Abstract:
Methods for fabricating sublithographic, nanoscale microstructures arrays including openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. In some embodiments, the films can be used as a template or mask to etch openings in an underlying material layer.
Abstract:
An apparatus for contaminants being deposited thereon in a particle beam device, and also the particle beam device including the apparatus, are provided. This apparatus may be an anticontaminator. The apparatus according to the system described herein may include at least one cooling unit. The cooling unit may provide at least one cooled surface on which contaminants in a particle beam device are deposited. The apparatus according to the system described herein may further include at least one aperture unit. The aperture unit may be arranged at a motion device for moving the aperture unit relative to the cooling unit. Furthermore, the aperture unit may have at least one aperture opening. The cooling unit may be connected to the aperture unit by at least one first flexible thermal conductor.
Abstract:
In accordance with an embodiment, a defect inspection apparatus includes a charged beam irradiation unit, a detection unit, an energy filter, and an inspection unit. The charged beam irradiation unit generates a charged beam and irradiates a sample including a pattern as an inspection target thereon with the generated charged beam. The detection unit detects secondary charged particles or reflected charged particles generated from the sample by irradiation of the charged beam and outputs a signal. The energy filter is arranged between the detection unit and the sample to selectively allow the secondary charged particles or the reflected charged particles with energy associated with an applied voltage to pass therethrough. The inspection unit applies voltages different from each other to the energy filter and outputs information concerning a defect of the pattern from an intensity difference between signals obtained under application voltage different from each other.
Abstract:
There is provided a method of adjusting a transmission electron microscope to facilitate an adjustment for bringing a focal plane of an electron beam exiting a two-stage filter type monochromator into coincidence with an achromatic plane. The method starts with obtaining a transmission electron microscope image including interference fringes of the electron beam that are generated by an aperture located behind the monochromator. The focal plane of the beam exiting the monochromator is brought into coincidence with the achromatic plane by adjusting the intensity of an electrostatic lens, the intensities of the electric and magnetic fields produced by at least one of two energy filters, or astigmatism generated in the monochromator based on an intensity distribution of the interference fringes in the obtained transmission electron microscope image.
Abstract:
A positioning system for precise stage is provided. It includes a designed pattern on a stage; an electron beam column generating a focused electron beam to scan the designed pattern and produce electron signal; an electron detection unit to detect the electronic signal; and a control unit converting the electron signal to a clock signal to determine the relative position of the electron beam column and the designed pattern, so as to adjust the displacement of the stage. A nanometer scale positioning method for a precise stage is provided, which can resolve the problem of mechanical drift of the stage when the stage is multi-axis positioning or rotating.
Abstract:
There is provided an apparatus and a method capable of preparing a standardized probe without need for working skill of probe processing. According to the present invention, a probe shape generation process of detecting a probe shape based on the probe incoming current detected by a probe current detection unit, a probe tip coordinate extraction process of detecting a tip position of the probe from the probe shape, a probe contour line extraction process of generating a probe contour line obtained by approximating a contour of the probe from the tip position of the probe and the probe shape, a probe center line extraction process of generating a center line and a vertical line of the probe from the probe contour line, a processing pattern generation process of generating a processing pattern based on the probe tip position, the probe center line, the probe vertical line, and a preset shape and dimension of a probe acute part, and an ion beam termination process of performing, based on the processing pattern, termination of ion-beam processing are performed.
Abstract:
An ion implanter and an ion implant method are disclosed. The ion implanter has an aperture assembly with a variable aperture and is located between an ion source of an ion beam and a holder for holding a wafer. At least one of the size and the shape of the variable aperture is adjustable. The ion beam may be flexibly shaped by the variable aperture, so that the practical implantation on the wafer can be controllably adjusted without modifying an operation of both the ion source and mass analyzer or applying a magnetic field to modify the ion beam. An example of the aperture assembly has two plates, each having an opening formed on its edge such that a variable aperture is formed by a combination of these openings. By respectively moving the plates, the size and the shape of the variable aperture can be changed.
Abstract:
A gas cluster ion beam (GCIB) processing system using multiple nozzles for forming and emitting at least one GCIB and methods of operating thereof are described. The GCIB processing system may be configured to treat a substrate, including, but not limited to, doping, growing, depositing, etching, smoothing, amorphizing, or modifying a layer thereupon. Furthermore, the GCIB processing system may be operated to produce a first GCIB and a second GCIB, and to irradiate a substrate simultaneously and/or sequentially with the first GCIB and second GCIB.
Abstract:
A particle-optical arrangement comprises a charged-particle source for generating a beam of charged particles; a multi-aperture plate arranged in a beam path of the beam of charged particles, wherein the multi-aperture plate has a plurality of apertures formed therein in a predetermined first array pattern, wherein a plurality of charged-particle beamlets is formed from the beam of charged particles downstream of the multi-aperture plate, and wherein a plurality of beam spots is formed in an image plane of the apparatus by the plurality of beamlets, the plurality of beam spots being arranged in a second array pattern; and a particle-optical to element for manipulating the beam of charged particles and/or the plurality of beamlets; wherein the first array pattern has a first pattern regularity in a first direction, and the second array pattern has a second pattern regularity in a second direction electron-optically corresponding to the first direction, and wherein the second regularity is higher than the first regularity.
Abstract:
An electron beam apparatus such as a sheet beam based testing apparatus has an electron-optical system for irradiating an object under testing with a primary electron beam from an electron beam source, and projecting an image of a secondary electron beam emitted by the irradiation of the primary electron beam, and a detector for detecting the secondary electron beam image projected by the electron-optical system; specifically, the electron beam apparatus comprises beam generating means 2004 for irradiating an electron beam having a particular width, a primary electron-optical system 2001 for leading the beam to reach the surface of a substrate 2006 under testing, a secondary electron-optical system 2002 for trapping secondary electrons generated from the substrate 2006 and introducing them into an image processing system 2015, a stage 2003 for transportably holding the substrate 2006 with a continuous degree of freedom equal to at least one, a testing chamber for the substrate 2006, a substrate transport mechanism for transporting the substrate 2006 into and out of the testing chamber, an image processing analyzer 2015 for detecting defects on the substrate 2006, a vibration isolating mechanism for the testing chamber, a vacuum system for holding the testing chamber at a vacuum, and a control system 2017 for displaying or storing positions of defects on the substrate 2006.