公开(公告)号：US20160143147A1

公开(公告)日：2016-05-19

申请号：US14923992

申请日：2015-10-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Min Woo PARK ,  Seung Pil JUNG

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/115 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/111 ,  H05K3/284 ,  H05K3/3415 ,  H05K2201/09436 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/10977 ,  H05K2203/1316 ,  H05K2203/1563 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The electronic device module and method thereof includes a board, an electronic device, a sealing part, and a connection conductor. The board includes external connection electrodes. The electronic device is mounted on the board. The sealing part is configured to seal the electronic device. The connection conductor is configured to penetrate through the sealing part and including one end bonded to the external connection electrodes of the board. One of the external connection electrodes includes a reinforcing via disposed in the board.

Abstract translation: 电子设备模块及其方法包括板，电子设备，密封部分和连接导体。 电路板包括外部连接电极。 电子设备安装在电路板上。 密封部件被构造成密封电子设备。 连接导体被构造成穿过密封部分并且包括结合到板的外部连接电极的一端。 外部连接电极中的一个包括设置在板中的加强通孔。

公开(公告)号：US09318820B2

公开(公告)日：2016-04-19

申请号：US14227574

申请日：2014-03-27

Applicant: Molex, LLC

Inventor： Toshihiro Niitsu ,  Motohisa Haga

IPC: H01R13/62 ,  H01R12/52 ,  H01R12/79 ,  H05K1/11 ,  H05K3/36 ,  H05K3/32 ,  H05K3/40

CPC classification number: H01R12/523 ,  H01R12/79 ,  H05K1/117 ,  H05K3/326 ,  H05K3/365 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/0367 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09863 ,  H05K2201/10303 ,  H05K2201/10386

Abstract: A connector for a multilayered board to connect a flat cable to a middle layer of a multilayered board while minimizing the impact due to variations in the dimensional precision and strength of multilayered boards and/or preventing deformation of the multilayered board and improving contact stability. The connector includes a board-side connecting portion and a cable-side connecting portion. The board-side connecting portion includes a column-shaped terminal, and the cable-side connecting portion includes flat terminals. The column-shaped terminal protrudes from the middle layer of the multilayered board in the thickness direction. The flat terminals include resilient contact portions, contacting a side surface portion of the column-shaped terminal from the width direction of the insertion slot in response to insertion of the cable-side connecting portion into the insertion slot.

Abstract translation: 一种用于多层板的连接器，用于将扁平电缆连接到多层板的中间层，同时最小化由于多层板的尺寸精度和强度的变化引起的冲击和/或防止多层板的变形并提高接触稳定性。 连接器包括板侧连接部和电缆侧连接部。 板侧连接部包括柱状端子，电缆侧连接部包括扁平端子。 柱状端子在厚度方向从多层板的中间层突出。 扁平端子包括弹性接触部分，其响应于电缆侧连接部分插入到插槽中而从插入槽的宽度方向接触到柱状端子的侧表面部分。

公开(公告)号：US09049793B2

公开(公告)日：2015-06-02

申请号：US13876670

申请日：2011-09-30

Applicant: Yoshitaka Yoshida ,  Hiroaki Yamamoto

Inventor： Yoshitaka Yoshida ,  Hiroaki Yamamoto

IPC: H01K1/02 ,  H05K1/03 ,  H05K3/00 ,  B32B3/30

CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

Abstract: A multi-piece-array formed by laminating a plurality of ceramic layers includes: a product region where a plurality of wiring board portions having a rectangular shape in plan view and including cavities are arranged in matrix; a redundant portion that is positioned along a periphery of the product region; and dividing grooves that are formed on a front surface and/or a back surface along a boundary between the wiring board portions and a boundary between the wiring board portion and the redundant portion. A deepest portion of the dividing groove has an arc shape and the dividing groove includes a middle portion, and a width of the deepest portion is greater than a width of the groove inlet and a width of the middle portion is equal to or less than the width of the groove inlet.

