公开(公告)号：US09930783B2

公开(公告)日：2018-03-27

申请号：US15079811

申请日：2016-03-24

Applicant: QUALCOMM Incorporated

Inventor： Chengjie Zuo ,  David Francis Berdy ,  Daeik Daniel Kim ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H05K7/00 ,  H05K1/18 ,  H03H7/01 ,  H05K3/30 ,  H05K3/40 ,  H05K3/10 ,  H05K1/11 ,  H05K1/14 ,  H01L23/12 ,  H01L21/56 ,  H01L23/15 ,  H01L23/28

CPC classification number: H05K1/181 ,  H01L21/56 ,  H01L23/12 ,  H01L23/15 ,  H01L23/28 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H03H7/0138 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/09227 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10962 ,  H05K2201/2036

Abstract: Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

公开(公告)号：US09674960B2

公开(公告)日：2017-06-06

申请号：US14700204

申请日：2015-04-30

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.

公开(公告)号：US20170118858A1

公开(公告)日：2017-04-27

申请号：US15083300

申请日：2016-03-29

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tsung-Tai CHENG

IPC: H05K7/14 ,  H05K1/18 ,  H05K7/06 ,  H05K5/00 ,  H05K5/02

CPC classification number: H05K7/1427 ,  H05K1/141 ,  H05K1/181 ,  H05K5/0069 ,  H05K5/0247 ,  H05K7/06 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10303 ,  H05K2201/10318

Abstract: An integrated power module packaging structure includes a housing, a first circuit board, a second circuit board, a first pin, a second pin and a third pin. The housing has a cavity. The second circuit board is located above the first circuit board, and both them are received in the cavity. A switching module is disposed on the first circuit board. A high side current/voltage detecting device and a driving device are disposed on the second circuit board. The first pin, the second pin and the third pin are disposed between the first circuit board and the second circuit board. The first pin connects the high side current/voltage detecting device and the switching module in series. The second pin connects the switching module. The driving device controls the switching module through the third pin.

公开(公告)号：US09055706B2

公开(公告)日：2015-06-09

申请号：US13635364

申请日：2011-04-11

Applicant: Johannes Stahr ,  Markus Leitgeb

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K3/20 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A method for integrating a component into a printed circuit board includes the following steps: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression, arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component integrated therein is provided.

Abstract translation: 一种用于将部件集成到印刷电路板中的方法包括以下步骤：提供两个完整的印刷电路板元件，其更具体地由多个互连的层或层组成，其中至少一个印刷电路板元件具有切口或凹陷 将要被集成在所述印刷电路板元件之一或所述至少一个印刷电路板元件的所述切口中的部件布置，并且将所述印刷电路板元件与容纳在所述切口中的部件连接，结果， 可以在印刷电路板中获得组件或传感器的安全可靠的适应。 此外，提供一种包括集成在其中的电子部件的这种类型的印刷电路板。

公开(公告)号：US20130141881A1

公开(公告)日：2013-06-06

申请号：US13702216

申请日：2011-04-11

Applicant: Kazuhiro Nobori

Inventor： Kazuhiro Nobori

IPC: H05K7/00 ,  H05K13/00

CPC classification number: H05K7/00 ,  G02F1/13452 ,  H01L2924/0002 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K13/00 ,  H05K2201/045 ,  H05K2201/055 ,  H05K2201/09445 ,  Y10T29/49124 ,  H01L2924/00

Abstract: In a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.

Abstract translation: 在显示装置（100）中，在端子部（112）的连接面上形成有一排突出电极（115）和一排突出电极（116），一排突出电极（116） 在一排突出电极（115）和显示部分（111）之间，柔性印刷电路板（150）的一端连接到一排突出电极（115），柔性印刷电路板（160）的一端 ）连接到所述突出电极（116）的行，所述突出电极（115）的行与所述突出电极（116）的行相邻，并且所述柔性印刷电路板（150）的一端和 柔性印刷电路板（160）的一端彼此相对。

公开(公告)号：US08456857B2

公开(公告)日：2013-06-04

申请号：US12293777

申请日：2007-03-21

Applicant: Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

Inventor： Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

IPC: H05K1/11

CPC classification number: H05K7/1439 ,  H05K1/14 ,  H05K1/144 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/10409

Abstract: A backplane arrangement is provided for an electronic mounting rack with a base backplane with several contact strips, wherein a free space, into which at least one additional backplane can be inserted, is provided on the base backplane.

Abstract translation: 为具有带有多个接触条的基座背板的电子安装架提供背板布置，其中可在其上插入有至少一个附加背板的自由空间设置在基底板上。

公开(公告)号：US20130008703A1

公开(公告)日：2013-01-10

申请号：US13635364

申请日：2011-04-11

Applicant: Johannes Stahr ,  Markus Leitgeb

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K1/11 ,  H05K3/36 ,  H05K3/32

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: In a method for integrating a component (3) into a printed circuit board, the following steps are provided: providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.

