公开(公告)号：KR1020090108371A

公开(公告)日：2009-10-15

申请号：KR1020080033757

申请日：2008-04-11

Applicant: 인싸이토(주)

Inventor： 남우성 ,  조신길 ,  정석

IPC: F15B21/00 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: B29C66/3022 ,  B01L3/502707 ,  B01L3/502746 ,  B01L2200/0689 ,  B01L2300/0825 ,  B01L2300/0887 ,  B01L2400/0406 ,  B29C65/02 ,  B29C65/08 ,  B29C65/1635 ,  B29C65/168 ,  B29C65/48 ,  B29C65/4895 ,  B29C65/8253 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/8322 ,  B29K2033/08 ,  B29K2033/12 ,  B29K2069/00 ,  B29L2031/756 ,  B81B3/0094 ,  B81B2201/0214 ,  B81B2201/051 ,  B81B2201/058 ,  B81B2203/0338 ,  B81B2203/0392 ,  B81C1/00103 ,  B81C2201/019 ,  B29K2083/00

Abstract: PURPOSE: A micro-fluidic circuit comprising a micro-fluidic channel with nano interstices and fabrication thereof are provided to have stable flow regardless of processes. CONSTITUTION: A micro-fluidic circuit comprises a micro-fluidic channel(5). A sample inlet and a sample outlet are formed on the top surface of the micro-fluidic circuit. Both edges of the micro-fluidic channel have a nano gap(4) lower a center part thereof.

Abstract translation: 目的：提供包含具有纳米空隙的微流体通道和其制造的微流体回路，以便与流程无关地具有稳定的流量。 构成：微流体回路包括微流体通道（5）。 样品入口和样品出口形成在微流体回路的顶表面上。 微流体通道的两个边缘具有在其中心部分下方的纳米间隙（4）。

公开(公告)号：KR1020080067797A

公开(公告)日：2008-07-22

申请号：KR1020070005147

申请日：2007-01-17

Applicant: 한양대학교 산학협력단

Inventor： 안유민 ,  조웅 ,  고용준 ,  주진경

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B3/0018 ,  B81B3/0035 ,  B81B7/008 ,  B81B2201/0214 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2201/06

Abstract: A thermo-pneumatic micro pump chip applicable to a micro bio chip and a manufacturing method thereof are provided to increase precision of flow control of a pump by bonding a poly dimethyl siloxane(PDMS) chip with a glass chip integrally. A thermo-pneumatic micro pump chip(100) that is applicable to a micro bio chip comprises a glass chip(10) and a PDMS chip(20) that are integrally bonded to each other. The glass chip is equipped with a heater(11) and a sensor. In addition, the PDMS chip is formed on an upper surface of the glass chip and moves fluid sample in a desired direction.

Abstract translation: 提供了适用于微生物芯片的热气动微型泵芯片及其制造方法，以通过将聚二甲基硅氧烷（PDMS）芯片与玻璃芯片整体结合来提高泵的流量控制精度。 适用于微生物芯片的热气动微型泵芯片（100）包括彼此一体地结合的玻璃芯片（10）和PDMS芯片（20）。 玻璃芯片配有加热器（11）和传感器。 此外，PDMS芯片形成在玻璃芯片的上表面上，并使流体样品沿期望的方向移动。

公开(公告)号：EP2223887B1

公开(公告)日：2018-09-12

申请号：EP10154557.2

申请日：2010-02-24

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Duraffourg, Laurent ,  Andreucci, Philippe ,  Ernst, Thomas ,  Hentz, Sébastien

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B2201/0214 ,  B81B2203/0109

公开(公告)号：EP3186678A4

公开(公告)日：2018-04-18

申请号：EP15835718

申请日：2015-08-28

Applicant: PANORAMA SYNERGY LTD

Inventor： DELL JOHN ,  FARAONE LORENZO ,  JEFFERY ROGER ,  KEATING ADRIAN ,  MARTYNIUK MARIUSZ ,  PUTRINO GINO ,  SILVA DILUSHA

