Abstract:
An opening is made in a resin (20) with a laser to form a viahole. A copper foil (22) etched into a thin film (3 νm) to lower the heat conductivity is used as a conformal mask, thereby making an opening (20a) in the resin (20) by fewer times of irradiation with a pulse laser beam. This prevents formation of any undercut in the resin (20) on which an interlayer resin-insulating layer is to be formed, enabling improvement in the connection reliability of the viahole.
Abstract:
A method of manufacturing a multi layered printed circuit board incorporating a substrate (230) on which a lower conductive circuit (234) is formed, an insulating resin layer (250) and an upper conductive circuit (258) formed on the lower conductive circuit (234) and having a structure that the lower conductive circuit (234) and the upper conductive circuit (258) are connected to each other through a via hole (260), the method of manufacturing a multilayered printed circuit board comprising the steps of: forming the lower conductive circuit (234) on the substrate (230); forming the insulating resin layer (250) on the lower conductive circuit; previously forming a coarsened surface (250a) on the surface of the insulating resin layer (250); forming, on the coarsened surface (250a), a metal layer (251) having an opening (251a) through which a portion of the coarsened surface (250a) is exposed; irradiating the coarsened surface (250a) exposed through the opening (251a) with a laser beam to remove the insulating resin layer to form an opening (248) for the via hole; and forming the upper conductive circuit (258) and the via hole (260).
Abstract:
A method of manufacturing a multi layered printed circuit board incorporating a substrate (230) on which a lower conductive circuit (234) is formed, an insulating resin layer (250) and an upper conductive circuit (258) formed on the lower conductive circuit (234) and having a structure that the lower conductive circuit (234) and the upper conductive circuit (258) are connected to each other through a via hole (260), the method of manufacturing a multilayered printed circuit board comprising the steps of: forming the lower conductive circuit (234) on the substrate (230); forming the insulating resin layer (250) on the lower conductive circuit; previously forming a coarsened surface (250a) on the surface of the insulating resin layer (250); forming, on the coarsened surface (250a), a metal layer (251) having an opening (251a) through which a portion of the coarsened surface (250a) is exposed; irradiating the coarsened surface (250a) exposed through the opening (251a) with a laser beam to remove the insulating resin layer to form an opening (248) for the via hole; and forming the upper conductive circuit (258) and the via hole (260).
Abstract:
A method of manufacturing a printed wiring board (210) comprising at least two insulating layers (211,212,213) made of a synthetic resin, an innerlayer conductor circuit (221-225) arranged between the insulating layers, and a plurality of blind via- holes (3A-3E) formed from an outermost surface toward the innerlayer conductor circuit (221-225) and having different depths by successively irradiating a laser beam every a portion forming the blind via-hole (3A-3E), characterized in that a shallowest blind via-hole (3A-3E) is formed as a standard hole by using a standard laser beam (242) having an energy strength required for the formation of the standard hole, and the standard laser beam (242) is irradiated plural times in the formation of the blind via-holes having deeper depths (3B,3D,3E).
Abstract:
A printed wiring board (501) comprising two or more insulating layers (516,518) on an innerlayer conductor circuit (562), a via-hole (502) extending from an outermost surface of the insulating layer (516) through the two or more insulating layers (516,518) to the innerlayer conductor circuit (562) and an inner metal plated film (521) formed in the via-hole (502) so as to electrically connect to the innerlayer conductor circuit (562) to an outer conductor circuit (561) arranged on the outermost surface, characterized in that an annular dummy land (504) for reinforcement having an opening hole (540) around the via-hole (502) is arranged in a boundary portion (517) facing the two or more insulating layers (516,518) to each other and is joined to the inner metal plated film (521).
Abstract:
When a printed wiring board which has inner layer conductor circuits (161 and 131) between insulating layers (101 - 103) and blind via-holes (141 and 142) made from the top surface of the insulating layer to the inner layer conductor circuits is manufactured, a hole (160) is provided beforehand in the center part of the inner layer conductor circuits (161) at the bottom of the blind via-hole (141), and a laser beam is applied from the top surface side of the insulating layer to form the blind via-holes (141 and 142). After that, metal plating films are formed on the surfaces of the inner layer conductor circuits (131 and 161) and the blind via-holes (141 and 142).
Abstract:
A wiring board construction (10) includes at least one microvia (12) disposed in a base substrate (14) and includes a deep imprinted cup shaped in the top surface thereof (24). A conductor material is disposed within the recess (26), and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion (31) helps to complete an electrically conductive path through the substrate.