公开(公告)号：US20170170583A1

公开(公告)日：2017-06-15

申请号：US15350239

申请日：2016-11-14

Applicant: GE Aviation Systems Limited

Inventor： Denis Vaughan WEALE ,  Julian Peter MAYES

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/658 ,  H05K1/02 ,  H01R12/71 ,  H01R13/24

CPC classification number: H01R12/7088 ,  H01R12/718 ,  H01R13/2414 ,  H01R13/658 ,  H05K1/0216 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/0314 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/2036 ,  Y02P70/611

Abstract: The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.

公开(公告)号：US20170170526A1

公开(公告)日：2017-06-15

申请号：US15358150

申请日：2016-11-22

Applicant: Xiaomi Inc.

Inventor： Zongqiang WANG ,  Xianmin ZHANG ,  Shasha SHI

IPC: H01M10/42 ,  B23K26/21 ,  C09J9/02 ,  C09J7/00 ,  C09J5/00 ,  H01M10/44 ,  H01M10/04

CPC classification number: H01M10/425 ,  B23K26/21 ,  C09J5/00 ,  C09J7/00 ,  C09J9/02 ,  C09J2201/602 ,  C09J2203/33 ,  H01M2/021 ,  H01M2/30 ,  H01M2/34 ,  H01M10/04 ,  H01M10/443 ,  H01M2220/20 ,  H01M2220/30 ,  H05K1/117 ,  H05K1/181 ,  H05K3/321 ,  H05K3/325 ,  H05K3/3442 ,  H05K2201/10037 ,  H05K2201/10181 ,  H05K2201/10409

Abstract: Disclosed are a protective main board for a battery cell, an electronic terminal and a method for assembling a battery cell of an electronic terminal. The protective main board for a battery cell includes a main board body and a conducting component. The main board body includes a main board circuit and a protection circuit configured to protect the battery cell, and the protection circuit is connected with the main board circuit. The conducting component is arranged on the main board body, and includes a first conducting member and a second conducting member, and the battery cell is electrically connected with the protection circuit through the first conducting member and the second conducting member respectively.

公开(公告)号：US20170094792A1

公开(公告)日：2017-03-30

申请号：US15276547

申请日：2016-09-26

Applicant: TBS Avionics Co. Ltd.

Inventor： Christoph Dunkel ,  Remo Masina ,  Raphael Pirker

IPC: H05K1/14 ,  A63H27/00 ,  A63H29/22 ,  H05K1/18

CPC classification number: H05K1/144 ,  A63H27/02 ,  A63H27/12 ,  A63H29/22 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: The invention concerns an electronic component that comprises a printed circuit board stack with multiple printed circuit boards arranged one on top of the other and that is used, in particular, for model aircraft or commercially utilized unmanned aircraft. The printed circuit boards are held at a distance from one another by spacers. The fastening elements that are provided here are electrically conductive in design, and the printed circuit boards are connected to one another in an electrically conductive manner and also mechanically by these fastening elements.

公开(公告)号：US09560785B1

公开(公告)日：2017-01-31

申请号：US14030525

申请日：2013-09-18

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： David A. Brigham ,  James F. Fung ,  Gregory S. Laste ,  Bryan A. Thibideau ,  Joseph C. Brackett

IPC: H01R12/00 ,  H05K13/00 ,  H05K7/10

CPC classification number: H05K7/10 ,  H05K1/0286 ,  H05K3/225 ,  H05K3/325 ,  H05K7/1061 ,  H05K13/00 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2201/10719 ,  H05K2203/176

Abstract: The mezzanine card system and method of use thereof provides a baseboard having opposing sides, each side configured to receive a mezzanine card thereon. A plurality of mezzanine cards are provided having integrated circuits, such as Field Programmable Gate Arrays, fixedly attached thereon. The mezzanine cards of the system reduce reprogramming time from about 15 months to about six weeks. This drastic reduction in reprogramming time provides great advantages for circuitry systems, especially when these systems are used within battlefield and electronic warfare technology. The surfaces of the baseboard are an Electroless Nickel, Electroless Palladium, and Immersion Gold (ENEPIG) plated finish.

Abstract translation: 夹层卡系统及其使用方法提供了具有相对侧的基板，每个侧面配置成在其上接收夹层卡。 提供了多个夹层卡，其具有固定地附接在其上的集成电路，例如现场可编程门阵列。 系统的夹层卡将重编程时间从大约15个月减少到大约六周。 重新编程时间的急剧减少为电路系统提供了巨大的优势，特别是当这些系统在战场和电子战技术中使用时。 踢脚板的表面是无电镀镍，无电镀钯和浸金（ENEPIG）电镀。

公开(公告)号：US09552918B2

公开(公告)日：2017-01-24

申请号：US14777381

申请日：2014-03-10

Applicant: OMRON AUTOMOTIVE ELECTRONICS CO., LTD.

Inventor： Koji Hachiya ,  Tomoyoshi Kobayashi ,  Takashi Yamaguchi

IPC: H01F5/00 ,  H01F27/08 ,  H01F27/28 ,  H01F27/22 ,  H01F37/00 ,  H05K1/16 ,  H05K1/02 ,  H05K3/00

CPC classification number: H01F27/2876 ,  H01F27/22 ,  H01F27/2804 ,  H01F37/00 ,  H01F2027/2819 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/165 ,  H05K3/0061 ,  H05K2201/086 ,  H05K2201/10409 ,  H05K2201/10416

Abstract: Coil patterns are provided in first and second outer surface layers and an inner layer of the board. First and second heat-dissipation patterns are provided in the second outer surface layer. A first thermal inter-layer connection member connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern. A second thermal inter-layer connection member connects the coil pattern of the inner layer and the second heat-dissipation pattern. The coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other. An area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern.

