Abstract:
본 발명의 일 측면에 의하면, 플렉서블한 기판 상에 금속 시드층을 형성하는 제1단계; 상기 금속 시드층 상에 드라이 필름 레지스트(Dry Film Resist; 이하 DFR층)를 적층하는 제2단계; 상기 DFR층의 패터닝에 의해 1차 패턴을 형성하여 상기 금속 시드층의 일부를 노출시키는 제3단계; 상기 일부 노출된 금속 시드층 상에 도금 공정을 통한 제1금속패턴을 형성하는 제4단계; 상기 제1금속패턴 및 상기 DFR층 상에 PR(Photoresist)층을 코팅하고, PR층의 패터닝에 의해 2차 패턴을 형성하여 상기 제1금속패턴의 일부 영역을 노출시키는 제5단계; 상기 제1금속패턴 상의 노출된 영역 상에 도금 공정을 통해 제2금속패턴을 형성하는 제6단계; 상기 DFR층 및 PR층을 동시에 제거하여, 플렉서블 기판 상에 상기 제1금속패턴과 제2금속패턴으로 이루어진 금속 구조체를 형성하는 제7단계; 를 포함하여 구성되는 것을 특징으로 하는 플렉서블 기판 상에 입체형 금속 구조체를 제조하는 방법을 제공한다. 본 발명에 의하면, 높은 단차가 필요한 구성에 감광필름(Dry Film Resist; DFR)을 사용함으로써, 플렉서블 기판에 금속 구조체를 제작할 때, 고열이 기판에 작용하지 않도록 하는 효과가 있다.
Abstract:
The present invention relates to a method for manufacturing a nano-patterned metal film. In terms of a method for manufacturing a nano-patterned metal film, the method for manufacturing a nano-patterned metal film using a nano-imprint lithography and a plating process comprises: a first step where a resin layer is formed on the upper layer of a substrate; a second step where nano-pattern is formed on the resin layer by an imprinting and a hardening process after locating a stamp for imprinting on the resin layer; a third step where a seed layer is vapour-deposited on the nano-patterned resin layer; a fourth step where a metal layer is formed on the seed layer by a plating process; and a fifth step where a nano-patterned metal film is produced by separating the seed and metal layers from the substrate after removing the resin layer. Hence, the present invention uses a nano-imprint lithography and a plating process which reduces cost and time for processing by simplifying the processes. Also, a nano-patterned metal film can simply be produced.
Abstract:
PURPOSE: A method for growing a nitride semiconductor with high quality and a method for manufacturing a nitride semiconductor light emitting device using the same are provided to reduce manufacturing costs by manufacturing a vertical LED without a surface texturing process. CONSTITUTION: A dielectric mask layer(20) is formed on a substrate(10) or a thin film. A polymer layer is formed on the dielectric mask layer. A pattern layer made of resins or metal organic precursors is formed on the polymer layer. The polymer layer is etched on the lower side of the pattern layer by a dry etching process. A pattern of the dielectric mask layer is formed to expose a part of the substrate or the thin film. The polymer layer and the pattern layer are removed from the upper side of the pattern of the dielectric mask layer. A nitride semiconductor layer(60) is laterally grown on the upper side of the partially exposed substrate.
Abstract:
PURPOSE: A micro-nano hybrid stamp using a micro patterned stamp for imprint lithography and a manufacturing method thereof are provided to remove an additional stamp by easily changing the linewidth, depth or shape of a multilevel pattern through the thermal process of a metal-organic precursor layer. CONSTITUTION: A substrate(105) for a stamp is made of polymer. A UV curable resin(106) is deposited or coated on the upper side of the substrate for the stamp. A micro-nano hybrid stamp(107) is obtained by forming a multilevel stamp on the upper side of the UV curable resin. A micro patterned stamp for imprint lithography is formed by thermally processing a metal-organic precursor layer buried in a pattern region. An engraved or embossed multilevel pattern(108) is formed by an imprint lithography process.
Abstract:
PURPOSE: A patterning method using an imprint lithography and a multilayer thin film and a semiconductor device manufactured by the same are provided to reduce a patterning process by forming a pattern of a nanosize once. CONSTITUTION: A pattern is formed on the upper side of a substrate(102) for a mold. A sacrificial layer is deposited and coated on the upper side of a substrate. Resin for imprint is coated on the upper side of the sacrificial layer. A multistage pattern is formed on the upper side of the resin for the imprint. A metal layer(105) is deposited on the surface of the resin for imprint.