Abstract translation: 通过层叠多个陶瓷层而形成的多片阵列包括：在平面图中具有矩形形状并且包括空腔的多个布线板部分以矩阵布置的产品区域; 沿着产品区域的周边定位的冗余部分; 以及沿着布线板部分之间的边界和布线板部分和冗余部分之间的边界形成在前表面和/或后表面上的划分凹槽。 分隔槽的最深部分具有弧形，分隔槽包括中间部分，并且最深部分的宽度大于沟槽入口的宽度，并且中间部分的宽度等于或小于 槽入口宽度。

公开(公告)号：US20140239768A1

公开(公告)日：2014-08-28

申请号：US13779210

申请日：2013-02-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： PETER B. JOHNSON ,  IRA OAKTREE WYGANT

IPC: H02N1/00 ,  H04R19/00

CPC classification number: B06B1/0292 ,  B06B2201/76 ,  B81B7/007 ,  B81B2203/0127 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2203/036 ,  H02N1/006 ,  H04R19/005 ,  H05K2201/09845 ,  H05K2201/09863

Abstract: A Capacitive Micromachined Ultrasonic Transducer (CMUT) device includes at least one CMUT cell including a first substrate of a single crystal material having a top side including a patterned dielectric layer thereon including a thick and a thin dielectric region, and a through-substrate via (TSV) extending a full thickness of the first substrate. The TSV is formed of the single crystal material, is electrically isolated by isolation regions in the single crystal material, and is positioned under a top side contact area of the first substrate. A membrane layer is bonded to the thick dielectric region and over the thin dielectric region to provide a movable membrane over a micro-electro-mechanical system (MEMS) cavity. A metal layer is over the top side substrate contact area and over the movable membrane including coupling of the top side substrate contact area to the movable membrane.

Abstract translation: 电容式微加工超声波传感器（CMUT）装置包括至少一个CMUT单元，其包括单晶材料的第一基板，其具有包括厚和薄的电介质区域的在其上的图案化电介质层的顶侧，以及贯穿基板通孔 TSV）延伸第一基板的整个厚度。 TSV由单晶材料形成，通过单晶材料中的隔离区电隔离，并且位于第一基板的顶侧接触区域的下方。 膜层结合到厚电介质区域和薄介电区域上，以在微机电系统（MEMS）腔体上提供可移动膜。 金属层在顶侧基板接触区域上方并且在可移动膜上方，包括顶侧基板接触区域与可动膜的耦合。

公开(公告)号：US20140041923A1

公开(公告)日：2014-02-13

申请号：US13779944

申请日：2013-02-28

Applicant: IBIDEN CO., LTD.

Inventor： Teruyoshi HISADA ,  Takashi Nakane

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0554

Abstract: A wiring board includes a board including a core, a conductive layer on the core, and a laminated structure over the core and conductive layer, and a stacked structure formed in the board and including a through-hole conductor through the core and a via conductor in the laminated structure. The through-hole conductor has though-hole portion through the core and land portion on the core, the laminated structure includes an insulation layer in which the via conductor is formed, the via conductor is stacked on the land portion such that the stacked structure including the through-hole and via conductors is formed through the core and the insulation layer, and the stacked structure is formed such that the through-hole portion has end connected to the land portion and the end has width set greater than width of bottom of the via conductor and smaller than width of top of the via conductor.

Abstract translation: 布线基板包括：基板，其包括芯，芯上的导电层，以及芯和导电层之上的叠层结构;以及层叠结构，形成在所述基板上，并且包括通过所述芯的通孔导体和通孔导体 在层压结构中。 通孔导体具有穿过芯部的芯部和芯部的平台部分的通孔部分，该层压结构包括其中形成通孔导体的绝缘层，通孔导体堆叠在焊盘部分上，使得堆叠结构包括 通孔和通孔导体通过芯和绝缘层形成，并且层叠结构形成为使得通孔部分具有端部连接到接合部分，并且端部的宽度设定为大于底部的宽度 通孔导体并小于通孔导体顶部的宽度。

公开(公告)号：US08181341B2

公开(公告)日：2012-05-22

申请号：US12488638

申请日：2009-06-22

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC: H01K3/10

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings.

