公开(公告)号：EP1858308A4

公开(公告)日：2010-03-31

申请号：EP06781090

申请日：2006-07-07

Applicant: IBIDEN CO LTD

Inventor： TAKAHASHI MICHIMASA ,  MIKADO YUKINOBU ,  NAKAMURA TAKENOBU ,  AOYAMA MASAKAZU

IPC: H05K3/46

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

公开(公告)号：EP1220589B1

公开(公告)日：2008-07-30

申请号：EP01130820.2

申请日：2001-12-24

Applicant: Denso Corporation

Inventor： Yazaki, Yoshitarou ,  Yokochi, Tomohiro ,  Kondo, Koji ,  Harada, Toshikazu ,  Shiraishi, Yoshihiko

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T428/24917

公开(公告)号：EP1121008B1

公开(公告)日：2008-07-30

申请号：EP99933214.1

申请日：1999-07-30

Applicant: IBIDEN CO., LTD.

Inventor： HIROSE, Naohiro ,  NODA, Kouta ,  SEGAWA, Hiroshi ,  EN, Honjin ,  TSUKADA, Kiyotaka ,  ISHIDA, Naoto ,  ASANO, Kouji ,  SHOUDA, Atsushi

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is made in a resin (20) with a laser to form a viahole. A copper foil (22) etched into a thin film (3 νm) to lower the heat conductivity is used as a conformal mask, thereby making an opening (20a) in the resin (20) by fewer times of irradiation with a pulse laser beam. This prevents formation of any undercut in the resin (20) on which an interlayer resin-insulating layer is to be formed, enabling improvement in the connection reliability of the viahole.

Abstract translation: 利用激光在树脂（20）中形成开口以形成通孔。 蚀刻成薄膜（3νm）以降低热导率的铜箔（22）用作共形掩模，由此通过用脉冲激光束照射较少次数来在树脂（20）中形成开口（20a） 。 这防止了在要形成层间树脂绝缘层的树脂20中形成任何底切，从而改善了通孔的连接可靠性。

公开(公告)号：EP1843649A3

公开(公告)日：2007-10-31

申请号：EP07013523.1

申请日：1999-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Hirose , Nachiro c/o Ogaki-kita-kojou, Ibiden Kabushiki Kaisha ,  Noda, Kouta c/o Ogaki-kita-kojou,Ibiden Kabushiki Kaisha, ,  Segawa, Hiroshi c/o Ogaki-kita-kojou, Ibiden Kabushiki Kaisha, ,  En ,Honjin c/o Ogaki-kita-kojou, Ibiden Kabushiki Kaisha, ,  Tsukada, Kiyotaka c/o Gama-kojou, Ibiden Kabushiki Kaisha, ,  Ishida, Naoto c/o Gama-kojou, Ibiden Kabushiki Kaisha, ,  Asano, Kouji c/o Gama-kojou, Ibiden Kabushiki Kaisha, ,  Shouda, Atsushi c/o Gama-kojou, Ibiden Kabushiki Kaisha,

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a multi layered printed circuit board incorporating a substrate (230) on which a lower conductive circuit (234) is formed, an insulating resin layer (250) and an upper conductive circuit (258) formed on the lower conductive circuit (234) and having a structure that the lower conductive circuit (234) and the upper conductive circuit (258) are connected to each other through a via hole (260), the method of manufacturing a multilayered printed circuit board comprising the steps of:
forming the lower conductive circuit (234) on the substrate (230); forming the insulating resin layer (250) on the lower conductive circuit; previously forming a coarsened surface (250a) on the surface of the insulating resin layer (250); forming, on the coarsened surface (250a), a metal layer (251) having an opening (251a) through which a portion of the coarsened surface (250a) is exposed; irradiating the coarsened surface (250a) exposed through the opening (251a) with a laser beam to remove the insulating resin layer to form an opening (248) for the via hole; and forming the upper conductive circuit (258) and the via hole (260).

Abstract translation: 一种多层印刷电路板，包括：形成有导电电路（334）的基板（330） 形成在导电电路（334）上的层间绝缘树脂层（350） 用于形成在所述层间绝缘树脂层（350）中形成的通孔（360）的开口（348）; 以及包括通孔（360）并形成在所述层间绝缘树脂层（350）上的另一个导电电路（358），其中，所述导电电路（334）的表面使用含有铜络合物和有机物的蚀刻溶液进行粗化处理 在用于形成通孔（360）的开口（348）的内壁上形成有酸和条状凹坑和突起。

