公开(公告)号：US06225571B1

公开(公告)日：2001-05-01

申请号：US09252741

申请日：1999-02-19

Applicant: Jeffrey L. Bream ,  Stephen A. Ferranti ,  Madhu Ganesa-Pillai ,  Leon Klafter ,  Alan M. Lyons ,  John Paul Mello ,  Steven J. Vargo

Inventor： Jeffrey L. Bream ,  Stephen A. Ferranti ,  Madhu Ganesa-Pillai ,  Leon Klafter ,  Alan M. Lyons ,  John Paul Mello ,  Steven J. Vargo

IPC: H05K118

CPC classification number: H05K3/341 ,  H01L23/36 ,  H01L23/3736 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/056 ,  H05K1/141 ,  H05K2201/066 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

Abstract: The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m° C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.

Abstract translation: 本发明提供一种与发热电气部件一起使用的散热器。 散热器包括具有相对侧的脊柱，从脊部延伸的冷却片，以及粘附到至少一个相对侧的电介质层。 电介质层具有至少约1W / m℃的热导率。散热器还可以包括附着到电介质层的金属层。 金属层提供可以粘附电气部件的表面。 散热器还可以包括附着在金属层上的发热部件。 在另一方面，发热部件是用焊料粘附到金属层的表面安装电子部件。

公开(公告)号：US06195256B1

公开(公告)日：2001-02-27

申请号：US09211426

申请日：1998-12-15

Applicant: Roberto Tiziani ,  Roberto Rossi ,  Claudio Maria Villa

Inventor： Roberto Tiziani ,  Roberto Rossi ,  Claudio Maria Villa

IPC: H05K720

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

Abstract: An external heat sink is soldered to an internal heat sink incorporated into the bottom of a molded body of encapsulating resin for a package of an integrated power device. The power device is for surface mounting on a printed circuit board. The internal heat sink has at least a portion protruding from an outer surface of at least one face of the molded body. An external heat sink is mounted on the printed circuit board. The external heat sink has at least a surface abutting with a surface of the body, thus defining a separation gap between at least a surface of the protruding portion of the internal heat sink and an opposing surface of the external heat sink. This separation gap is filled with molten solder alloy during a normal soldering treatment of the printed circuit board.

Abstract translation: 将外部散热器焊接到结合到用于集成电力设备的封装的封装树脂的成型体的底部中的内部散热器。 电源设备用于表面安装在印刷电路板上。 内部散热器具有从成型体的至少一个面的外表面突出的至少一部分。 外部散热器安装在印刷电路板上。 外部散热器具有与主体的表面邻接的至少一个表面，从而在内部散热器的突出部分的至少一个表面与外部散热器的相对表面之间形成分隔间隙。 在印刷电路板的正常焊接处理期间，该分离间隙被熔融焊料合金填充。

公开(公告)号：US06194782B1

公开(公告)日：2001-02-27

申请号：US09103802

申请日：1998-06-24

Applicant: Roman Katchmar

Inventor： Roman Katchmar

IPC: H01L2334

CPC classification number: H01L23/49838 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/094 ,  H05K2201/10969 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A surface mount area-array integrated circuit package is disclosed. The package consists of a package substrate having conductive vias and internal and external conductive traces, a semiconductor die electrically and mechanically connected to the top surface of package substrate, an area-array of conductive surface mount terminations electrically and mechanically connected to the bottom of the package substrate, and at least one adhesive mass. The at least one adhesive mass is located on the bottom of the package substrate and replaces the conductive terminations in the area(s) where the joint strain energy density is calculated to be the greatest. When mounted on a substrate, the at least one adhesive mass adheres the package to the substrate. Increased mechanical and electrical reliability is thus achieved.

Abstract translation: 公开了一种表面安装区域阵列集成电路封装。 该封装由具有导电通孔和内部和外部导电迹线的封装基板，半导体管芯电连接和机械连接到封装基板的顶表面，导电表面安装端子的区域阵列电气和机械连接到 封装衬底和至少一个粘合剂块。 至少一个粘合剂物质位于封装衬底的底部，并替代计算接头应变能量密度最大的区域中的导电端子。 当安装在基底上时，至少一个粘合剂块将包装粘附到基底上。 从而实现了增加的机械和电气可靠性。

公开(公告)号：US06191369B1

公开(公告)日：2001-02-20

申请号：US09181619

申请日：1998-10-28

Applicant: Shinichi Kusakawa

Inventor： Shinichi Kusakawa

IPC: H05K116

CPC classification number: H05K1/0269 ,  H05K1/0266 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/325 ,  H05K3/341 ,  H05K2201/0314 ,  H05K2201/09781 ,  H05K2201/10136 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/0191 ,  H05K2203/168

Abstract: A printed circuit board 100 comprises a substrate 102 and a plurality of conductive traces 104-116 formed on the surface of the substrate 102. The conductive traces 104-116 include a marker trace 104 which is formed through the same process and of the same material as the other conductive traces 106-116 used for electrical signal transmission. The marker trace 104 may be so formed as to surround a desired footprint FP1 of a double-sided adhesive sheet 140 to be bonded on the printed circuit board 100. In this manner, a marker, such as the marker trace 104, may be formed without any need for additional and/or dedicated marker-forming process.