Abstract translation: 一种形成电路板的方法，其包括用二氧化碳激光器产生激光并通过用激光照射绝缘基板使绝缘基板形成孔。 所述孔包括在所述绝缘基板的上表面中的顶部开口，所述绝缘基板的底表面中的底部开口以及沿着所述绝缘基板的厚度方向从所述顶部开口延伸到所述底部开口的内壁， 内壁包括在大致正交于厚度方向的方向上延伸的凸起。 通过在孔中提供金属使得金属沿着内壁从顶部开口延伸到底部开口，并且完全封闭每个顶部和底部开口，在绝缘基板中形成通孔。

公开(公告)号：US07973249B2

公开(公告)日：2011-07-05

申请号：US12713249

申请日：2010-02-26

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: A multilayer printed wiring board including insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.

Abstract translation: 包括彼此交替堆叠的绝缘层和导体层的多层印刷线路板。 导体层通过形成在绝缘层中的通孔彼此电连接。 每个通孔形成为沿与绝缘层的厚度方向大致正交的方向凸出。 该多层印刷线路板具有安装在其表面层上的诸如电容器，IC等的电子部件。

公开(公告)号：US20110114372A1

公开(公告)日：2011-05-19

申请号：US12904334

申请日：2010-10-14

Applicant: Hisashi KATO ,  Ryo AOKI

Inventor： Hisashi KATO ,  Ryo AOKI

IPC: H05K1/03

CPC classification number: H05K1/115 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/4602 ,  H05K2201/0112 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0315

Abstract: A printed wiring board has an insulation layer having upper and lower surfaces, an upper-surface circuit formed on the upper surface of the insulation layer, a resin insulation layer formed on the upper surface of the insulation layer and the upper-surface circuit and having a via-conductor opening through the resin insulation layer, a conductive circuit formed on the resin insulation layer, and a via conductor formed in the opening. The resin insulation layer has first and second surfaces. The second surface of the resin insulation layer faces the upper surface of the insulation layer. The conductive circuit is formed on the first surface of the resin insulation layer. The via conductor is connecting the conductive circuit and the upper-surface circuit. The opening has an inner wall which has a diameter decreasing from the second surface of the resin insulation layer toward the first surface of the resin insulation layer.

Abstract translation: 印刷电路板具有具有上表面和下表面的绝缘层，形成在绝缘层的上表面上的上表面电路，形成在绝缘层的上表面上的树脂绝缘层和上表面电路，并且具有 通过树脂绝缘层的通路导体开口，形成在树脂绝缘层上的导电电路和形成在开口中的通孔导体。 树脂绝缘层具有第一表面和第二表面。 树脂绝缘层的第二表面面向绝缘层的上表面。 导电电路形成在树脂绝缘层的第一表面上。 通孔导体连接导电电路和上表面电路。 该开口具有从树脂绝缘层的第二表面向树脂绝缘层的第一表面减小直径的内壁。

公开(公告)号：US20110051386A1

公开(公告)日：2011-03-03

申请号：US12745223

申请日：2008-11-28

Applicant: Tadashi Nagasawa ,  Katsura Hayashi

Inventor： Tadashi Nagasawa ,  Katsura Hayashi

IPC: H05K7/02 ,  H05K1/11 ,  H05K3/10

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/421 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/09845 ,  H05K2201/09863 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A circuit board (2) includes an insulation layer (7) where a via conductor (10) is embedded. The via conductor (10) includes: a first conductor portion (10a) having an lower portion narrower than an upper portion; and a second conductor portion (10b) which is formed immediately below the first conductor portion (10a), connected to the first conductor portion (10a), and has a maximum width greater than the upper end width of the first conductor portion (10a). The insulation layer (7) has a plurality of indentations (T1a, T1b) on the surface in contact with the via conductor (10). Convex portions (T2a, T2b) of the via conductor are arranged in the indentations (T1a, T1b).

Abstract translation: 电路板（2）包括嵌入通孔导体（10）的绝缘层（7）。 通孔导体（10）包括：第一导体部分（10a），其具有比上部更窄的下部; 和形成在第一导体部分（10a）正下方的第二导体部分（10b），其连接到第一导体部分（10a），并且具有大于第一导体部分（10a）的上端宽度的最大宽度， 。 绝缘层（7）在与通孔导体（10）接触的表面上具有多个凹口（T1a，T1b）。 通孔导体的凸部（T2a，T2b）布置在凹陷（T1a，T1b）中。

公开(公告)号：US07832098B2

公开(公告)日：2010-11-16

申请号：US12098582

申请日：2008-04-07

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01K3/10

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。