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公开(公告)号:US20230420224A1
公开(公告)日:2023-12-28
申请号:US18230722
申请日:2023-08-07
Applicant: Carl Zeiss Microscopy GmbH
Inventor: Andreas Schmaunz
IPC: H01J37/32 , H01J37/145 , H01J37/244 , H01J37/28 , H01J37/304
CPC classification number: H01J37/32449 , H01J37/145 , H01J37/244 , H01J37/28 , H01J37/304 , H01J2237/006 , H01J2237/2065
Abstract: Operating a gas feed device for a particle beam apparatus includes predetermining a flow rate of a precursor through an outlet of a precursor reservoir containing the precursor to be fed onto an object, loading a temperature of the precursor reservoir, the temperature being associated with the predetermined flow rate, from a database into a control unit, setting a temperature of the precursor reservoir to the temperature loaded from the database using a temperature setting unit, and determining at least one functional parameter of the precursor reservoir depending on the flow rate and the temperature, loaded from the database, using the control unit and informing a user of the gas feed device about the determined functional parameter. Informing the user of the gas feed device about the functional parameter may include displaying the functional parameter on a display unit, outputting an optical signal, or outputting an acoustic signal.
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公开(公告)号:US11848171B2
公开(公告)日:2023-12-19
申请号:US17587935
申请日:2022-01-28
Applicant: Hitachi High-Tech Corporation
Inventor: Akio Yamamoto , Wen Li , Hiroshi Oinuma , Shunsuke Mizutani
IPC: H01J37/244 , H01J37/28 , H01J37/22 , H01J37/26
CPC classification number: H01J37/244 , H01J37/222 , H01J37/265 , H01J37/28 , H01J2237/2443 , H01J2237/2826
Abstract: Provided is a charged particle beam device and a charged particle beam device calibration method capable of correcting an influence of characteristic variation and noise with high accuracy. Control units execute a first calibration of correcting a characteristic variation between a plurality of channels in detectors and signal processing circuits by using a setting value of a control parameter for each of the plurality of channels in a state in which a primary electron beam is not emitted. The control units further execute a second calibration of correcting a characteristic variation between the plurality of channels in scintillators or the like by using the setting value of the control parameter for each of the plurality of channels in a state in which the primary electron beam is emitted.
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公开(公告)号:US20230402248A1
公开(公告)日:2023-12-14
申请号:US18034929
申请日:2020-12-16
Applicant: Hitachi High-Tech Corporation
Inventor: Akito TANOKUCHI , Hiroki TSUBOUCHI , Takao UBUKATA
CPC classification number: H01J37/18 , H01J37/28 , H01J2237/1825
Abstract: Provided are a vacuum treatment device and a vacuum treatment method with which it is possible to suppress deterioration of the degree of vacuum in a conveyance destination vacuum chamber when conveying a sample between two vacuum chambers. In this regard, a control device 30 controls conveyance of a wafer 600 from LC 102 to SC 101 via a LC-SC gate valve 510. At this time, the control device stops vacuum evacuation, which is being performed by a TMP 401A for a first duration of time, after having controlled the LC-SC gate valve 510 to close, measures an internal pressure of the LC 102 by using a pressure gauge 103 in a condition in which the vacuum evacuation is stopped, and controls the LC-SC gate valve 510 to open if the measured internal pressure has reached a first reference value.
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公开(公告)号:US11837433B2
公开(公告)日:2023-12-05
申请号:US17669503
申请日:2022-02-11
Applicant: JEOL Ltd.
Inventor: Akiho Nakamura
IPC: H01J37/26 , H01J37/28 , H01J37/147
CPC classification number: H01J37/265 , H01J37/1474 , H01J37/28 , H01J2237/2802 , H01J2237/2804
Abstract: A method of measuring a relative rotational angle includes: shifting an electron beam on a specimen plane by using a deflector; tilting the electron beam with respect to the specimen plane by using the deflector; acquiring a first STEM image including information of a scattering azimuth angle and a second STEM image not including the information of the scattering azimuth angle, before the shifting and the tilting; acquiring a third STEM image including the information of the scattering azimuth angle and a fourth STEM image not including the information of the scattering azimuth angle, after the shifting and the tilting; and obtaining the relative rotational angle based on the first STEM image, the second STEM image, the third STEM image and the fourth STEM image.
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公开(公告)号:US11837431B2
公开(公告)日:2023-12-05
申请号:US16018008
申请日:2018-06-25
Applicant: Hermes Microvision, Inc.
Inventor: Shuai Li , Zhongwei Chen
IPC: H01J37/147 , H01J37/145 , H01J37/28 , H01J37/141
CPC classification number: H01J37/145 , H01J37/141 , H01J37/1472 , H01J37/1474 , H01J37/1477
Abstract: The device includes a beam source for generating an electron beam, a beam guiding tube passed through an objective lens, an objective lens for generating a magnetic field in the vicinity of the specimen to focus the particles of the particle beam on the specimen, a control electrode having a potential for providing a retarding field to the particle beam near the specimen to reduce the energy of the particle beam when the beam collides with the specimen, a deflection system including a plurality of deflection units situated along the optical axis for deflecting the particle beam to allow scanning on the specimen with large area, at least one of the deflection units located in the retarding field of the beam, the remainder of the deflection units located within the central bore of the objective lens, and a detection unit to capture secondary electron (SE) and backscattered electrons (BSE).