公开(公告)号：EP1843649A2

公开(公告)日：2007-10-10

申请号：EP07013523.1

申请日：1999-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Hirose , Nachiro c/o Ogaki-kita-kojou, Ibiden Kabushiki Kaisha ,  Noda, Kouta c/o Ogaki-kita-kojou,Ibiden Kabushiki Kaisha, ,  Segawa, Hiroshi c/o Ogaki-kita-kojou, Ibiden Kabushiki Kaisha, ,  En ,Honjin c/o Ogaki-kita-kojou, Ibiden Kabushiki Kaisha, ,  Tsukada, Kiyotaka c/o Gama-kojou, Ibiden Kabushiki Kaisha, ,  Ishida, Naoto c/o Gama-kojou, Ibiden Kabushiki Kaisha, ,  Asano, Kouji c/o Gama-kojou, Ibiden Kabushiki Kaisha, ,  Shouda, Atsushi c/o Gama-kojou, Ibiden Kabushiki Kaisha,

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a multi layered printed circuit board incorporating a substrate (230) on which a lower conductive circuit (234) is formed, an insulating resin layer (250) and an upper conductive circuit (258) formed on the lower conductive circuit (234) and having a structure that the lower conductive circuit (234) and the upper conductive circuit (258) are connected to each other through a via hole (260), the method of manufacturing a multilayered printed circuit board comprising the steps of:
forming the lower conductive circuit (234) on the substrate (230); forming the insulating resin layer (250) on the lower conductive circuit; previously forming a coarsened surface (250a) on the surface of the insulating resin layer (250); forming, on the coarsened surface (250a), a metal layer (251) having an opening (251a) through which a portion of the coarsened surface (250a) is exposed; irradiating the coarsened surface (250a) exposed through the opening (251a) with a laser beam to remove the insulating resin layer to form an opening (248) for the via hole; and forming the upper conductive circuit (258) and the via hole (260).

Abstract translation: 一种制造多层印刷电路板的方法，所述多层印刷电路板结合其上形成有下导电电路（234）的基板（230），形成在下导电电路（234）上的绝缘树脂层（250）和上导电电路（258） 所述多层印刷电路板的制造方法包括以下步骤：形成下层导电电路（234）和上层导电电路（258），所述下层导电电路（234）和所述上层导电电路（258）通过通孔（260） 衬底（230）上的下导电电路（234）; 在下导电电路上形成绝缘树脂层（250）; 预先在绝缘树脂层（250）的表面上形成粗化表面（250a）; 在所述粗化表面（250a）上形成具有开口（251a）的金属层（251），所述粗化表面（250a）的一部分通过所述开口暴露; 用激光束照射通过开口（251a）暴露的粗化表面（250a）以去除绝缘树脂层以形成通孔的开口（248）; 并形成上导电电路（258）和通孔（260）。

公开(公告)号：EP1827069A3

公开(公告)日：2007-10-03

申请号：EP07075315.7

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru, c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka, c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki, c/o Ibiden Co., Ltd. ,  Minoura, Hisashi, c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu, c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro, c/o Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A method of manufacturing a printed wiring board (210) comprising at least two insulating layers (211,212,213) made of a synthetic resin, an innerlayer conductor circuit (221-225) arranged between the insulating layers, and a plurality of blind via- holes (3A-3E) formed from an outermost surface toward the innerlayer conductor circuit (221-225) and having different depths by successively irradiating a laser beam every a portion forming the blind via-hole (3A-3E), characterized in that a shallowest blind via-hole (3A-3E) is formed as a standard hole by using a standard laser beam (242) having an energy strength required for the formation of the standard hole, and the standard laser beam (242) is irradiated plural times in the formation of the blind via-holes having deeper depths (3B,3D,3E).

Abstract translation: 一种制造包括至少两个由合成树脂制成的绝缘层（211,212,213）的印刷线路板（210）的方法，布置在绝缘层之间的内层导体电路（221-225）以及多个盲通孔（ 通过在形成盲通孔（3A-3E）的每个部分上连续照射激光束而从最外表面朝向内层导体电路（221-225）形成并且具有不同深度的多个通孔（3A-3E），其特征在于， 通过使用具有形成标准孔所需的能量强度的标准激光束（242）将通孔（3A-3E）形成为标准孔，并且标准激光束（242）被多次照射 形成深度更深的盲通孔（3B，3D，3E）。

公开(公告)号：EP1816905A3

公开(公告)日：2007-10-03

申请号：EP07075316.5

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru, c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka, c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki, c/o Ibiden Co., Ltd. ,  Minoura, Hisashi, c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu, c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro, c/o Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A printed wiring board (501) comprising two or more insulating layers (516,518) on an innerlayer conductor circuit (562), a via-hole (502) extending from an outermost surface of the insulating layer (516) through the two or more insulating layers (516,518) to the innerlayer conductor circuit (562) and an inner metal plated film (521) formed in the via-hole (502) so as to electrically connect to the innerlayer conductor circuit (562) to an outer conductor circuit (561) arranged on the outermost surface, characterized in that an annular dummy land (504) for reinforcement having an opening hole (540) around the via-hole (502) is arranged in a boundary portion (517) facing the two or more insulating layers (516,518) to each other and is joined to the inner metal plated film (521).