IPC: G02F1/335 ,  B81B3/00 ,  B82Y20/00 ,  G01Q20/02 ,  G01Q70/06 ,  G02B6/122 ,  G02F1/01

CPC classification number: G01Q10/00 ,  B81B3/0029 ,  B81B2201/0214 ,  B81B2201/047 ,  B82Y20/00 ,  G01Q60/38 ,  G02B6/1225

Abstract: A method of stimulating a MicroElectroMechanical Systems (MEMS) structure (e.g. a cantilever), and an optical sensor for use in such a method, using optical radiation pressure instead of electrostatic pressure, or the like. An optical pulse creates optical radiation pressure which stimulates movement of the MEMS structure and then movement of the MEMS structure may be measures. An interrogating light may be input after the optical pulse to measure movement of the MEMS structure. Advantageously, the same light source can be utilised to stimulate movement of the MEMS structure and to measure movement of the MEMS structure.

公开(公告)号：EP2910306B1

公开(公告)日：2017-09-27

申请号：EP15154707.2

申请日：2015-02-11

Applicant: ARKRAY, Inc.

Inventor： Onuma, Naotsugu

IPC: B01L3/00 ,  B81C1/00 ,  B32B38/00 ,  B32B37/24

CPC classification number: G01N27/44791 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2300/0822 ,  B01L2300/0851 ,  B01L2300/16 ,  B01L2400/0421 ,  B29C65/08 ,  B29C65/18 ,  B29C66/026 ,  B29C66/1122 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/919 ,  B29C66/929 ,  B29C66/949 ,  B29L2031/756 ,  B32B37/12 ,  B32B38/0008 ,  B32B2037/243 ,  B32B2310/0481 ,  B81B2201/0214 ,  B81B2201/058 ,  B81C1/00206 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2027/06 ,  B29K2023/38 ,  B29K2071/00 ,  B29K2025/06 ,  B29K2027/18 ,  B29K2023/12 ,  B29K2023/06

Abstract: The present disclosure provides a method for manufacturing a chip that includes a microchannel (10). The method includes steps of: fixing a cationic polymer having a quaternary onium group on at least one surface of each of a pair of resin substrates (1,2); and joining the resin substrates together at the surfaces on which the cationic polymer has been fixed.

Abstract translation: 本公开提供了一种用于制造包括微通道（10）的芯片的方法。 该方法包括以下步骤：在一对树脂基材（1,2）中的每一个的至少一个表面上固定具有季鎓基团的阳离子聚合物; 并在其上固定有阳离子聚合物的表面处将树脂基底接合在一起。

公开(公告)号：EP3211409A1

公开(公告)日：2017-08-30

申请号：EP17154932.2

申请日：2017-02-07

Applicant: NXP USA, Inc.

Inventor： ZHANG, Qing ,  CHOUDHURI, Mohommad Mahbub ,  ZEB, Gui

IPC: G01N27/22

CPC classification number: B81B7/008 ,  B81B2201/0214 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/00246 ,  B81C2201/0159 ,  B81C2201/016 ,  B81C2201/019 ,  G01N27/223

Abstract: A semiconductor device composed of a capacitive humidity sensor comprised of a moisture-sensitive polymer layer electrografted to an electrically conductive metal layer situated on an CMOS substrate or a combined MEMS and CMOS substrate, and exposed within an opening through a passivation layer, packages composed of the encapsulated device, and methods of forming the capacitive humidity sensor within the semiconductor device, are provided.

Abstract translation: 一种由电容式湿度传感器构成的半导体器件，该电容式湿度传感器包括电接枝到位于CMOS衬底或组合的MEMS和CMOS衬底上的导电金属层并且通过钝化层暴露于开口内的湿敏聚合物层， 封装的器件以及在半导体器件内形成电容式湿度传感器的方法。

公开(公告)号：EP3209600A1

公开(公告)日：2017-08-30

申请号：EP15771880.0

申请日：2015-09-18

Applicant: Robert Bosch GmbH

Inventor： NEUL, Reinhard ,  OHMS, Torsten ,  HEUCK, Friedjof ,  ANTE, Frederik ,  SCHELLING, Christoph ,  HATTASS, Mirko

