公开(公告)号：US09711780B2

公开(公告)日：2017-07-18

申请号：US14535897

申请日：2014-11-07

Applicant: LG CHEM, LTD.

Inventor： Youngsun Park ,  Jeongsuk Lee ,  Keunpyo Ahn ,  Chunyeon Kim ,  Joung Ho Ha ,  Masayuki Wakebe

IPC: H01M14/00 ,  H01M2/34 ,  H01M2/04 ,  H01M10/0525 ,  H01M10/42 ,  H05K1/02 ,  H05K3/22 ,  H05K3/34

CPC classification number: H01M2/34 ,  H01M2/0404 ,  H01M10/0525 ,  H01M10/425 ,  H01M10/4257 ,  H01M2010/4271 ,  H01M2200/00 ,  H01M2200/103 ,  H01M2200/106 ,  H01M2220/30 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/341 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/1028 ,  Y02E60/122

Abstract: A battery pack including a battery cell having an electrode assembly of a cathode/separator/anode structure mounted in a battery case together with an electrolyte in a sealed state, and a protection circuit module (PCM) electrically connected to the battery cell. The PCM includes a protection circuit board (PCB) electrically connected to the battery cell, the PCB being provided on a region where a circuit is connected with a conductive pattern including a fusing part, having relatively high resistance, configured to fuse itself for interrupting the flow of current when a large amount of current is conducted.

公开(公告)号：US20170117604A1

公开(公告)日：2017-04-27

申请号：US15331677

申请日：2016-10-21

Applicant: KYOCERA Document Solutions Inc.

Inventor： Yuichiro Kurokawa

IPC: H05K1/02 ,  H01P3/08

CPC classification number: H01P3/08 ,  H01P3/02 ,  H01P3/088 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/0145 ,  H05K2201/05 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2203/1572

Abstract: A signal transmission path includes a first cable, a second cable, and an interval regulation member. The first cable includes a plurality of signal lines arranged in parallel along one direction. The second cable includes a plurality of signal lines arranged in parallel along the one direction, and is laminated with the first cable. The interval regulation member forms a predetermined specific interval between the first cable and the second cable in a lamination direction in which the first cable and the second cable are laminated.

公开(公告)号：US09606496B2

公开(公告)日：2017-03-28

申请号：US14326193

申请日：2014-07-08

Applicant: CANON KABUSHIKI KAISHA

Inventor： Satoshi Ogawara

IPC: H05K1/00 ,  G03G15/00 ,  H05K3/40 ,  H05K1/02 ,  H05K3/34

CPC classification number: G03G15/80 ,  G03G21/1652 ,  H05K1/0254 ,  H05K1/0269 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10363

Abstract: A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.

公开(公告)号：US20170006711A1

公开(公告)日：2017-01-05

申请号：US15106634

申请日：2014-11-10

Applicant: ROBERT BOSCH GMBH

Inventor： Uwe Liskow

IPC: H05K3/32 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K3/328 ,  H01R12/51 ,  H01R12/57 ,  H01R12/62 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/30 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/3421 ,  H05K5/0082 ,  H05K2201/09063 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2201/10628 ,  H05K2201/10962 ,  H05K2203/107 ,  Y02P70/613

Abstract: An electronic control module includes a printed circuit board and an electrical component. The circuit board has a contact area arranged on a component side. The electrical component has an electrical connection element with a connection section running parallel to the component side and is electrically connected to the contact area. An adapter is arranged on the circuit board independently of the electrical component and has a holding body fastened to the circuit board outside the contact area and a metal web. The web is arranged on the holding body and has a contact section running parallel to the component side. The contact section and the connection section lie atop another and are welded to one another in a covering area. The web or the connection element makes electrical contact with the contact area by an electrically conductive material applied to the contact area.

Abstract translation: 电子控制模块包括印刷电路板和电气部件。 电路板具有布置在部件侧的接触区域。 电气部件具有电连接元件，其连接部分平行于部件侧延伸并且电连接到接触区域。 电路板上独立于电气部件设置适配器，并且具有在接触区域外部紧固到电路板的保持体和金属网。 卷筒纸布置在保持体上，并且具有平行于部件侧延伸的接触部分。 接触部分和连接部分位于另一个顶部并且在覆盖区域中彼此焊接。 网或连接元件通过施加到接触区域的导电材料与接触区域电接触。

公开(公告)号：US09518887B2

公开(公告)日：2016-12-13

申请号：US14989332

申请日：2016-01-06

Applicant: KULITE SEMICONDUCTOR PRODUCTS, INC.

Inventor： Louis DeRosa ,  Robert Gardner

IPC: H05K1/00 ,  H05K1/18 ,  G01L19/14 ,  H05K1/02 ,  G01L15/00 ,  H05K7/00 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/189 ,  G01L15/00 ,  G01L19/14 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.

