公开(公告)号：WO2013136895A1

公开(公告)日：2013-09-19

申请号：PCT/JP2013/053292

申请日：2013-02-12

Applicant: 富士電機株式会社

Inventor： 中村　瑶子 ,  梨子田　典弘

IPC: H01L23/12 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/36 ,  H01L25/07 ,  H01L25/18

CPC classification number: H05K1/0296 ,  H01L21/56 ,  H01L21/563 ,  H01L23/12 ,  H01L23/28 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/01 ,  H01L25/072 ,  H01L31/048 ,  H01L33/52 ,  H01L33/56 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/115 ,  H05K1/185 ,  H05K2201/09609 ,  H05K2201/09727 ,  H05K2201/098 ,  H01L2924/00

Abstract: 　封止樹脂の密着性を保持し、モジュールの信頼性等を向上させることができる樹脂封止型の半導体装置を提供する。　導電パターン付絶縁基板１と、導電パターン付絶縁基板１の導電パターン２ａ，２ｂ上に固着された導電ブロック３ａ，３ｂと、導電ブロック上に固着された半導体チップ６と、半導体チップ上に固着された導電ポスト８を備えるプリント基板９と、これらを封止する樹脂１１とを備えている半導体装置である。導電ブロックが固着した箇所の周囲の導電パターンの単位面積あたりの平均の導電膜の体積を、導電ブロックから外に向って減少するようにした。

Abstract translation: 提供一种树脂密封半导体器件，其能够保持密封树脂的密合性并提高模块的可靠性。 该半导体器件具有导电图案（1）的绝缘基板，固定在绝缘基板（1）的导电图案（2a，2b）上的导电块（3a，3b），固定在绝缘基板 导电块，具有固定在半导体芯片上的导电柱（8）的印刷基板（9）和密封它们的树脂（11）。 在导电块固定的位置附近的导电图案的每单位表面积的导电膜的平均体积从导电块向外减少。

公开(公告)号：WO2012014648A1

公开(公告)日：2012-02-02

申请号：PCT/JP2011/065545

申请日：2011-07-07

Applicant: 三洋電機株式会社 ,  野口 仁志 ,  江崎 賢一

Inventor： 野口　仁志 ,  江崎　賢一

IPC: H01G4/12 ,  H01G4/18 ,  H01G4/33 ,  H05K1/16 ,  H05K3/46

CPC classification number: H01G4/232 ,  H01G4/12 ,  H01G4/18 ,  H01G4/33 ,  H05K1/162 ,  H05K2201/09609 ,  H05K2201/09763 ,  H05K2203/0338 ,  Y10T29/435

Abstract: 基板内蔵用キャパシタは、所定方向に延びた第１電極と、前記第１電極に設けられた誘電体層と、前記誘電体層に設けられて、この誘電体層を介して前記第１電極と対向するとともに、前記誘電体層から前記所定方向において突出する端部を有する第２電極と、前記所定方向において前記第１電極から間隔を空けて設けられた電極層とを備え、前記所定方向における前記第２電極の端部が前記電極層に接続されるとともに、前記電極層の表面が、前記第１電極の表面と同一平面上に位置するように設けられていることを特徴とする。

Abstract translation: 公开的衬底嵌入式电容器的特征在于具有：沿预定方向延伸的第一电极; 提供给上述第一电极的电介质层; 设置在上述电介质层上的第二电极面对上述第一电极，其间具有电介质层，并且具有从上述电介质层沿上述预定方向突出的端部; 以及设置在上述预定方向上与上述第一电极间隔开的电极层。 衬底嵌入式电容器的特征还在于上述第二电极的上述预定方向的端部与上述电极层连接，上述电极层的表面设置成位于 与上述第一电极的表面相同的平面。

公开(公告)号：WO2011106091A3

公开(公告)日：2012-01-05

申请号：PCT/US2011000338

申请日：2011-02-24

Applicant: R & D CIRCUITS INC ,  RUSSELL JAMES V

Inventor： RUSSELL JAMES V

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0222 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/4069 ,  H05K3/42 ,  H05K2201/0187 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09727 ,  H05K2201/09809 ,  Y10T29/49124 ,  Y10T29/49165

Abstract: A method and a structure for a coaxial via that extend along the entire length of a signal via in a printed circuit board. Signal integrity is improved by providing ground shield for the entire length of the coaxial via. The ground shielding can be implemented by either providing ground cage vias around a signal via and routing a trace to the signal via on a built up layer or by providing a semi circle ground trench through a build up layer to permit a trace access to the signal via.