Abstract translation: 印刷电路板100包括衬底102和形成在衬底102的表面上的多个导电迹线104-116.导电迹线104-116包括通过相同工艺和相同材料形成的标记迹线104 作为用于电信号传输的其它导电迹线106-116。 标记迹线104可以形成为包围要粘合在印刷电路板100上的双面粘合片140的期望的印迹FP1。以这种方式，可以形成诸如标记迹线104的标记 而不需要额外的和/或专用的标记形成过程。

公开(公告)号：US6154364A

公开(公告)日：2000-11-28

申请号：US197093

申请日：1998-11-19

Applicant: Troy M. Girrens ,  Robert Gordon Fessenden ,  Dianne K. Ruch ,  Thomas P. Douglas ,  Timothy J. Guse ,  Billy R. Colwell ,  Sidney T. Faulkner

Inventor： Troy M. Girrens ,  Robert Gordon Fessenden ,  Dianne K. Ruch ,  Thomas P. Douglas ,  Timothy J. Guse ,  Billy R. Colwell ,  Sidney T. Faulkner

IPC: H01L23/36 ,  H05K3/34 ,  H05K3/40 ,  H05K7/20

CPC classification number: H01L23/36 ,  H05K3/341 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2203/0545 ,  H05K3/3426 ,  H05K3/3484 ,  H05K3/4015 ,  Y02P70/613

Abstract: A process and circuit board assembly by which a single soldering operation produces a multicomponent stack capable of dissipating heat from a power IC chip (12) mounted to a substrate (10). The circuit board assembly generally includes a number of conductors (16) on the substrate (10), with the conductors (16) being spaced apart and substantially parallel to each other. A heat spreader (14) is soldered to at least some of the conductors (16), and the chip (12) is soldered to the heat spreader (14). With this structure, heat is conducted from the chip (12) through the heat spreader (14) and conductors (16) to the substrate (10). To maintain proper orientation of the components (12, 14, 16) relative to each other during a single soldering operation, the components (12, 14, 16) are equipped with complementary features.

Abstract translation: 一种工艺和电路板组件，其中单个焊接操作产生能够从安装到衬底（10）的功率IC芯片（12）散热的多组件堆叠。 电路板组件通常在衬底（10）上包括多个导体（16），其中导体（16）彼此间隔开并且基本上彼此平行。 散热器（14）被焊接到至少一些导体（16），并且芯片（12）被焊接到散热器（14）。 利用这种结构，热量从芯片（12）通过散热器（14）和导体（16）传导到衬底（10）。 为了在单次焊接操作期间保持部件（12,14,16）相对于彼此的适当取向，部件（12,14,16）配备有互补特征。

公开(公告)号：US6100606A

公开(公告)日：2000-08-08

申请号：US225495

申请日：1999-01-06

Applicant: Atsushi Nakahata ,  Shigeyuki Okumura ,  Tomohiro Taguchi

Inventor： Atsushi Nakahata ,  Shigeyuki Okumura ,  Tomohiro Taguchi

IPC: H01H50/10 ,  H01P1/12 ,  H05K1/02 ,  H05K3/34 ,  H03K17/04

CPC classification number: H05K1/0243 ,  H01H50/10 ,  H01P1/127 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10969 ,  H05K2203/1147 ,  H05K3/3447

Abstract: A miniaturized high frequency switching device is capable of giving an optimum over-all impedance over the length of a signal path while compensating for inevitable impedance variation seen in a particular segment of the signal path. The switching device includes a contact block having fixed contacts and a movable contact. The fixed contacts and the movable contact are surrounded by an electromagnetic shield which is supported on a conductor base to be grounded therethrough for isolating the current path from a surrounding electromagnetic field. The fixed contacts are formed respectively on one ends of terminal pins provided for electrical connection to an external load circuit operating on high frequency signals. The terminal pin extends through an insulation ring fitted in the conductor base so as to be electrically insulated therefrom and form the signal path flowing a high frequency current. An impedance compensating structure is provided in the contact block for differentiating a first impedance at a first segment of a limited length along the terminal pin from a second impedance inherent to a second segment immediately adjacent the first segment so as to give a target over-all impedance, which is between the first and second impedance, over the full length of the terminal pin.