Abstract translation: 线圈图案设置在第一和第二外表面层和板的内层中。 第一和第二散热图案设置在第二外表面层中。 第一热层间连接构件连接第一外表面层的线圈图案和第一散热图案。 第二热层间连接构件连接内层的线圈图案和第二散热图案。 设置在第二外表面层中的线圈图案和第一和第二散热图案彼此分离。 第二散热图案的面积大于第一散热图案的面积。

公开(公告)号：US20170014929A1

公开(公告)日：2017-01-19

申请号：US15196632

申请日：2016-06-29

Applicant: FUJITSU LIMITED

Inventor： Tsuyoshi So ,  Hideo Kubo ,  Yoshinori Uzuka ,  Nobumitsu Aoki

IPC: B23K1/00 ,  B23K35/30 ,  H05K13/00 ,  B23K35/02 ,  H05K7/20 ,  H05K1/02

CPC classification number: B23K1/0016 ,  B23K1/0012 ,  B23K35/00 ,  B23K35/025 ,  B23K35/3006 ,  B23K2101/14 ,  B23K2101/40 ,  H01L21/4882 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/0204 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/10409

Abstract: A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.

Abstract translation: 公开的连接冷却部件的方法包括通过将底板压靠电子部件将电子部件和冷却部件的球形底板彼此接合，同时在底板和电子部件之间提供热粘合材料 。

公开(公告)号：US09549467B1

公开(公告)日：2017-01-17

申请号：US14041407

申请日：2013-09-30

Applicant: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration

Inventor： David J. Petrick ,  Luan Vo ,  Dennis Albaijes

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11

CPC classification number: G06F1/185 ,  G06F1/189 ,  H02H3/087 ,  H02J1/00 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10628 ,  Y02P70/611

Abstract: An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.

Abstract translation: 一种用于太空任务的电子组件，包括PCB和耦合到PCB的一个或多个多针CGA器件。 PCB具有一个或多个通孔在焊盘特征中，并且每个通孔内焊盘特征包括焊盘焊盘，其被配置为将一个或多个多引脚CGA器件的引脚耦合到通孔。 PCB还包括在PCB的中心平面上方和下方两个对称配置的多个层。

公开(公告)号：US09521747B2

公开(公告)日：2016-12-13

申请号：US14363823

申请日：2012-12-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Rasp ,  Konrad Wagner

IPC: H05K1/02 ,  H05K1/05 ,  F21V19/00 ,  H05K1/11 ,  H05K3/00 ,  F21Y101/00

CPC classification number: H05K1/0296 ,  F21V19/0005 ,  F21V19/003 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0268 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0061 ,  H05K2201/09463 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10886 ,  H05K2203/162 ,  H05K2203/173 ,  H01L2924/00014

Abstract: A connection board includes at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the contact surfaces electrically connect to one another when the connection board is in a fastened state by a fastener that extends through the cut-out.

Abstract translation: 连接板包括至少一个切口，用于将连接板固定到安装板和彼此电隔离的多个接触表面，其中当连接板通过紧固件处于紧固状态时，接触表面彼此电连接 延伸穿过切口。

公开(公告)号：US09497877B2

公开(公告)日：2016-11-15

申请号：US14179811

申请日：2014-02-13

Applicant: SMA Solar Technology AG

Inventor： Eberhard Janssen ,  Volker Marschang ,  Burkhard Roecher

IPC: H05K7/14 ,  H01G2/06 ,  H02M7/00 ,  H01G2/10 ,  H01G2/14 ,  H05K1/02 ,  H05K3/22 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K7/1417 ,  H01G2/06 ,  H01G2/106 ,  H01G2/14 ,  H02M7/003 ,  H05K1/0201 ,  H05K1/0215 ,  H05K1/0231 ,  H05K1/0254 ,  H05K1/0268 ,  H05K3/222 ,  H05K3/301 ,  H05K3/325 ,  H05K7/14 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/10454 ,  H05K2201/10492 ,  Y10T29/49004

Abstract: An electronic device includes a housing, a circuit board, a plurality of holders having mechanical connectors to the housing and to the circuit board and mechanically fixing the circuit board within the housing, and at least one capacitor having a first electrode, a second electrode and a dielectric arranged between the first and second electrodes. The first electrode is electrically connected to a contact on the circuit board, and the second electrode is electrically connected to the housing. The at least one capacitor is part of one of the plurality of holders; and the dielectric of the capacitor is part of a thermal insulation between the connectors to the circuit board and to the housing.

Abstract translation: 电子设备包括壳体，电路板，多个保持器，其具有到外壳和电路板的机械连接器，并将电路板机械地固定在壳体内;以及至少一个电容器，其具有第一电极，第二电极和 布置在第一和第二电极之间的电介质。 第一电极电连接到电路板上的触点，并且第二电极电连接到壳体。 所述至少一个电容器是所述多个保持器之一的一部分; 并且电容器的电介质是到电路板的连接器和壳体之间的绝热的一部分。

公开(公告)号：US20160295682A1

公开(公告)日：2016-10-06

申请号：US15090207

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Tsuyoshi Tashima

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

Abstract translation: 电子控制单元包括基板，电子元件，散热器，盖子，蓄热器和螺钉。 在基板上形成布线图形。 电子部件安装在基板上，并在其通电时产生热量。 散热器沿其厚度方向设置在基板的一侧。 盖由树脂制成，并且在其厚度方向上设置在基板的另一侧。 蓄热器固定在基板侧的盖的一部分上，并且与盖侧的基板的表面接触。 螺钉的一端连接到散热器。 螺杆的中心部分沿其厚度方向穿过穿过基底的孔插入。 螺杆的另一端连接到蓄热器。