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    Module having at least one thermally conductive layer between printed circuit boards
    36.
    发明授权
    Module having at least one thermally conductive layer between printed circuit boards 有权
    模块在印刷电路板之间具有至少一个导热层

    公开(公告)号：US08971045B1

    公开(公告)日：2015-03-03

    申请号：US13731014

    申请日：2012-12-30

    Applicant: NETLIST, Inc.

    Inventor： Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

    Abstract: A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.

    Abstract translation: 模块可电连接到计算机系统。 模块包括边缘连接器，其具有可电连接到计算机系统的多个电触点，热耦合到边缘连接器的至少一层导热材料，以及第一和第二印刷电路板，每个具有多个集成电路部件， 电耦合到边缘连接器并且热耦合到至少一个导热材料层。 至少一层导热材料设置在第一和第二印刷电路板之间。

    HIGH FREQUENCY MODULE AND MANUFACTURING METHOD THEREOF
    38.
    发明申请
    HIGH FREQUENCY MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
    高频模块及其制造方法

    公开(公告)号：US20150016067A1

    公开(公告)日：2015-01-15

    申请号：US14325752

    申请日：2014-07-08

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Chang Sup SONG ,  Jong Pil Park

    IPC: H05K9/00 ,  H05K3/36 ,  H05K3/30 ,  H05K7/06

    CPC classification number: H05K1/144 ,  H01L2224/16227 ,  H01L2924/15153 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/047 ,  H05K2201/0723 ,  H05K2201/09027 ,  H05K2201/09618 ,  H05K2201/2018 ,  Y10T29/49126

    Abstract: A high frequency (HF) module and a manufacturing method thereof. The HF module has a single airtight box-like structure formed by a first PCB, a second PCB, and a third PCB. On a lower surface of the third PCB facing the first PCB, a second electronic component is mounted at a position corresponding to a first electronic component relatively low in height, among first electronic components mounted on the first PCB. Upper and lower ends of a plurality of vias formed within the second PCB are connected to a copper layer existing within a body of the third PCB and a copper layer existing within a body of the first PCB to constitute a single electromagnetic wave shielding unit overall.

    Abstract translation: 高频（HF）模块及其制造方法。 HF模块具有由第一PCB，第二PCB和第三PCB形成的单个气密的盒状结构。 在面向第一PCB的第三PCB的下表面上，在安装在第一PCB上的第一电子部件中，第二电子部件被安装在对应于相对低的高度的第一电子部件的位置处。 形成在第二PCB内的多个通孔的上端和下端连接到存在于第三PCB的主体内的铜层和存在于第一PCB的主体内的铜层，以总体构成单个电磁波屏蔽单元。

    MOBILE INDEPENDENT LOADING MECHANISM
    39.
    发明申请
    MOBILE INDEPENDENT LOADING MECHANISM 审中-公开
    移动独立装载机构

    公开(公告)号：US20140162473A1

    公开(公告)日：2014-06-12

    申请号：US13711345

    申请日：2012-12-11

    Applicant: Russell S. Aoki ,  Anthony P. Valpiani

    Inventor： Russell S. Aoki ,  Anthony P. Valpiani

    IPC: H01R12/16 ,  H05K3/30

    CPC classification number: H05K3/30 ,  H05K3/301 ,  H05K7/1061 ,  H05K2201/10325 ,  H05K2201/2018 ,  Y10T29/4913

    Abstract: A mobile device assembly comprising a land grid array (LGA) socket configured to couple with a board of a mobile device. The LGA socket may be configured to couple with a component of the mobile device. A mobile independent loading mechanism (ILM) may at least partially overlap the component and couple with the board of the mobile device via one or more fasteners. By coupling with the board of the mobile device, the mobile ILM may therefore apply pressure to the component, securely holding the component to the LGA socket.

    Abstract translation: 一种移动设备组件，包括被配置为与移动设备的板耦合的平面栅格阵列（LGA）插座。 LGA插座可以被配置为与移动设备的组件耦合。 移动式独立装载机构（ILM）可以至少部分地与部件重叠并且经由一个或多个紧固件与移动装置的板耦合。 通过与移动设备的板耦合，移动ILM可以因此向组件施加压力，将组件牢固地保持在LGA插座上。

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
    40.
    发明申请
    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
    电子元件及其制造方法

    公开(公告)号：US20140003017A1

    公开(公告)日：2014-01-02

    申请号：US14016415

    申请日：2013-09-03

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Seiji KAI ,  Shintaro NAKATANI ,  Mitsuyoshi HIRA ,  Takao MUKAI ,  Hisashi YAMAZAKI

    IPC: H05K1/18 ,  H03H3/08

    CPC classification number: H05K1/182 ,  H03H3/08 ,  H03H9/1071 ,  H05K3/3431 ,  H05K2201/0999 ,  H05K2201/10083 ,  H05K2201/2018 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49165

    Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.

    Abstract translation: 电子部件包括：框状支撑体，其包括热固性树脂，并且在基板的一个主表面上包围功能单元，并且在内侧与基板的周边分离，并且盖部件 被固定到支撑体上，使得框状支撑体的开口被密封。 框状支撑体包括框架状支撑体主体，从支撑体主体向内侧突出的第一突起和从支撑体主体向外侧突出的第二突起， 支撑体主体和第一突起彼此连续。

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