Abstract translation: 小型化的高频开关装置能够在信号路径的长度上给出最佳的全部阻抗，同时补偿在信号路径的特定段中看到的不可避免的阻抗变化。 开关装置包括具有固定触点和可动触头的触点块。 固定触点和可动触头被电磁屏蔽围绕，电磁屏蔽被支撑在导体基座上，以便将电流路径与周围的电磁场隔离。 固定触点分别形成在端子引脚的一端上，用于与在高频信号上工作的外部负载电路电连接。 端子销延伸穿过安装在导体基座中的绝缘环，以便与其电绝缘，并形成流过高频电流的信号路径。 在接触块中提供阻抗补偿结构，用于沿着端子引脚将有限长度的第一段上的第一阻抗与紧邻第一段的第二段固有的第二阻抗进行微分，从而使目标全部 在第一和第二阻抗之间的阻抗在端子引脚的整个长度上。

公开(公告)号：US6071371A

公开(公告)日：2000-06-06

申请号：US16908

申请日：1998-02-02

Applicant: Jay F. Leonard ,  Yanshu Chen

Inventor： Jay F. Leonard ,  Yanshu Chen

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H05K3/30 ,  H05K3/34 ,  A05K3/00

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/50 ,  H05K3/305 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H05K2201/10636 ,  H05K2201/10969 ,  H05K3/3442 ,  H05K3/3494 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/1089 ,  Y10T29/49144

Abstract: A process is provided for simultaneously attaching surface-mount (SM) integrated circuit (IC) devices (12) and chip-on-board (COB) IC devices (22) to a circuit board (10) using a combined solder reflow and adhesive cure thermal cycle. The process generally entails placing SM and COB devices (12, 22) on the circuit board (10), such that a suitable solder composition (14) and adhesive (24) are present between the circuit board (10) and the SM and COB devices (12, 22), respectively. The circuit board (10) and devices (12, 22) are then heated so as to simultaneously cure the adhesive (24) and reflow the solder composition (14). A preferred heating step entails at least one thermal cycle that attains a peak temperature well above the cure temperature of the adhesive (24), as well as above the melting or liquidus temperature of the solder composition (14). Accordingly, the thermal cycle is employed to cure the adhesive (24) well outside its conventional cure limits. Thereafter, the circuit board (10) and the devices (12, 22) are cooled to solidify the molten solder (14). The COB device (22) can then be wire bonded to the circuit board (10) and encapsulated in accordance with known practices.

Abstract translation: 提供了一种使用组合的焊料回流和粘合剂将表面贴装（SM）集成电路（IC）器件（12）和片上（COB）IC器件（22））同时附接到电路板（10）的工艺 治疗热循环。 该方法通常需要将SM和COB装置（12,22）放置在电路板（10）上，使得在电路板（10）和SM和COB之间存在合适的焊料组合物（14）和粘合剂（24） 装置（12,22）。 然后加热电路板（10）和装置（12,22），以同时固化粘合剂（24）并回流焊料组合物（14）。 优选的加热步骤需要达到远高于粘合剂（24）的固化温度的峰值温度以及高于焊料组合物（14）的熔融或液相线温度的至少一个热循环。 因此，采用热循环来将粘合剂（24）很好地固化在常规固化极限之外。 此后，电路板（10）和装置（12,22）被冷却以固化熔融焊料（14）。 然后可以根据已知的做法将COB装置（22）引线接合到电路板（10）并封装。

公开(公告)号：US6057600A

公开(公告)日：2000-05-02

申请号：US199716

申请日：1998-11-25

Applicant: Kenji Kitazawa ,  Shinichi Koriyama ,  Shigeki Morioka ,  Satoru Tomie

Inventor： Kenji Kitazawa ,  Shinichi Koriyama ,  Shigeki Morioka ,  Satoru Tomie

IPC: H01L23/66 ,  H05K1/02 ,  H05K3/34 ,  H05K1/00 ,  H01L23/00 ,  H01L23/12

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09781 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K3/341 ,  H05K3/3442

Abstract: A structure for mounting a high-frequency device on an insulating board having a circuit on a top surface and transmitting signals to the high-frequency device. The high-frequency device is sealed within a cavity on a top surface of a dielectric board. The dielectric board has a first signal transmission line on its top surface and a second signal transmission line on its bottom surface, the first and second signal transmission lines overlapping each other over a portion where the signal is transmitted through coupling of the first and second signal transmission lines. A recess is formed at the top surface of the insulating board below the overlapping portion of the first and second signal transmission lines to suppress transmission loss of the high-frequency signal between the first and second signal transmission lines. The recess may be filled with air or a material having a dielectric constant low than that of the insulating board.

