公开(公告)号：US20070114638A1

公开(公告)日：2007-05-24

申请号：US11309215

申请日：2006-07-13

Applicant: Ling-Ling Shen

Inventor： Ling-Ling Shen

IPC: H01L23/495

CPC classification number: H05K1/0243 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10075 ,  H05K2201/10287 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10969 ,  H01L2924/00

Abstract: A printed circuit board with a quartz crystal oscillator includes a mounting area for receiving the quartz crystal oscillator, two first vias, and two second vias. A copper foil is arranged on the mounting area. Pins of the quartz crystal oscillator are inserted into the first vias. The second vias are connected to a ground layer of the PCB and communicate with the copper foil, for transmitting noise of the quartz crystal oscillator to the ground layer of the PCB.

Abstract translation: 具有石英晶体振荡器的印刷电路板包括用于接收石英晶体振荡器的安装区域，两个第一通孔和两个第二通孔。 铜箔布置在安装区域上。 将石英晶体振荡器的引脚插入第一通孔中。 第二通孔连接到PCB的接地层，并与铜箔连通，将石英晶体振荡器的噪声传递到PCB的接地层。

公开(公告)号：US07084501B2

公开(公告)日：2006-08-01

申请号：US10828160

申请日：2004-04-21

Applicant: Hisanobu Utsunomiya

Inventor： Hisanobu Utsunomiya

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/10 ,  H01L23/48 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/145 ,  H05K2201/1053 ,  H05K2201/10583 ,  H01L2924/00

Abstract: The wide usable interconnecting component of the present invention is capable of reducing number of components or electric elements and reducing number of interconnecting sections without limiting circuit design. The interconnecting component electrically interconnects electric components, and the interconnecting component acts as an electric element. Namely, the interconnecting component acts as a passive element or an active element.

Abstract translation: 本发明的广泛可用的互连部件能够减少部件或电气元件的数量并减少互连部件的数量而不限制电路设计。 互连部件电连接电气部件，并且互连部件用作电气元件。 即，互连部件用作无源元件或有源元件。

公开(公告)号：US06603670B1

公开(公告)日：2003-08-05

申请号：US10325945

申请日：2002-12-23

Applicant: Min Ju Chien

Inventor： Min Ju Chien

IPC: H05K714

CPC classification number: H01M2/1022 ,  H01M2/1044 ,  H01M2/1055 ,  H01M2/20 ,  H01R12/716 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10037 ,  H05K2201/10325 ,  H05K2201/10583

Abstract: A supporting device includes a housing for receiving one or more batteries. A spring blade has a middle flap and an end limb secured to the board, and includes a bent segment for engaging with the batteries. Another spring blade is engaged through the board for attaching to the circuit board, and includes a panel for detachably securing the battery to the housing. The board has two legs for spacing the board from the circuit board.

Abstract translation: 支撑装置包括用于接收一个或多个电池的壳体。 弹簧叶片具有固定到板的中间翼片和末端部分，并且包括用于与电池接合的弯曲部分。 另一弹簧片通过该板接合以附接到电路板，并且包括用于将电池可拆卸地固定到壳体的面板。 电路板有两条腿用于将电路板与电路板间隔开。

公开(公告)号：US5668702A

公开(公告)日：1997-09-16

申请号：US643377

申请日：1996-05-06

Applicant: Shary Nassimi

Inventor： Shary Nassimi

IPC: H01C1/02 ,  H01L23/04 ,  H05K3/34 ,  H05K7/00 ,  H01L23/053 ,  H01L23/055 ,  H05K7/02

CPC classification number: H01L23/041 ,  H01C1/02 ,  H05K3/341 ,  H05K3/3415 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10659 ,  H05K2203/0455 ,  H05K3/3447 ,  H05K3/3468 ,  Y02P70/613

Abstract: A combination axial and surface mounted cylindrically-shaped package containing at least one electronic component and being surface mountable to a printed circuit board with electrical lands by the use of conventional axial component through hole mounting machinery that includes a hollow, electrically-insulated, and generally circular-cylindrically-shaped housing, at least one electronic component that is contained in the hollow, electrically-insulated, and generally circular-cylindrically-shaped housing, a pair of electrically-conductive axial leads that are in electrical communication with the at least one electronic component, and at least one circumferentially-disposed, laterally-oriented, and electrically-conductive ring also in electrical communication with the at least one electronic component.