Abstract translation: 一种用于沿着印刷电路板中的信号通道的整个长度延伸的同轴通孔的方法和结构。 通过为同轴通孔的整个长度提供接地屏蔽来改善信号完整性。 接地屏蔽可以通过在信号通孔周围提供接地保持架通孔，并将迹线路由到建立层上的信号通道或者通过建立层提供半圆接地沟槽来实现，以允许对信号进行跟踪访问 通过。

公开(公告)号：WO2008137335A2

公开(公告)日：2008-11-13

申请号：PCT/US2008/061444

申请日：2008-04-24

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY ,  TIEDEMANN, Larry, E. ,  HENKE, Reinhold ,  HENTGES, James, P. ,  MCCLUSKEY, Dean, R. ,  NESS, Keith, D. ,  PAPE, Robert, A.

Inventor： TIEDEMANN, Larry, E. ,  HENKE, Reinhold ,  HENTGES, James, P. ,  MCCLUSKEY, Dean, R. ,  NESS, Keith, D. ,  PAPE, Robert, A.

IPC: H05K7/20

CPC classification number: H05K7/20 ,  H05K1/0206 ,  H05K3/42 ,  H05K7/209 ,  H05K2201/09609 ,  H05K2201/09781 ,  H05K2201/10053

Abstract: A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion.

Abstract translation: 提供一种电源开关装置，其包括壳体，设置在壳体内的印刷电路板，以及安装到印刷电路板的多个电气部件，包括至少一个继电器。 至少一对负载端子连接到继电器的相对侧上的印刷电路板，并且多个传热元件形成在印刷电路板中并且在印刷电路板中并且分散在靠近继电器的环绕负载端子处，并且 延伸到周边部分。

公开(公告)号：WO2005091941A3

公开(公告)日：2005-12-01

申请号：PCT/US2005006784

申请日：2005-03-01

Applicant: WEMTEC INC ,  MCKINZIE WILLIAM E III

Inventor： MCKINZIE WILLIAM E III

IPC: H01P1/20 ,  H01P7/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16

CPC classification number: H01P1/20 ,  H01P1/2005 ,  H05K1/0216 ,  H05K1/0236 ,  H05K1/0239 ,  H05K1/115 ,  H05K1/162 ,  H05K2201/09609 ,  H05K2201/09672

Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Some embodiments of resonant via arrays are mechanically balanced, which promotes improved manufacturability. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.

Abstract translation: 教导系统和方法阻止平行板波导（PPW）结构中电磁波的传播。 谐振通孔的周期性阵列用于在PPW中产生宽带高频阻带，同时允许DC和低频波传播。 谐振通孔阵列的一些实施例是机械平衡的，这促进了改进的可制造性。 重要的应用包括诸如电路板，陶瓷模块和半导体芯片的分层电子设备中的电磁降噪。

公开(公告)号：WO2005089076A2

公开(公告)日：2005-09-29

申请号：PCT/KR2005/000791

申请日：2005-03-18

Applicant: JU, Sung, Suk

Inventor： JU, Sung, Suk

IPC: H05K9/00 ,  H05K1/00 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H05K1/0393 ,  H05K2201/09609

Abstract: A film type conductive sheet made of synthetic resin having horizontal and vertical directional conductivities, capable of preventing burrs causing electric short-circuits, and having a narrow thickness while maintaining the horizontal and vertical directional conductivities is disclosed. The film type conductive sheet includes a synthetic resin master film having a plurality of penetrating holes, and metals or metal pastes coated to the upper and lower sides of the synthetic resin master film such that the metals are connected to each other through the penetrating holes, enabling vertical conduction and horizontal conduction thereof. Since burrs are not generated when cutting and using the film type conductive sheet, and applying the same to equipment so that electronic equipment malfunction due to interference between circuits is prevented. Since a very thin film type conductive sheet can be made, the film type conductive sheet is applicable to wide range of applications.

Abstract translation: 公开了一种由具有水平和垂直方向导电性的合成树脂制成的薄膜型导电片，其能够防止毛刺引起电气短路，并且具有窄的厚度，同时保持水平和垂直方向导电性。 膜型导电片包括具有多个穿透孔的合成树脂母膜，以及涂覆在合成树脂母膜的上侧和下侧的金属或金属膏，使得金属通过穿透孔相互连接， 使其能够垂直传导和水平传导。 由于在切割和使用薄膜型导电薄片时不会产生毛刺，并且将其施加到设备上，从而防止由于电路之间的干扰导致的电子设备故障。 由于可以制造非常薄的膜型导电片，所以膜型导电片可以应用于广泛的应用。

公开(公告)号：WO01058229A1

公开(公告)日：2001-08-09

申请号：PCT/JP2001/000778

申请日：2001-02-02

IPC: H01G4/33 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4611 ,  H05K2201/0959 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827

Abstract: A capacitor structure of a wiring board having large capacitance per unit area is disclosed. A first pattern (3) is formed on the upper side of an insulator layer (2), and a second pattern (4) is formed on the lower side. In the insulator layer (2), first vias (5) and second vias (6) are formed, and the wall surfaces of the first vias (5) and the second vias (6) are plated. The first pattern (3) with first vias are lands while the second pattern (4) with first vias are blanks. The second pattern (4) with second vias (6) lands while the first pattern (3) with second vias (6) blank.

