公开(公告)号：US20180263121A1

公开(公告)日：2018-09-13

申请号：US15913094

申请日：2018-03-06

Applicant: BorgWarner Ludwigsburg GmbH

Inventor： Sisay Tadele ,  Helmut Hoppe ,  Alexander Dauth ,  Gerd Bräuchle

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H01G2/06 ,  H01G2/106 ,  H01G9/06 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09027 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/10522 ,  H05K2201/10606 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2201/10901 ,  H05K2201/2018 ,  H05K2201/2045

Abstract: What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

公开(公告)号：US10039186B2

公开(公告)日：2018-07-31

申请号：US15267872

申请日：2016-09-16

Applicant: Intel Corporation

Inventor： Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Adel A. Elsherbini ,  Sasha Oster ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/147 ,  A61B5/00 ,  A61B5/6833 ,  A61B2562/164 ,  A61B2562/166 ,  H05K1/0283 ,  H05K1/112 ,  H05K1/181 ,  H05K3/365 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/10318

Abstract: A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.

公开(公告)号：US20180188290A1

公开(公告)日：2018-07-05

申请号：US15741213

申请日：2016-07-04

Applicant: OKINS ELECTRONICS CO.,LTD

Inventor： Sung Gye PARK ,  Jin Kook JUN

IPC: G01R3/00 ,  G01R1/04 ,  G01R31/28 ,  H05K3/10 ,  H05K3/28 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: G01R3/00 ,  G01R1/0433 ,  G01R31/2863 ,  G01R31/2896 ,  H05K1/0268 ,  H05K1/028 ,  H05K1/111 ,  H05K3/103 ,  H05K3/28 ,  H05K3/285 ,  H05K3/3484 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10856 ,  H05K2203/041 ,  H05K2203/1327 ,  H05K2203/166

Abstract: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.

公开(公告)号：US20180098423A1

公开(公告)日：2018-04-05

申请号：US15827275

申请日：2017-11-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: H05K1/02 ,  H05K5/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

公开(公告)号：US20180042104A1

公开(公告)日：2018-02-08

申请号：US15785563

申请日：2017-10-17

Applicant: OMRON Corporation

Inventor： Shingo NAGAOKA ,  Hiroyuki ONISHI ,  Takeo NISHIKAWA ,  Kentaro HAMANA

IPC: H05K1/02 ,  H01L23/433 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H01L23/36 ,  H01L23/4332 ,  H01L23/5222 ,  H02M1/44 ,  H02M3/155 ,  H02M7/48 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/0311 ,  H05K2201/066 ,  H05K2201/0792 ,  H05K2201/10166 ,  H05K2201/10265 ,  H05K2201/10356 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: Provided is a power converter which is applied to a power converter equipped with a switching element provided on a line, and a radiator connected to a predetermined potential such as a ground potential. A noise eliminator in which a conductive member is covered with insulator is provided between the switching element (semiconductor switch) and the radiator (heatsink). A flexible connecting line connected to a conductive member of the noise eliminator is connected to an on-board line disposed on a circuit board.

公开(公告)号：US20180035551A1

公开(公告)日：2018-02-01

申请号：US15428292

申请日：2017-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-hyun Woo

IPC: H05K5/00 ,  G11C5/04 ,  F16B43/00 ,  H05K1/11

CPC classification number: H05K5/006 ,  F16B5/065 ,  F16B43/004 ,  G11C5/04 ,  H05K1/117 ,  H05K5/0008 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/10159 ,  H05K2201/10265 ,  H05K2201/10409

Abstract: A semiconductor memory device including a case including an upper case, a lower case, support structures extending from the lower case to the upper case, a printed circuit board (PCB) in the case and supported by the support structures, a leaf spring on a lower surface of the PCB, the leaf spring seated on support surfaces of the support structures, and a solder layer between the PCB and the leaf spring, the solder layer coupling the PCB with the leaf spring may be provided.

公开(公告)号：US20170215286A1

公开(公告)日：2017-07-27

申请号：US15007743

申请日：2016-01-27

Applicant: Northrop Grumman Systems Corporation

Inventor： Matthew J. Pirih ,  Steven J. Mass ,  Andrew Yurko

IPC: H05K1/14 ,  H05K3/02 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10265 ,  H05K2201/10348 ,  H05K2203/0723 ,  H05K2203/095 ,  H05K2203/107

Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.

公开(公告)号：US20170155203A1

公开(公告)日：2017-06-01

申请号：US15321022

申请日：2015-06-12

Applicant: Sumitomo Wiring Systems, Ltd

Inventor： Hideki Goto

IPC: H01R12/58 ,  H05K1/11

CPC classification number: H01R12/585 ,  H01R12/718 ,  H05K1/11 ,  H05K1/184 ,  H05K2201/10265 ,  H05K2201/10295

Abstract: The present invention provides a terminal-equipped printed circuit board having a novel structure in which a circuit board terminal is stably positioned on and fixed to a printed circuit board, and conduction stability between the circuit board terminal and a conduction portion provided in a through-hole of the printed circuit board can be ensured without needing a soldering step. The printed circuit board includes press-in holes and through-holes that have conduction portions, and the circuit board terminal includes press-in protrusions and press-fit lead portions that have press-fit portions. The circuit board terminal and the conduction portions are brought into conduction by the press-fit lead portions being inserted into the through-holes and the press-fit portions being press-fitted against the conduction portions of the through-holes. The circuit board terminal is positioned on and fixed to the printed circuit board by the press-in protrusions being pressed into the press-in holes.

公开(公告)号：US20170099745A1

公开(公告)日：2017-04-06

申请号：US15383405

申请日：2016-12-19

Applicant: Cisco Technology, Inc.

Inventor： Long Dang ,  Don Nguyen ,  Michael Brooks

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  F16B2/248 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10265 ,  H05K2201/10393

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

公开(公告)号：US20160352032A1

公开(公告)日：2016-12-01

申请号：US15164198

申请日：2016-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juneseok PARK

IPC: H01R12/79 ,  H01R12/77

CPC classification number: H01R12/79 ,  H01R12/714 ,  H01R12/771 ,  H01R13/24 ,  H01R13/6205 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2203/104 ,  Y02P70/611

Abstract: An electronic device may include: a printed circuit board (PCB); a plurality of electronic components electrically connected to the PCB; and a connection member comprising a first portion fixed to one of the PCB and an electronic component and a second portion magnetically connected to the other one of the PCB and the electronic component. The second portion of the connection member may be moveably connected to the first portion.

Abstract translation: 电子设备可以包括：印刷电路板（PCB）; 电连接到PCB的多个电子部件; 以及连接构件，其包括固定到所述PCB中的一个和电子部件的第一部分和与所述PCB和所述电子部件中的另一个磁性连接的第二部分。 连接构件的第二部分可以可移动地连接到第一部分。