Abstract translation: 在将组件（3）集成到印刷电路板中的方法中，提供以下步骤：提供两个完整的印刷电路板元件（1,4），其更特别地由多个相互连接的层或层（6， 其中至少一个印刷电路板元件（4）具有切口或凹陷（10），将组件（3）布置成集成在一个印刷电路板元件（1）上或者在 所述至少一个印刷电路板元件，并且将所述印刷电路板元件（1,4）与所述部件（3）连接在所述切口（10）中，结果可以获得安全可靠的住宿 在印刷电路板中的部件或传感器（3）。 此外，提供一种包括集成在其中的电子部件（3）的这种类型的印刷电路板。

公开(公告)号：US08122598B2

公开(公告)日：2012-02-28

申请号：US12468626

申请日：2009-05-19

Applicant: Toshihiko Yokomaku

Inventor： Toshihiko Yokomaku

IPC: H05K3/34

CPC classification number: H05K3/3463 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16251 ,  H05K1/0262 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3415 ,  H05K3/3457 ,  H05K3/4602 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2224/05599

Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps. This multilayer printed wiring board is easy to mount components, excellent in work efficiency or easy in reworkable process and a mounting method of such multilayer printed wiring board is also provided.

Abstract translation: 多层印刷电路板的部件安装方法包括：多个焊料凸块，用于安装形成在其前后的电子元件，其中当焊料凸块由第一，第二，第三和第四 焊料，第一，第二，第三和第四焊料具有不同的熔点，第一，第二，第三和第四焊料的熔点被排列为第一焊料的熔点，第二焊料的熔点，熔化 第三焊料的点和第四焊料的熔点按照高熔点顺序依次使用，并且第一，第二，第三和第四焊料依次用于以高熔点的顺序焊接电子部件等。 此外，在这种情况下，优选地，具有大体积的焊料凸块应比其它焊料凸块更早地焊接。 该多层印刷电路板容易安装组件，工作效率优异或易于再加工的工艺，并且还提供了这种多层印刷线路板的安装方法。

公开(公告)号：US20110183474A1

公开(公告)日：2011-07-28

申请号：US13079939

申请日：2011-04-05

Applicant: Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

Inventor： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

IPC: H01L21/56

CPC classification number: H01L25/162 ,  H01L23/3121 ,  H01L23/4824 ,  H01L23/5227 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L25/50 ,  H01L27/0617 ,  H01L27/0629 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/045 ,  H05K2203/081 ,  H05K2203/1476 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01006

Abstract: A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.

Abstract translation: 提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。 通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接连接。 通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热射流在280℃以上的温度进行热处理来进行。 因此，可以使用高熔点焊料将半导体芯片IC1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。 因此，半导体芯片IC1可以以高连接强度安装在PCB 38上。

公开(公告)号：US20110051382A1

公开(公告)日：2011-03-03

申请号：US12913136

申请日：2010-10-27

Applicant: Masanori YUMOTO ,  Yoshihisa HIRANO ,  Chiaki IMAEDA

Inventor： Masanori YUMOTO ,  Yoshihisa HIRANO ,  Chiaki IMAEDA

IPC: H05K1/00

CPC classification number: G02F1/13452 ,  G02F1/133615 ,  H05K1/141 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/045 ,  H05K2201/055

Abstract: An electro-optical apparatus comprising an electro-optical panel including a display section, a flexible printed circuit board, and a rigid circuit board. The flexible printed circuit board includes a first terminal connected to the electro-optical panel and a second terminal connected to an external circuit. The rigid circuit board includes a first surface on which electronic components are mounted and a second surface mounted to the flexible printed circuit board. The second surface of the rigid circuit board is opposite to the first surface. An entirety of the rigid circuit board is stacked on the flexible printed circuit board within the flexible printed circuit board. The rigid circuit board is electrically connected to the flexible printed circuit board. The flexible printed circuit board is bent toward the external circuit.

Abstract translation: 一种电光装置，包括包括显示部分，柔性印刷电路板和刚性电路板的电光面板。 柔性印刷电路板包括连接到电光面板的第一端子和连接到外部电路的第二端子。 刚性电路板包括安装有电子部件的第一表面和安装到柔性印刷电路板的第二表面。 刚性电路板的第二表面与第一表面相对。 整个刚性电路板堆叠在柔性印刷电路板上的柔性印刷电路板上。 刚性电路板电连接到柔性印刷电路板。 柔性印刷电路板向外部电路弯曲。