Abstract translation: 一种印刷电路板（501），包括位于内层导体电路（562）上的两个或更多个绝缘层（516,518），从绝缘层（516）的最外表面延伸穿过两个或更多个绝缘体 （562）的层（516,518）和形成在通孔（502）中的内部金属镀膜（521），以便将内层导体电路（562）电连接到外导体电路（561） ），其特征在于，在面向所述两个或更多个绝缘层（517）的边界部分（517）中布置用于加强的具有围绕所述通孔（502）的开口孔（540）的环形虚拟焊盘（504） （516,518）彼此接合并与内侧金属镀膜（521）接合。

公开(公告)号：EP0971570B1

公开(公告)日：2007-07-25

申请号：EP98901002.0

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： TAKADA, Masaru, Ibiden Co., Ltd. ,  TSUKADA, Kiyotaka, Ibiden Co., Ltd. ,  KOBAYASHI, Hiroyuki ,  MINOURA, Hisashi ,  UKAI, Yoshikazu ,  KONDO, Mitsuhiro

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: When a printed wiring board which has inner layer conductor circuits (161 and 131) between insulating layers (101 - 103) and blind via-holes (141 and 142) made from the top surface of the insulating layer to the inner layer conductor circuits is manufactured, a hole (160) is provided beforehand in the center part of the inner layer conductor circuits (161) at the bottom of the blind via-hole (141), and a laser beam is applied from the top surface side of the insulating layer to form the blind via-holes (141 and 142). After that, metal plating films are formed on the surfaces of the inner layer conductor circuits (131 and 161) and the blind via-holes (141 and 142).

Abstract translation: 当在绝缘层（101-103）之间具有内层导体电路（161和131）以及由绝缘层的顶面到内层导体电路制成的盲通孔（141和142）的印刷线路板是 在盲孔（141）的底部的内层导体电路（161）的中央部预先设置孔（160），从绝缘体的上表面侧照射激光 层以形成盲通孔（141和142）。 此后，在内层导体电路（131和161）和盲通孔（141和142）的表面上形成金属镀膜。

公开(公告)号：EP1019986A4

公开(公告)日：2003-03-26

申请号：EP98952161

申请日：1998-10-07

Applicant: DIMENSIONAL CIRCUITS CORP

Inventor： GREGOIRE GEORGE D

IPC: H01R12/55 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  H01R9/09

CPC classification number: H05K3/005 ,  H05K1/095 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/061 ,  H05K3/107 ,  H05K3/1241 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/041 ,  H05K2203/0746 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A wiring board construction (10) includes at least one microvia (12) disposed in a base substrate (14) and includes a deep imprinted cup shaped in the top surface thereof (24). A conductor material is disposed within the recess (26), and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion (31) helps to complete an electrically conductive path through the substrate.

Abstract translation: 布线板结构包括设置在基底基板中的至少一个微孔，并且包括形成在其顶表面中的深刻印刷杯。 导体材料设置在凹部内，并且具有设置在其底部的部分。 设置在与导体材料底部相对的基板的底表面处的导体有助于完成穿过基板的导电路径，以帮助完成穿过基板的导电路径。

公开(公告)号：WO2015053083A1

公开(公告)日：2015-04-16

申请号：PCT/JP2014/075256

申请日：2014-09-24

Applicant: 日立化成株式会社

Inventor： 吉田　信之

IPC: H05K3/40 ,  H05K3/00

CPC classification number: H05K3/4652 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/422 ,  H05K3/423 ,  H05K2201/0355 ,  H05K2201/0397 ,  H05K2201/09863 ,  H05K2201/2072 ,  H05K2203/1184 ,  H05K2203/1476

Abstract: 　コンフォーマル工法又はダイレクトレーザ工法を用いて、上層配線用の金属箔から内層配線に到るビアホール用穴と、このビアホール用穴の開口部に形成される上層配線用の金属箔の飛び出しと、この金属箔の飛び出しと前記ビアホール用穴の内壁との間に形成される下方空間と、を設ける工程（１）と、前記ビアホール用穴内及び上層配線用の金属箔上に電解フィルドめっき層を形成することによって前記ビアホール用穴を穴埋めする工程（２）と、を有し、前記工程（２）における、電解フィルドめっき層の形成によるビアホール用穴の穴埋めが、電解フィルドめっきの電流密度を電解フィルドめっきの途中で一旦低下させ、再び増加させて行われる多層配線基板の製造方法。

Abstract translation: 一种制造多层布线基板的方法，具有：步骤（1），其使用保形法或直接激光法形成从用于形成上层布线的金属箔延伸到内层布线的通孔的开口 用于形成在用于通孔的开口的开口部分中的上层布线的金属箔的突出部分和形成在金属箔的突出部分和开口的内壁之间的下部空间， 通孔; 以及用于在用于通孔的开口中形成电解填料镀层和用于上层布线的金属箔上填充通孔的开口的步骤（2）。 通过在步骤（2）期间形成电解填料镀层来填充通孔的开口是通过首先降低电解填料电镀期间的电解填料电镀的电流密度，然后提高电流密度来进行的。