Abstract translation: 公开了具有每单位面积的大电容的布线基板的电容器结构。 第一图案（3）形成在绝缘体层（2）的上侧，并且在下侧形成第二图案（4）。 在绝缘体层（2）中，形成第一通孔（5）和第二通孔（6），并且第一通孔（5）和第二通孔（6）的壁表面被电镀。 具有第一通孔的第一图案（3）是平台，而具有第一通孔的第二图案（4）是空格。 具有第二通路（6）的第二图案（4）着陆，而具有第二通孔（6）的第一图案（3）为空白。

公开(公告)号：WO00003567A1

公开(公告)日：2000-01-20

申请号：PCT/GB1999/002180

申请日：1999-07-08

IPC: H05K1/05 ,  H01L23/373 ,  H05K3/44 ,  H05K3/46

CPC classification number: H01L23/373 ,  H01L23/3732 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/445 ,  H05K3/4644 ,  H05K2201/0323 ,  H05K2201/09609 ,  Y10S428/901 ,  Y10T428/12347 ,  Y10T428/30 ,  H01L2924/00

Abstract: A thermal management device (13) comprising anisotropic carbon (10) encapsulated in an encapsulating material (12) that improves the strength of the carbon. The encapsulating material may be polyimide or epoxy resin or acrylic or polyurethane or polyester (12) or any other suitable polymer.

Abstract translation: 包括封装在包封材料（12）中的各向异性碳（10）的热管理装置（13），其改善了碳的强度。 封装材料可以是聚酰亚胺或环氧树脂或丙烯酸或聚氨酯或聚酯（12）或任何其它合适的聚合物。

公开(公告)号：WO9857226A3

公开(公告)日：1999-03-04

申请号：PCT/NL9800341

申请日：1998-06-12

Applicant: ZETFOLIE B V ,  RUITER JACOBUS CHRISTIAAN GERA ,  TERLOUW ERIK MAARTEN ,  HADZIIOANNOU GEORGES ,  BROUWER HENDRIK JAN

Inventor： RUITER JACOBUS CHRISTIAAN GERA ,  TERLOUW ERIK MAARTEN ,  HADZIIOANNOU GEORGES ,  BROUWER HENDRIK-JAN

IPC: G02F1/136 ,  G02F1/1333 ,  G02F1/1343 ,  G02F1/1345 ,  G02F1/135 ,  G02F1/1362 ,  H01B1/22 ,  H05K1/00 ,  H05K3/10 ,  H05K3/40 ,  H01B1/20

CPC classification number: H05K3/4038 ,  G02F1/1333 ,  G02F1/1345 ,  G02F1/135 ,  G02F1/1362 ,  H01B1/22 ,  H05K1/0287 ,  H05K3/105 ,  H05K2201/09609 ,  H05K2203/105

Abstract: Substrate (7; 7'; 10) and devices including such a substrate, the substrate having a first surface and a second surface extending substantially in parallel to the first surface, the substrate being of a material of a first conductivity and provided with a plurality of electrically conducting channels (21) which are extending exclusively in a direction perpendicular to the first and second surfaces, said channels having a second conductivity substantially larger than the first conductivity, the substrate being provided with at least one electrode (42) on either one of the first and second surfaces, contacting at least one of said channels, the at least one electrode (42) having a predetermined minimum dimension (D) in a contact area (A) with the substrate, and mutual distances between adjacent ones of the plurality of channels (21) being smaller than said minimum dimension of said at least one electrode (42).

公开(公告)号：WO1993026144A1

公开(公告)日：1993-12-23

申请号：PCT/CH1993000147

申请日：1993-06-10

Applicant: DYCONEX PATENTE AG ,  SCHMIDT, Walter ,  MARTINELLI, Marco

Inventor： DYCONEX PATENTE AG

IPC: H05K03/40

CPC classification number: H05K3/4084 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: The process for producing subsequently contactable contact points between two conductive track planes on a circuit substrate separated by an electrically insulating layer makes it possible to produce, for example, a basic conductor pattern which can subsequently be easily adapted to requirements. By laying windows in the conductive track planes out in such a way that, when the electrically insulating layer is subsequently through-etched due to under-etching, rod-like parts connected to the aperture periphery are revealed between or in the apertures which can be brought into contact with electrically conductive parts of the other conductive track plane, these conductive tracks can be electrically interconnected by mechanical bending.