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    Printed wiring board
    161.
    发明专利
    Printed wiring board 审中-公开
    印刷线路板

    公开(公告)号：JP2011097054A

    公开(公告)日：2011-05-12

    申请号：JP2010238159

    申请日：2010-10-25

    Applicant: Ibiden Co Ltd ,  イビデン株式会社

    Inventor： KATO HISASHI ,  AOKI MAKOTO

    IPC: H05K1/11 ,  H05K3/28 ,  H05K3/46

    CPC classification number: H05K1/115 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/4602 ,  H05K2201/0112 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0315

    Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board which improves connection reliability between a via conductor and a conductor circuit on the bottom side of the via conductor. SOLUTION: A resin filler 38 in a through hole conductor 36 has a larger thermal expansion coefficient than a core substrate 30 provided with a core, and a via conductor 62 on a cover plating layer (through hole land) 42 is given a large separating force by heat cycle. The via conductor 62 is reversely tapered from the front surface side to the bottom side, and the area of the bottom 62D is made large. Thus, the connection reliability between the bottom 62D of the via conductor 62 and the cover plating layer 42 is improved, thereby improving the reliability of the printed wiring board. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种改善通孔导体和通孔导体底侧的导体电路之间的连接可靠性的印刷线路板。 解决方案：通孔导体36中的树脂填料38具有比设置有芯的芯基板30更大的热膨胀系数，并且覆盖镀层（通孔焊盘）42上的通孔导体62被赋予 热循环大分离力。 通孔导体62从前表面侧向底侧相反地渐缩，底部62D的面积变大。 因此，通孔导体62的底部62D与覆盖镀层42之间的连接可靠性提高，从而提高印刷电路板的可靠性。 版权所有（C）2011，JPO＆INPIT

    Wiring board and manufacturing method therefor
    162.
    发明专利
    Wiring board and manufacturing method therefor 审中-公开
    接线板及其制造方法

    公开(公告)号：JP2005026322A

    公开(公告)日：2005-01-27

    申请号：JP2003187855

    申请日：2003-06-30

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： MURAMATSU SHIGEJI ,  HIZUME TORU

    IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

    CPC classification number: H05K3/4644 ,  H05K3/005 ,  H05K3/421 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0108 ,  H05K2203/1189

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring board which can be reduced in manufacturing cost and made simple in manufacturing processes. SOLUTION: A molding die having a hemispherical protrusion is pressed down on an interlayer resin layer 180 while another molding die having a hemispherical protrusion is pressed down on an interlayer resin layer 190. By this setup, a hemispherical opening 200 is formed in a via forming region on the interlayer resin layer 180 so as to expose a part of a wiring pattern 160. Similarly, a hemispherical opening 210 is formed in a via forming region on the interlayer resin layer 190 so as to expose a part of a wiring pattern 170. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 解决的问题：提供可以降低制造成本并简化制造工艺的布线板。 解决方案：将具有半球形突起的成型模压在层间树脂层180上，同时将具有半球形突起的另一个模具压在层间树脂层190上。通过这种设置，形成半球形开口200 在层间树脂层180上的通孔形成区域，以露出布线图案160的一部分。类似地，半导体开口210形成在层间树脂层190上的通路形成区域中，以露出布线的一部分 模式170.版权所有（C）2005，JPO＆NCIPI

    MULTI-CAVITY WIRING BOARD AND METHOD FOR MANUFACTURING SAME
    165.
    发明公开
    MULTI-CAVITY WIRING BOARD AND METHOD FOR MANUFACTURING SAME 无效

