中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

502 records (took 0.015 seconds)

    Flexible substrate electronic assembly
    71.
    发明授权
    Flexible substrate electronic assembly 失效
    柔性基板电子组件

    公开(公告)号：US5276418A

    公开(公告)日：1994-01-04

    申请号：US675045

    申请日：1991-03-25

    Applicant: Tomasz Klosowiak ,  Sanjar Ghaem

    Inventor： Tomasz Klosowiak ,  Sanjar Ghaem

    IPC: H05K1/05 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K5/00 ,  H05K7/14 ,  H01H9/02

    CPC classification number: H05K5/006 ,  H05K1/14 ,  H05K1/189 ,  H05K7/1417 ,  H05K1/05 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/042 ,  H05K2201/053 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K2201/10363 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/40

    Abstract: A unitary flexible substrate has three planar areas with components and conductors carried thereon. The substrate is folded to provide a subassembly with a compact packaging factor such that each planar area is in a different parallel plane. Two conductor-carrying projections of the substrate extend from different end portions of the substrate to free distal ends of the projections which are positioned adjacent to each other. The projection conductors, at the projection distal ends, are soldered to each other to provide a more direct, low resistance electrical connection between conductors on the substrate end portions. Heat sink rigidizer plates are attached to each of the three planar substrate portions. One rigidizer plate is thermally and planarly coupled to a metal heat sink cover of a protective housing for the folded subassembly. The other rigidizer plates are planarly bonded to each other to form a unitary support structure for two of the planar substrate portions.

    Abstract translation: 单一柔性基板具有三个平面区域，其上承载有部件和导体。 折叠基板以提供具有紧凑包装因子的子组件，使得每个平面区域处于不同的平行平面。 基板的两个导体承载突起从基板的不同端部延伸到彼此相邻定位的凸起的自由远端。 在突出的远端处的投影导体彼此焊接，以在基底端部的导体之间提供更直接，低电阻的电连接。 散热刚性板连接到三个平面基板部分中的每一个。 一个刚性板被热平面地耦合到用于折叠子组件的保护壳体的金属散热器盖。 其他刚性板彼此平面地接合以形成用于两个平面基板部分的整体支撑结构。

    Mounting of electronic components on substrates
    73.
    发明授权
    Mounting of electronic components on substrates 失效
    电子元器件在基片上的安装

    公开(公告)号：US5141455A

    公开(公告)日：1992-08-25

    申请号：US681826

    申请日：1991-04-08

    Applicant: Timothy R. Ponn

    Inventor： Timothy R. Ponn

    IPC: H01R13/719 ,  H05K1/18 ,  H05K3/32 ,  H05K9/00

    CPC classification number: H05K1/189 ,  H01R13/719 ,  H05K3/326 ,  H05K1/182 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49153

    Abstract: A method for mounting electronic components, such as capacitors and the like, to a flat flexible insulating substrate having conductive material thereon. In one form of the invention, an electronic component is attached to a given area of the substrate with one conductive side of the electronic component in electrical connection with the conductive material on the substrate. A slot is formed in the substrate substantially about the electronic component but less than 360.degree. thereabout to define a tongue, including the electronic component, and an integral hinge portion of the substrate. The tongue is bent about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith into a desired position for connection of an opposite conductive side of the electronic component to an appropriate terminal. In another form of the invention, a closed or 360.degree. slot is formed in the substrate. One conductive side of the electronic component is in electrical connection with the conductive material on the substrate within the closed slot, and the other conductive side of the electronic component is in electrical connection with the conductive material on the substrate outside the closed slot. A terminal is electrically connected to the conductive material on the substrate inside the closed slot.

    Method of manufacturing an electrical circuit system and electrical circuit system
    74.
    发明授权
    Method of manufacturing an electrical circuit system and electrical circuit system 失效
    制造电路系统和电路系统的方法

    公开(公告)号：US5042971A

    公开(公告)日：1991-08-27

    申请号：US510465

    申请日：1990-04-16

    Applicant: Stephen D. Ambrose

    Inventor： Stephen D. Ambrose

    IPC: H01R4/04 ,  H01R12/62 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32

    CPC classification number: H01R4/04 ,  H01R12/62 ,  H05K1/189 ,  H05K3/326 ,  H05K1/0286 ,  H05K1/0289 ,  H05K1/118 ,  H05K1/145 ,  H05K1/182 ,  H05K2201/052 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09172 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10689 ,  Y10S439/912

    Abstract: A method of manufacturing an electrical circuit system comprising electrical conductors on a flexible film and an article of manufacture made thereby, which may be used in place of printed circuit boards and which conductors form connector means for readily connecting to the leads of one or more sides of an electronic package. The electrical conductors also form a means for selectably connecting each electrical conductor from each pin to a selected input or output conductor, comprising a first and second plurality of conductors, such as a matrix having a column of conductors and a row of conductors. The electrical circuit system may be manufactured by numerous methods such as applying a conductive ink or paint by screening, photolithography or drawn by a digital plotter on a plastic film, such as Mylar. The film may include electrical edge connection means to provide input or output to or from said conductors. All or most of the system is integral, thus forming the conductors and the in-line connector portion of the conductors in continuum, using the same conductive material, such as ink, or paint and the same dielectric material, such as ink, or paint. A dielectric covers the appropriate portion of the system.

    Abstract translation: 一种制造电路系统的方法，该电路系统包括柔性膜上的电导体和由此制成的制品，其可用于代替印刷电路板，并且哪些导体形成用于容易地连接到一个或多个侧面的引线的连接器装置 的电子包装。 电导体还形成用于将每个引脚的每个电导体可选地连接到选定的输入或输出导体的装置，该导体包括第一和第二多个导体，例如具有导体列和一排导体的矩阵。 电路系统可以通过许多方法来制造，例如通过筛选，光刻或通过数字绘图仪在诸如Mylar的塑料膜上涂抹导电油墨或涂料。 该胶片可以包括电边缘连接装置，以向所述导体提供输入或输出。 所有或大部分系统是一体的，因此使用相同的导电材料（例如墨水或涂料）和相同的电介质材料（例如油墨或油漆）在连续体中形成导体的导体和直列连接器部分 。 电介质覆盖系统的适当部分。

Patent Agency Ranking