Abstract translation: 一种用于将高频器件安装在具有在顶表面上的电路的绝缘板上并将信号传输到高频器件的结构。 高频器件被密封在电介质板的顶表面上的空腔内。 电介质板在其顶表面上具有第一信号传输线，在其底表面上具有第二信号传输线，第一和第二信号传输线在信号通过第一和第二信号的耦合的一部分上彼此重叠 传输线。 在第一和第二信号传输线的重叠部分之下的绝缘板的顶表面处形成凹部，以抑制第一和第二信号传输线之间的高频信号的传输损耗。 凹部可以填充空气或介电常数低于绝缘板的介电常数的材料。

公开(公告)号：US5917704A

公开(公告)日：1999-06-29

申请号：US944700

申请日：1997-10-06

Applicant: John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

Inventor： John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

IPC: H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H05K3/34 ,  H05K7/20

CPC classification number: H01L23/4334 ,  H01L23/3121 ,  H05K3/341 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/0112 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/107 ,  H05K3/3452 ,  H05K3/3494 ,  Y02P70/613

Abstract: There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.

Abstract translation: 这里公开了一种具有整体散热器16的电子部件10，其特别设计用于辅助将散热器激光焊接到衬底20上的焊盘22上。部件10具有顶表面30，大体平行的底表面32 至少一个周边外表面34，大体上垂直于顶表面和底表面之间。 部件10包括：电路部分12; 连接到电路部分12并从其向外延伸的至少一个终端14; 位于通常在电路部分12下方并与电路部分12热接触的散热器16部分; 以及封闭电路部分12的至少顶表面的主体部分18和靠近电路部分12的每个端接件14的一部分。散热器16限定电子部件10的至少一部分底表面32，并且至少 电子部件10的至少一个周边外表面34的一部分。

公开(公告)号：US5914536A

公开(公告)日：1999-06-22

申请号：US678536

申请日：1996-07-05

Applicant: Yasushi Shizuki ,  Yuji Iseki ,  Naoko Ono ,  Kunio Yoshihara ,  Masayuki Saito ,  Hiroshi Yamada ,  Kazuki Tateyama

Inventor： Yasushi Shizuki ,  Yuji Iseki ,  Naoko Ono ,  Kunio Yoshihara ,  Masayuki Saito ,  Hiroshi Yamada ,  Kazuki Tateyama

IPC: G01R31/04 ,  H01L21/60 ,  H01L21/66 ,  H01L23/485 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H01L23/48

CPC classification number: H01L24/13 ,  G01R31/048 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3452 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/171 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/0269 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2203/0465 ,  H05K3/3431 ,  H05K3/368 ,  Y02P70/613

Abstract: A semiconductor device includes a wiring board having a main surface and a plurality of pad electrodes formed on the main surface, a rectangular semiconductor element having a main surface facing the main surface of the wiring board and mounted on the main surface of the wiring board, a solder resist formed to surround the semiconductor element with a preset distance therefrom on the main surface of the wiring board, a plurality of terminal electrodes formed on the end portion of the main surface of the semiconductor element, and a plurality of solder bumps for electrically connecting the plurality of pad electrodes to the plurality of terminal electrodes with a gap provided between the main surface of the wiring board and the main surface of the semiconductor element, wherein each of the plurality of pad electrodes includes at least a portion which extends from substantially under a corresponding one of the plurality of terminal electrodes of the semiconductor element to the solder resist lying outside the semiconductor element and each of the plurality of solder bumps includes a portion extending over part of a corresponding one of the plurality of pads which lies outside the semiconductor element.

Abstract translation: 半导体器件包括具有主表面和形成在主表面上的多个焊盘电极的布线板，具有面向布线板的主表面的主表面并且安装在布线板的主表面上的矩形半导体元件， 在该布线基板的主面上形成有围绕半导体元件与预定距离的阻焊剂，形成于该半导体元件的主面的端部的多个端子电极和多个用于电连接的焊料凸块 将所述多个焊盘电极连接到所述多个端子电极，所述间隙设置在所述布线板的主表面和所述半导体元件的主表面之间，其中所述多个焊盘电极中的每一个包括至少一部分， 在半导体元件的多个端子电极中的对应的一个到焊料re 位于半导体元件外侧的多个焊料块中的每一个包括在位于半导体元件外部的多个焊盘中相应的一个焊盘的一部分上延伸的部分。