公开(公告)号：US20140208590A1

公开(公告)日：2014-07-31

申请号：US13754799

申请日：2013-01-30

Applicant: NVIDIA CORPORATION

Inventor： Leilei Zhang ,  Ronilo V. Boja ,  Abraham Fong Yee ,  Zuhair Bokharey

IPC: H05K3/00

CPC classification number: H05K3/0094 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/42 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49165

Abstract: A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.

Abstract translation: 公开了一种用于制造在厚衬底中形成的具有高密度微孔的印刷电路板的方法。 该方法包括以下步骤：使用激光钻孔技术在厚基底中形成一个或多个孔，用导电材料电镀一个或多个孔，其中导电材料不完全填充一个或多个孔，并填充一个 或更多的电镀孔与非导电材料。

公开(公告)号：US20140198471A1

公开(公告)日：2014-07-17

申请号：US14149864

申请日：2014-01-08

Applicant: FUJITSU LIMITED

Inventor： Naohiko Kajio ,  NAOFUMI KOSUGI ,  Yoshio Matsumoto

IPC: H05K1/14

CPC classification number: H05K1/142 ,  H05K1/144 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10568 ,  H05K2201/10803 ,  H05K2201/2036 ,  H05K2203/167

Abstract: First and second tapered holes are provided at facing positions of the first and second circuit boards. The elastic spacer including first and second spacers is attached between them to couple the two in parallel and thereby facilitate attachment of the two to a back panel. The first spacer is provided at one end part with a tapered part which fits with the first tapered hole and the second spacer is provided at one end part with a tapered part which fits with the second tapered hole. A spring is inserted between the two spacers. The first spacer is fit in the tapered hole and fastened by a screw to the first circuit board. The second circuit board is fastened by a screw to the first spacer in a state fitting the second tapered hole over the second spacer with the second circuit board approaching the first circuit board.

Abstract translation: 第一和第二锥形孔设置在第一和第二电路板的相对位置处。 包括第一和第二间隔件的弹性间隔件连接在它们之间以使两者平行连接，从而便于将两者附接到后面板。 第一间隔件在一端部设置有与第一锥形孔配合的锥形部，第二间隔件在一端部设置有与第二锥形孔配合的锥形部。 弹簧插入两个间隔件之间。 第一间隔件装配在锥形孔中，并通过螺钉固定在第一电路板上。 第二电路板通过螺钉固定在第一间隔件上，其状态是将第二锥形孔装配在第二间隔件上，而第二电路板接近第一电路板。

公开(公告)号：US08759687B2

公开(公告)日：2014-06-24

申请号：US12948882

申请日：2010-11-18

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/03

CPC classification number: H05K3/4691 ,  H05K2201/0715 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09845

Abstract: A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.

Abstract translation: 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性布线板以及位于绝缘基板和柔性布线板上方的绝缘层，并露出柔性布线板的至少一部分。 柔性布线板具有在位于绝缘基板旁边的柔性布线板的端部处朝向绝缘基板制成的锥形部分。

公开(公告)号：US08698009B2

公开(公告)日：2014-04-15

申请号：US13435450

申请日：2012-03-30

Applicant: Kota Noda ,  Tsutomu Yamauchi

Inventor： Kota Noda ,  Tsutomu Yamauchi

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger.

Abstract translation: 一种布线板，具有通过从基板的两个表面形成具有不同形状的孔而形成的贯通孔。 在这样的贯通孔中，形成在基板的第一表面侧的第一开口部的深度比形成在第二表面侧的第二开口部的深度浅，第一开口的直径更大 比第二开口的直径。 即使第一开口部分的重力线和第二开口部分的重力线彼此偏移，可以使插入第一开口部分的内部空间的第二开口部分的区域更大。

公开(公告)号：US08692126B2

公开(公告)日：2014-04-08

申请号：US12805710

申请日：2010-08-16

Applicant: Jun Ishii ,  Hirotoshi Iguchi

Inventor： Jun Ishii ,  Hirotoshi Iguchi

IPC: H05K1/03

CPC classification number: H05K3/303 ,  G11B5/484 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126

Abstract: A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer, and a conductive layer formed on the insulating layer. In the metal supporting layer, a reference hole for positioning is formed, and a stepped portion is formed so as to surround the reference hole.

Abstract translation: 布线电路板包括金属支撑层，形成在金属支撑层上的绝缘层和形成在绝缘层上的导电层。 在金属支撑层中，形成用于定位的基准孔，并且形成有围绕基准孔的阶梯部。

公开(公告)号：US08674781B2

公开(公告)日：2014-03-18

申请号：US13621117

申请日：2012-09-15

Applicant: Heung-Kyu Kim

Inventor： Heung-Kyu Kim

IPC: H01P3/08

CPC classification number: H01P3/081 ,  H01P11/003 ,  H05K1/0221 ,  H05K3/205 ,  H05K2201/0376 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2201/09827

Abstract: A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.