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C2203/0792 ,  H01L2224/16225

Abstract: The invention relates to a microelectronic component assembly comprising a plurality of substrates, and a corresponding method of production. Said microelectronic component assembly comprising a plurality of substrates has a first substrate (C1), which is designed as a circuit substrate of a first level of integration, a second substrate (C2), which is designed as a circuit substrate of a second level of integration, and a third substrate (C3), which is designed as a MEMS sensor substrate and which is bonded onto the second substrate (C2). The second and the third substrate is bonded onto the first substrate (C1). The first level of integration is substantially higher than the second level of integration.

Abstract translation: 本发明涉及包括多个衬底的微电子部件组件以及相应的生产方法。 包括多个基板的所述微电子元件组件具有：第一基板（C1），其被设计为第一集成度的电路基板;第二基板（C2），其被设计为第二层级的电路基板 集成，以及第三衬底（C3），其被设计为MEMS传感器衬底并且被结合到第二衬底（C2）上。 第二和第三衬底结合到第一衬底（C1）上。 第一个整合水平远高于第二个整合水平。

公开(公告)号：EP3140246A1

公开(公告)日：2017-03-15

申请号：EP15788858.7

申请日：2015-05-08

Applicant: InvenSense, Inc.

Inventor： TSAI, Julius Ming-Lin ,  CAGDASER, Baris ,  LIM, Martin ,  KHENKIN, Aleksey S.

IPC: B81C1/00 ,  B81B7/02 ,  G01L23/08

CPC classification number: B81B7/02 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

Abstract translation: 至少一个环境传感器和至少一个MEMS声学传感器的集成封装游离缺失盘。 所述包中包含的共享端口没有公开这两个传感器的环境，worin环境和声学传感器测量声波的环境传感器测量特性。 的端口暴露传感器对环境空气流和声音传感器声波。 声音传感器的一个例子是一个麦克风和所述环境传感器的一个例子是一个湿度传感器。

公开(公告)号：EP2193098B1

公开(公告)日：2015-11-18

申请号：EP08753588.6

申请日：2008-05-19

Applicant: Electronics and Telecommunications Research Institute

Inventor： YU, Han Young ,  KIM, Byung Hoon ,  KIM, An Soon ,  BAEK, In Bok ,  AH, Chil Seong ,  YANG, Jong Heon ,  PARK, Chan Woo ,  AHN, Chang Geun

IPC: H01J49/00 ,  H01J49/42 ,  B82B1/00 ,  B81B3/00 ,  G01N33/00 ,  H01L29/76 ,  H01L29/775 ,  H01L29/06 ,  B81B7/00

CPC classification number: H01J49/4205 ,  B81B7/0025 ,  B81B2201/0214 ,  B81B2201/0271 ,  B82Y10/00 ,  B82Y40/00 ,  G01N2291/0257 ,  H01J49/0018 ,  H01L29/0673 ,  H01L29/7613 ,  H01L29/775 ,  H03H2009/02314

公开(公告)号：EP2193098A4

公开(公告)日：2014-05-07

申请号：EP08753588

申请日：2008-05-19

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： YU HAN YOUNG ,  KIM BYUNG HOON ,  KIM AN SOON ,  BAEK IN BOK ,  AH CHIL SEONG ,  YANG JONG HEON ,  PARK CHAN WOO ,  AHN CHANG GEUN

IPC: B82B1/00 ,  B81B3/00 ,  B82Y15/00 ,  B82Y40/00 ,  G01N33/00 ,  H01J49/00 ,  H01J49/42 ,  H01L29/06 ,  H01L29/76 ,  H01L29/775

CPC classification number: H01J49/4205 ,  B81B7/0025 ,  B81B2201/0214 ,  B81B2201/0271 ,  B82Y10/00 ,  B82Y40/00 ,  G01N2291/0257 ,  H01J49/0018 ,  H01L29/0673 ,  H01L29/7613 ,  H01L29/775 ,  H03H2009/02314