Abstract translation: 一种组合的轴向和表面安装的圆柱形包装，其包含至少一个电子部件，并且通过使用常规的轴向部件通孔安装机构可表面安装到具有电焊盘的印刷电路板，该机械包括中空的，电绝缘的，并且通常 圆形圆柱形壳体，至少一个电子部件，其容纳在中空的，电绝缘的和大致圆柱形的壳体中，一对导电轴向引线，其与至少一个 电子部件和至少一个周向布置的，横向定向的和导电的环，其还与所述至少一个电子部件电连通。

公开(公告)号：US5241134A

公开(公告)日：1993-08-31

申请号：US908826

申请日：1992-07-01

Applicant: Clarence S. Yoo

Inventor： Clarence S. Yoo

IPC: H01L23/495 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01R43/0235 ,  H01L23/49541 ,  H05K3/3426 ,  H05K3/3442 ,  H05K3/3478 ,  H01L2924/0002 ,  H05K2201/0373 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0113 ,  H05K2203/033 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K3/3489 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179

Abstract: The prior art terminal for making a solder bond between a lead and a bond site is modified so as to enhance the reliability of the solder bond. In one embodiment, this modification entails solder relief terminals: solder relief holes through the terminal, notches, grooves or ridges on the surface of the terminal, or bending of the terminal. In a second embodiment, this modification entails predeposit of a predetermined and controlled amount of solid solder and flux on the terminal.

Abstract translation: 改进了用于在引线和键合部位之间形成焊料接合的现有技术的端子，以提高焊料接合的可靠性。 在一个实施例中，该修改涉及消除焊接端子：通过端子的焊接浮雕孔，端子表面上的凹口，凹槽或脊，或端子的弯曲。 在第二实施例中，该修改需要在端子上预定和控制量的固体焊料和焊剂。

公开(公告)号：US5038255A

公开(公告)日：1991-08-06

申请号：US595247

申请日：1990-10-10

Applicant: Jun Nishihashi ,  Toshiyuki Kondo ,  Masato Ono ,  Hirokazu Shiroishi ,  Osamu Waki

Inventor： Jun Nishihashi ,  Toshiyuki Kondo ,  Masato Ono ,  Hirokazu Shiroishi ,  Osamu Waki

IPC: B60Q1/26 ,  F21S8/10 ,  F21V17/00 ,  F21V17/10 ,  F21V19/00 ,  F21V23/06 ,  F21V29/00 ,  H05B33/08 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34

CPC classification number: F21V29/70 ,  B60Q1/2696 ,  F21S48/212 ,  F21S48/215 ,  F21S48/255 ,  F21V29/87 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/089 ,  H05K1/183 ,  H05K3/303 ,  F21S48/328 ,  F21Y2101/00 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0209 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2203/167 ,  H05K3/0064 ,  H05K3/301 ,  H05K3/3405 ,  Y02P70/613 ,  Y10S362/80

Abstract: A vehicle lamp is mounted on vehicles such as automobiles. The lamp has an inner chamber constructed by a lamp housing and a lens, respectively having long shapes. In the chamber, there is a long light source fixing face member on which plural light sources are fixed. All light sources or electric bulbs are neatly fitted to convex or concave guide portions. Circuit patterns are printed on an inner face of the housing. Terminals of the light sources come into contact with the circuit patterns. The housing is made of particular synthetic resin having a good heat conductivity, so that no heat is accumulated in the chamber.