Abstract translation: 公开了一种具有微带线的印刷电路板，具有带状线的印刷电路板及其制造方法。 根据本发明实施例的具有微带线的印刷电路板包括第一绝缘层，埋在第一绝缘层的一个表面中的信号线，穿过第一绝缘层并被布置的多个导体 在与信号线并联的信号线的两侧，以及形成为与第一绝缘层的另一个表面上的导体电连接的接地层。

公开(公告)号：US08624127B2

公开(公告)日：2014-01-07

申请号：US12952864

申请日：2010-11-23

Applicant: Atsushi Ishida ,  Ryojiro Tominaga ,  Kenji Sakai

Inventor： Atsushi Ishida ,  Ryojiro Tominaga ,  Kenji Sakai

IPC: H05K1/09

CPC classification number: H05K3/4038 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49165

Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract translation: 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

公开(公告)号：US20130335871A1

公开(公告)日：2013-12-19

申请号：US13843860

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Moon LEE ,  Sung Kwon WI ,  Ju Hwan YANG ,  Won Chul SIM ,  Young Do KWEON

IPC: H02H9/04

CPC classification number: H02H9/044 ,  H01C1/14 ,  H01C7/12 ,  H01T4/08 ,  H01T4/10 ,  H05K1/026 ,  H05K2201/09736 ,  H05K2201/09827

Abstract: Disclosed herein are an electrostatic discharge protection device including: a substrate; a pair of electrodes formed on the substrate so as to be spaced apart from each other; and an insulating layer formed on the electrodes, wherein each of the electrodes has a shape in which it protrudes from a cross section thereof toward a surface thereof, and a manufacturing method thereof, and a composite electronic component including the same.

Abstract translation: 这里公开了一种静电放电保护装置，包括：基板; 一对电极，形成在所述基板上以彼此间隔开; 以及形成在电极上的绝缘层，其中每个电极具有从其横截面向其表面突出的形状及其制造方法，以及包括该绝缘层的复合电子部件。

公开(公告)号：US08553364B1

公开(公告)日：2013-10-08

申请号：US12623983

申请日：2009-11-23

Applicant: Christopher Schreiber ,  Christopher Gene Dunn

Inventor： Christopher Schreiber ,  Christopher Gene Dunn

IPC: G11B5/48

CPC classification number: G11B5/48 ,  B33Y80/00 ,  G11B5/486 ,  H05K1/0215 ,  H05K1/0228 ,  H05K1/056 ,  H05K3/388 ,  H05K3/44 ,  H05K3/4685 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/09827

Abstract: A low impedance, low crosstalk disk drive suspension circuit has multiple traces carrying a first polarity of a differential signal, interleaved with multiple traces carrying the second polarity of a differential signal. Each pair of conductors consisting of a trace of the first polarity and a trace of the second polarity may cross over each other at multiple crossover points. The crossover connections may utilize a second layer of copper trace conductors over the first and main layer, or alternatively the crossover connections may utilize an isolated portion of the suspension substrate.

公开(公告)号：US08546696B2

公开(公告)日：2013-10-01

申请号：US12820605

申请日：2010-06-22

Applicant: Hirohito Watanabe

Inventor： Hirohito Watanabe

IPC: H05K1/00 ,  H05K3/00 ,  H01R9/00

CPC classification number: H05K1/117 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/2009 ,  Y10T29/49147 ,  Y10T156/10

Abstract: A printed circuit board having a connection terminal which includes: an insulating substrate including first and second surfaces, and an end surface along an outline normal to an insertion direction of the connection terminal; at least one lead wiring layer formed on the first surface of the insulating substrate; an insulating protection film covering the lead wiring layer; at least one lead terminal layer constituting an end portion of the lead wiring layer, the lead terminal layer being formed into a strip, and having an end surface along the outline; a reinforcement body adhered on the second surface of the insulating substrate at a backside position of the lead terminal layer; wherein a distance between an outer surface of the lead terminal layer and an outer surface of the reinforcement body on the outline side is smaller than a distance therebetween on the lead wiring layer side.

Abstract translation: 一种具有连接端子的印刷电路板，包括：绝缘基板，包括第一表面和第二表面;以及沿着垂直于连接端子的插入方向的轮廓的端面; 形成在绝缘基板的第一表面上的至少一个引线布线层; 覆盖引线布线层的绝缘保护膜; 构成所述引线配线层的端部的至少一个引线端子层，所述引线端子层形成为带状，并且具有沿着所述轮廓的端面; 加强体，其在所述引线端子层的背面位置粘附在所述绝缘基板的所述第二表面上; 其中，引线端子层的外表面与轮廓侧的加强体的外表面之间的距离小于引线布线层侧的距离。