0296 , H05K1/0298 , H05K1/0366 , H05K1/111 , H05K1/181 , H05K3/007 , H05K3/3436 , H05K3/4682 , H05K2201/01 , H05K2201/0183 , H05K2201/10
Abstract: A circuit board includes an insulating layer including first and second insulator films, a first wiring layer embedded in the first insulator film and including pads and first wiring patterns exposed from the first insulator film, and a second wiring layer including second wiring patterns formed on the second insulator film and via wirings penetrating the insulating layer and electrically connecting the second wiring patterns to the first wiring layer. The first insulator film is made of a reinforcement-free resin that includes no reinforcing member. The second insulator film is made of a reinforcing member impregnated with a resin.
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