Abstract:
본 발명은 하기 화학식 1로 표시되는 4족 금속 전구체에 관한 것으로, 상기 4족 전이금속 전구체는 열적으로 안정하고 휘발성이 좋으므로 양질의 4족 전이금속 박막을 형성할 수 있다. [화학식 1]
(상기 식에서, M은 Ti, Zr 또는 Hf이고, R 1 은 C1-C10의 선형 또는 분지형 알킬기, C1-C10의 선형 또는 분지형의 플루오로알킬기, 또는 C6-C12의 방향족 탄화수소이며, R 2 , R 3 은 각각 독립적으로 H이거나 C1-C10의 선형 또는 분지형 알킬기, 또는 C1-C10의 선형 또는 분지형의 플루오로알킬기고, R 4 및 R 5 는 각각 독립적으로 C1-C10의 선형 또는 분지형 알킬기이다.)
Abstract:
본 발명은 화학기상증착법을 이용하여 기판 상부에 Sb 증착막을 형성하는 단계; 및 Te 증착막을 형성하는 단계;를 교번하여 수행하는 Sb-Te계 열전박막을 증착 방법이며, Sb 증착 및 Te 증착 단계에서 플라즈마를 발생하는 Sb-Te계 열전박막의 제조방법에 관한 것이다.
Abstract:
PURPOSE: A contact formation of silicon solar cells using conductive ink with nano-sized glass frit is provided to minimize the loss of electrode material and to reduce production costs. CONSTITUTION: An emitter layer(202) is formed on the upper part of a substrate. A reflection barrier layer is formed on the emitter layer. A first conductive layer(204) is patterned in the reflection barrier layer. A second conductive layer(205) is formed in the upper surface of the first conductive layer. A conductive ink composite is used in the process for forming the second conductive layer.
Abstract:
PURPOSE: Graphene and a manufacturing method of the same, a semiconductor device using the same, and a manufacturing method of the semiconductor are provided to control the electric characteristic of the graphene by generating the structural change of the graphene. CONSTITUTION: A manufacturing method of graphene controls the electric characteristic of graphene(104) by generating the structural change of the graphene. The structural change of the graphene is generated by doping nitrogen into the graphene based on nitrogen plasma treatment. The structural change of the graphene controls the electric characteristic of the graphene based on conductivity. The conductivity is controlled by the power of nitrogen plasma, the flux of nitrogen, the generating pressure of the nitrogen plasma, and the contact time of the nitrogen plasma and the graphene.
Abstract:
PURPOSE: A method and apparatus for forming a graphene pattern using a stripping method are provided to easily form the graphene pattern having a uniform line width on a substrate by selectively stripping a part of a graphene layer formed on the substrate using a polymer stamp. CONSTITUTION: A graphene layer(104a) is formed on a substrate(102). A graphene stripping layer(108) is formed on a pattern surface of a polymer stamp(106) having a raised pattern. The pattern surface of the polymer stamp is attached with a target location of the graphene layer. The graphene layer attached to the raised pattern of the polymer stamp is selectively stripped from the substrate. The graphene pattern layer is formed on the substrate.
Abstract:
본 발명은 변형된 글리신을 사용한 신규의 갈륨 화합물 및 그 제조방법에 관한 것으로, 구체적으로는 하기 화학식 1로 표시되는 갈륨 디알킬글리신 화합물에 관한 것으로 수분에 민감하지 않고 보관이 용이하며 열적 안정성이 있는 신규의 갈륨 디알킬글리신 화합물 및 그 제조 방법에 관한 것이다. [화학식 1]
[상기 화학식 1에서, R 1 및 R 2 는 서로 독립적으로 선형 또는 분지형의 C1-C5의 알킬기이다.]
Abstract:
PURPOSE: A novel tin compound with fluoro-ligand is provided to ensure high vapor pressure and to be used as a material for thin film deposition. CONSTITUTION: A tin alkoxide compound is denoted by chemical formula 1(Sn[O-A-OR^1]_2) or formula 2(Sn[O-CR^2R^3(CH_2)_m-OR^1]_2). The tin alkoxide compound is Sn(OCMe_2CH_2OCH_2CF_3)_2, or Sn(OCMeEtCH_2OCH_2CF_3)_2. A method for preparing the tin alkoxide compound comprises a step of reacting a tin halide compound of chemical formula 3(SnX_2) with an alkali metal salt of alcohol of chemical formula 4(M[O-A-OR^1]). A thin film containing tin compounds is prepared by MOCVD(modified chemical vapor deposition) or ALD(atomic layer deposition) using the tin alkoxide compounds as a precursor.
Abstract:
PURPOSE: A novel bismuth amino alkoxide compound with an amino alkoxide ligand and a method for preparing the same are provided to deposit a thin film or various alloys. CONSTITUTION: A bismuth amino alkoxide compound is denoted by chemical formula 1(Bi[O-A-NR^1R^2]_3) or formula 2(Bi[O-CR^3R^4(CH_2)_m-NR^1R^2]_3). A method for preparing the compound of chemical formula 1 comprises a step of reacting bismuth halide compound of chemical formula 2(BiX) with alkali metal salt of alcohol of chemical formula 4(M[O-A-NR_1R_2]). A bismuth compound of chemical formula 6(Bi[NR^5_2]_3) is prepared by reacting a bismuth halide compound of chemical formula 3(BiX_3) with alkali metal compounds of chemical formula 5(M[NR^5_2]). A bismuth-containing thin film is prepared using the bismuth amino alkoxide compounds as a precursor.