    公开(公告)号：EP2627159A4

    公开(公告)日：2018-01-17

    申请号：EP11830572

    申请日：2011-09-30

    Applicant: NGK SPARK PLUG CO

    Inventor： YOSHIDA YOSHITAKA ,  YAMAMOTO HIROAKI

    IPC: H05K1/03 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00

    CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

    Abstract: There are provided a multi-piece-array in which it is difficult for chipping, cracking, or breaking to occur from the vicinity of dividing grooves at the time of division or after division and which has high reliability, and a method of manufacturing the multi-piece-array. A multi-piece-array 1 is formed by laminating a plurality of ceramic layers s1 and s2 and has a front surface 2 and a back surface 3. The multi-piece-array 1 includes a product region 4a where a plurality of wiring board portions 4 having a rectangular shape in plan view and including cavities 5 are arranged in a matrix, an edge portion 6 that is positioned along the periphery of the product region 4a, and dividing grooves 8 and 9 that are formed on at least one of the front surface 2 and the back surface 3 along boundaries between the wiring board portions 4 and 4 and boundaries between the wiring board portions 4 and the edge portion 6. The deepest portions 8b of the dividing grooves 8 and 9 have an arc shape and each of the dividing grooves 8 and 9 includes a middle portion 8a between the deepest portion 8b and a groove inlet 8c on a cross-section orthogonal to an extending direction. The width w2 of the deepest portion 8b is greater than the width w3 of the groove inlet 8c and the width w1 of the middle portion 8a is equal to or less than the width w3 of the groove inlet 8c.

    MULTI-CAVITY WIRING BOARD AND METHOD FOR MANUFACTURING SAME
    168.
    发明公开
    MULTI-CAVITY WIRING BOARD AND METHOD FOR MANUFACTURING SAME 审中-公开
    LEITERPLATTE MIT MEHRERENHOHLRÄUMENUND VERFAHREN ZU IHRER HERSTELLUNG

    公开(公告)号：EP2627159A1

    公开(公告)日：2013-08-14

    申请号：EP11830572.1

    申请日：2011-09-30

    Applicant: NGK SPARK PLUG CO., LTD.

    Inventor： YOSHIDA Yoshitaka ,  YAMAMOTO Hiroaki

    IPC: H05K1/02 ,  H05K3/00

    CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

    Abstract: There are provided a multi-piece-array in which it is difficult for chipping, cracking, or breaking to occur from the vicinity of dividing grooves at the time of division or after division and which has high reliability, and a method of manufacturing the multi-piece-array.
    A multi-piece-array 1 is formed by laminating a plurality of ceramic layers s1 and s2 and has a front surface 2 and a back surface 3. The multi-piece-array 1 includes a product region 4a where a plurality of wiring board portions 4 having a rectangular shape in plan view and including cavities 5 are arranged in a matrix, an edge portion 6 that is positioned along the periphery of the product region 4a, and dividing grooves 8 and 9 that are formed on at least one of the front surface 2 and the back surface 3 along boundaries between the wiring board portions 4 and 4 and boundaries between the wiring board portions 4 and the edge portion 6. The deepest portions 8b of the dividing grooves 8 and 9 have an arc shape and each of the dividing grooves 8 and 9 includes a middle portion 8a between the deepest portion 8b and a groove inlet 8c on a cross-section orthogonal to an extending direction. The width w2 of the deepest portion 8b is greater than the width w3 of the groove inlet 8c and the width w1 of the middle portion 8a is equal to or less than the width w3 of the groove inlet 8c.

    Abstract translation: 提供了一种多分片阵列，其中在划分或划分之后难以从划分槽附近发生切屑，破裂或断裂，并且其具有高可靠性，并且制造多层结构的方法 -piece阵列。 多片阵列1通过层叠多个陶瓷层s1和s2而形成，并具有前表面2和后表面3.多片阵列1包括产品区域4a，其中多个布线板部分 在平面图中具有矩形形状并且包括空腔5的图4以矩阵形式布置，沿着产品区域4a的周边定位的边缘部分6和形成在前部的至少一个上的分隔槽8和9 表面2和背面3沿着布线板部分4和4之间的边界以及布线板部分4和边缘部分6之间的边界。分隔槽8和9的最深部分8b具有弧形，并且每个 分割槽8,9在与延伸方向正交的截面上包括在最深部分8b和凹槽入口8c之间的中间部分8a。 最深部8b的宽度w2大于槽入口8c的宽度w3，中间部分8a的宽度w1等于或小于槽入口8c的宽度w3。

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