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公开(公告)号:US11817415B2
公开(公告)日:2023-11-14
申请号:US16308931
申请日:2017-05-23
Applicant: NITTO DENKO CORPORATION
Inventor: Satoshi Honda , Yuki Sugo , Nao Kamakura
IPC: C09J1/00 , H01L23/00 , C09J7/10 , C09J7/38 , C09J9/02 , C09J11/04 , H01J37/28 , H01L21/52 , H01L21/683 , H01L21/78 , C08K3/08 , C08K3/10 , C09J9/00
CPC classification number: H01L24/32 , C09J1/00 , C09J7/10 , C09J7/385 , C09J9/00 , C09J9/02 , C09J11/04 , H01J37/28 , H01L21/52 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , C08K3/08 , C08K3/10 , C09J2203/326 , C09J2301/408 , C09J2400/16 , H01L2224/48091 , H01L2224/73265 , H01L2224/83191 , H01L2224/83203 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2224/48091 , H01L2924/00014
Abstract: Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 μm or more and 50 μm or less.
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公开(公告)号:US11798780B2
公开(公告)日:2023-10-24
申请号:US17563186
申请日:2021-12-28
Applicant: Hitachi High-Tech Corporation
Inventor: Toshiyuki Yokosuka , Chahn Lee , Hideyuki Kazumi , Hajime Kawano , Shahedul Hoque , Kumiko Shimizu , Hiroyuki Takahashi
IPC: H01J37/28 , H01J37/147 , H01J37/20 , H01J37/22
CPC classification number: H01J37/28 , H01J37/147 , H01J37/20 , H01J37/22 , H01J2237/2803 , H01J2237/2806 , H01J2237/2817 , H01J2237/2826 , H01J2237/3045
Abstract: The scanning charged particle beam microscope according to the present application is characterized in that, in acquiring an image of the FOV (field of view), interspaced beam irradiation points are set, and then, a deflector is controlled so that a charged particle beam scan is performed faster when the charged particle beam irradiates a position on the sample between each of the irradiation points than when the charged particle beam irradiates a position on the sample corresponding to each of the irradiation points (a position on the sample corresponding to each pixel detecting a signal). This allows the effects from a micro-domain electrification occurring within the FOV to be mitigated or controlled.
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公开(公告)号:US20230335373A1
公开(公告)日:2023-10-19
申请号:US18131891
申请日:2023-04-07
Applicant: Hitachi High-Tech Corporation
Inventor: Akio YAMAMOTO , Wen LI , Shunsuke MIZUTANI , Naoya ISHIGAKI
IPC: H01J37/244 , H01J37/28 , H01J37/26
CPC classification number: H01J37/244 , H01J37/28 , H01J37/265 , H01J2237/24475 , H01J2237/2448
Abstract: There is provided a technique capable of reducing deterioration of a back scattered electron (BSE) detector caused by a dark pulse. Charged particle beam apparatus includes: a plurality of BSE detectors configured to detect a BSE from a sample; and a controller. The controller acquires, within a period, a first peak time of a first peak included in an output signal from a first BSE detector among the plurality of BSE detectors, and a second peak time of a second peak included in an output signal from a second BSE detector other than the first BSE detector among the plurality of BSE detectors, determines, when the second peak is present where a time difference between the first peak time and the second peak time is within a threshold value, that the first peak is caused by the BSE, and determines, when the second peak is not present where the time difference is within the threshold value, that the first peak is caused by the dark pulse.
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公开(公告)号:US20230335367A1
公开(公告)日:2023-10-19
申请号:US18028771
申请日:2020-11-10
Applicant: Hitachi High-Tech Corporation
Inventor: Takashi OHSHIMA , Hideo MORISHITA , Tatsuro IDE , Hiroyasu SHICHI , Yoichi OSE , Junichi KATANE
IPC: H01J37/06 , H01J37/28 , H01J37/244
CPC classification number: H01J37/06 , H01J37/28 , H01J37/244 , H01J2237/24535 , C23C14/14
Abstract: An activation mechanism is provided in an activation region of an electron gun, and includes a light source device 3 configured to irradiate a photocathode with excitation light, a heat generating element, an oxygen generation unit configured to generate oxygen by heating the heat generating element, and an emission current meter configured to monitor an emission current generated by electron emission when the photocathode 1 is irradiated with the excitation light from the light source device. In a surface activation process, the photocathode is irradiated with the excitation light from the light source device, an emission current amount of the photocathode is monitored by the emission current meter, the heat generating element is heated to generate oxygen by the oxygen generation unit, and the heating of the heat generating element is stopped when the emission current amount of the photocathode satisfies a predetermined stop criterion.
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公开(公告)号:US11791130B2
公开(公告)日:2023-10-17
申请号:US17299153
申请日:2019-01-23
Applicant: Hitachi High-Tech Corporation
Inventor: Koichi Hamada , Megumi Kimura , Momoyo Enyama , Ryou Yumiba , Makoto Sakakibara , Kei Sakai , Satoru Yamaguchi , Katsumi Setoguchi , Masumi Shirai , Yasunori Takasugi
IPC: H01J37/28 , H01J37/153 , H01J37/22
CPC classification number: H01J37/28 , H01J37/153 , H01J37/222 , H01J2237/2817
Abstract: The objective of the present invention is to reduce differences between individual electron beam observation devices accurately by means of image correction. This method for calculating a correction factor for correcting images between a plurality of electron beam observation devices, in electron beam observation devices which generate images by scanning an electron beam across a specimen, is characterized by including: a step in which a first electron beam observation device generates a first image by scanning a first electron beam across first and second patterns, on either a specimen including the first pattern and the second pattern, having a different shape or size to the first pattern, or a first specimen including the first pattern and a second specimen including the second pattern; a step in which a second electron beam observation device generates a second image by scanning a second electron beam across the first and second patterns; and a step in which the first or second electron beam observation device calculates a correction factor at a peak frequency extracted selectively from first and second frequency characteristics calculated on the basis of the first and second images.
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