Abstract translation: 车辆灯安装在诸如汽车的车辆上。 该灯具有分别具有长形状的灯壳和透镜构成的内室。 在该室中存在多个光源固定的长光源固定面部件。 所有光源或电灯泡整齐地装配到凸形或凹形导向部分。 电路图案印在外壳的内表面上。 光源的端子与电路图案接触。 壳体由具有良好导热性的特定合成树脂制成，从而在室内不会积聚热量。

公开(公告)号：US4984130A

公开(公告)日：1991-01-08

申请号：US512631

申请日：1990-04-12

Applicant: Helmut L. Dull ,  Horst W. Flunkert

Inventor： Helmut L. Dull ,  Horst W. Flunkert

IPC: H01G4/248 ,  H01C1/148 ,  H01C17/00 ,  H01F27/29 ,  H01G2/06 ,  H05K3/34

CPC classification number: H01G2/065 ,  H01C1/148 ,  H01C17/006 ,  H01F27/292 ,  H05K3/3442 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

Abstract: A passive electric component suitable for SMD-technique and having a cylindrical supporting member or a supporting member in the form of a rectangular parallelepiped and having electric connection elements at its ends which surround the supporting member in the form of a tube and do not cover the end faces of the supporting member.

Abstract translation: 一种适用于SMD技术的无源电气元件，具有圆柱形支撑构件或呈长方体形式的支撑构件，其端部具有围绕支撑构件的管状电连接元件，并且不覆盖 支撑构件的端面。

公开(公告)号：US4851966A

公开(公告)日：1989-07-25

申请号：US929113

申请日：1986-11-10

Applicant: Kenneth J. Roback ,  Thomas R. Beise

Inventor： Kenneth J. Roback ,  Thomas R. Beise

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3457 ,  H05K1/111 ,  H05K3/3421 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2203/044 ,  H05K2203/048 ,  H05K3/305 ,  H05K3/3468 ,  Y02P70/611 ,  Y02P70/613

Abstract: Method and apparatus are disclosed for printed circuit board assembly wherein optimal placement of components are effected. Components, such as microminiature components, are placed, at least on the underside of the circuit board, whereby specially contoured solder pads effect a self-alignment of such components prior to their being affixed in place by a suitable adhesive material.

Abstract translation: 公开了用于印刷电路板组件的方法和装置，其中实现部件的最佳布置。 至少在电路板的下侧放置诸如微型组件的组件，由此特殊轮廓的焊盘在通过合适的粘合剂材料固定在适当位置之前，会影响这些部件的自对准。

公开(公告)号：US4829406A

公开(公告)日：1989-05-09

申请号：US164219

申请日：1988-03-04

Applicant: Michael Korwin-Pawlowski

Inventor： Michael Korwin-Pawlowski

IPC: H01G2/06 ,  H01G9/16 ,  H05K3/30

CPC classification number: H01G2/065 ,  H01G9/16 ,  H01L23/051 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10568 ,  H05K2201/10583 ,  Y02P70/613

Abstract: An electrical device designed for leadless surface mounting on a PC board has molding compound which surrounds the electrical component and is so shaped as to have an outer surface which defines a flat, so that when the device is placed on the board it will remain in proper location and not roll away. An appropriately shaped mold is provided to accommodate the shape the molding compound simultaneously for a plurality of devices.

Abstract translation: 设计用于无铅表面安装在PC板上的电气装置具有包围电气部件的成型组合物，并且被成形为具有限定平面的外表面，使得当该装置放置在板上时，其将保持适当 位置而不滚滚。 提供适当形状的模具以同时容纳多个装置的模塑料的形状。

公开(公告)号：US4449769A

公开(公告)日：1984-05-22

申请号：US387497

申请日：1982-06-11

Applicant: Mikio Kobayashi ,  Kingo Kuritani

Inventor： Mikio Kobayashi ,  Kingo Kuritani

IPC: H05K3/34 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/145 ,  H05K1/184 ,  H05K3/305 ,  H05K1/036 ,  H05K2201/043 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/0195 ,  H05K2203/1189 ,  H05K3/4046 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

Abstract: Two substrates carrying printed circuit patterns are coupled together back-to-back with an adhesive tape interposed therebetween. A plurality of holes are formed through the substrates, and apertures of small diameter are punched in the portions of the adhesive tape backing these holes. Electric components to be held to the substrate are then inserted through the holes punched in the adhesive tape and soldered firmly into portion by an automatic soldering apparatus.

Abstract translation: 携带印刷电路图案的两个基板被背对背地连接在一起。 通过基板形成多个孔，并且在这些孔背面的胶带的部分中冲压小直径的孔。 然后将被保持在基板上的电气部件插入穿过胶带的孔中，并通过自动焊接装置牢固地焊接到部分中。