公开(公告)号：US20160204675A1

公开(公告)日：2016-07-14

申请号：US14994493

申请日：2016-01-13

Applicant: NANJING CHERVON INDUSTRY CO., LTD.

Inventor： Dezhong Yang ,  Pingbo Shi ,  Jifeng Feng

IPC: H02K7/14 ,  H02K11/33 ,  H02K11/30 ,  H02K3/28 ,  H05K1/18 ,  H05K1/02

CPC classification number: H02K7/145 ,  H02K11/33 ,  H05K1/0263 ,  H05K3/202 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: A power tool and a printed circuit board for use therewith. The power tool has an electric motor and a power source. The printed circuit board assembly has a main board having a conductive portion, a semiconductor power device, and a conductor attached to the conductive portion. The conductive portion electrically connects to the semiconductor power device and the conductor electrically connects to the conductive portion. When current is flowing through the printed circuit board, the heat and the voltage loss generated by the printed circuit board can be reduced.

Abstract translation: 电动工具和与其一起使用的印刷电路板。 电动工具具有电动马达和电源。 印刷电路板组件具有导电部分的主板，半导体功率器件和连接到导电部分的导体。 导电部分电连接到半导体功率器件，并且导体电连接到导电部分。 当电流流过印刷电路板时，可以减少由印刷电路板产生的热量和电压损失。

公开(公告)号：US09360378B2

公开(公告)日：2016-06-07

申请号：US14395467

申请日：2013-04-03

Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (C.N.R.S.) ,  UNIVERSITE DE FRANCHE-COMTE

Inventor： Sylvain Ballandras ,  Bruno Francois

IPC: H05K7/00 ,  G01K11/26 ,  H05K1/02 ,  B23K1/00 ,  H05K1/18 ,  H05K3/28 ,  H05K1/03 ,  H05K1/05 ,  H05K3/10 ,  H05K3/34

CPC classification number: G01K11/265 ,  B23K1/0016 ,  B23K2101/38 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/103 ,  H05K3/285 ,  H05K3/3426 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electrical device includes a first electrical component and a second electrical component connected to each other via an electrical connection having an electrically insulating support plate and a weld joint deposited on the support plate. The weld joint has a melting temperature (Ta) significantly lower than an ambient operating temperature (Ta) to which at least one of the two electrical components and the electrical connection are subjected. The electrical device includes cement that completely covers the exposed weld joint. The material of the cement is chosen to maintain its adhesion and its tightness with respect to the weld joint when the Ta is applied.

Abstract translation: 电气设备包括通过电连接彼此连接的第一电气部件和第二电气部件，该电气连接具有电绝缘支撑板和沉积在支撑板上的焊接接头。 焊接接头具有明显低于两个电气部件和电连接中的至少一个所承受的环境工作温度（Ta）的熔化温度（Ta）。 电气设备包括完全覆盖暴露的焊接接头的水泥。 当施加Ta时，选择水泥的材料以保持其粘合性和相对于焊接接头的密封性。

公开(公告)号：US20160081192A1

公开(公告)日：2016-03-17

申请号：US14947558

申请日：2015-11-20

Applicant: MC10, Inc.

Inventor： Yung-Yu Hsu

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：US20160050743A1

公开(公告)日：2016-02-18

申请号：US14804748

申请日：2015-07-21

Applicant: FUJITSU LIMITED

Inventor： Jun TAGUCHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

Abstract translation: 电路板包括能够保持印刷电路板的板构件，包括电子部件的印刷电路板和设置在电子部件上的冷却部件，印刷电路板和电子部件位于板部件和 冷却构件; 以及设置到板构件并允许与印刷电路板电连接的电路。

公开(公告)号：US20150327355A1

公开(公告)日：2015-11-12

申请号：US14443231

申请日：2013-11-15

Applicant: JUMATECH GMBH

Inventor： Markus WÖLFEL

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K1/0265 ,  H05K1/0278 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/202 ,  H05K2201/0275 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/057 ,  H05K2201/09027 ,  H05K2201/0969 ,  H05K2201/1028 ,  Y10T29/49156

Abstract: An angle-adjustable printed circuit board structure having two printed circuit board sections arranged angularly with respect to one another. The printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads. The two contact pads are situated on different printed circuit board sections. The printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. The conduction element has a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section.

Abstract translation: 一种角度可调的印刷电路板结构，其具有相对于彼此成角度地布置的两个印刷电路板部分。 印刷电路板结构包含至少一个导电元件，其至少主要嵌入在印刷电路板结构中，并且在两个接触焊盘之间延伸并且导电地连接到所述接触焊盘。 两个接触垫位于不同的印刷电路板部分上。 印刷电路板部分可相对于彼此具有角度可调节和/或成角度，同时维持接触焊盘和至少一个传导元件之间的连接，并且通过经印刷的弯曲边缘弯曲至少一个导电元件 电路板部分。 如横截面所示，导电元件沿着弯曲边缘比垂直方向具有更大的程度。