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公开(公告)号：KR100867150B1
公开(公告)日：2008-11-06
申请号：KR1020070097722
申请日：2007-09-28
Applicant: 삼성전기주식회사
IPC: H05K1/16
CPC classification number: H05K1/0231 , H01L2224/16225 , H05K1/0236 , H05K1/165 , H05K1/185 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/10636 , H05K2201/10643 , Y02P70/611 , Y10T29/4913 , Y10T29/49146
Abstract: A printed circuit board with an embed chip capacitor and a method for embedding the chip capacitor are provided to shield the noise of a specific frequency by using the series connection structure of a via and the chip capacitor as an EBG(Electromagnetic Band Gap) structure. A printed circuit board includes a first conductor layer(310), a second conductor layer(320), a capacitor(340), and a via. A second conductor layer is separately positioned on the first conductor layer. A capacitor is positioned between the first conductor layer and the second conductor layer. The second electrode is connected to the second conductor layer. The via connects the first electrode of the chip capacitor and the first conductor layer. The chip capacitor is embedded in the printed circuit board.
Abstract translation: 提供具有嵌入式芯片电容器的印刷电路板和嵌入片式电容器的方法，通过使用通孔和片式电容器的串联连接结构作为EBG（电磁带隙）结构来屏蔽特定频率的噪声。 印刷电路板包括第一导体层（310），第二导体层（320），电容器（340）和通路。 第二导体层分别位于第一导体层上。 电容器位于第一导体层和第二导体层之间。 第二电极连接到第二导体层。 通孔连接片式电容器的第一电极和第一导体层。 芯片电容器嵌入印刷电路板。
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公开(公告)号：KR100851065B1
公开(公告)日：2008-08-12
申请号：KR1020070041993
申请日：2007-04-30
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K2201/09309 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09781 , Y10T29/4913 , Y10T29/49165 , Y10T428/12465
Abstract: An electromagnetic band gap structure and a printed circuit board are provided to prevent a mixed signal in an electronic device having an RF circuit and a digital circuit on the same substrate. An electromagnetic band gap structure includes first to third metal layers(210-1,210-2,210-3), first to third dielectric layers(220a,220b,220c), a metal plate(330), and first and second vias(340,360). The first dielectric layer is formed on the first metal layer. The second metal layer is formed on the first dielectric layer and has a hole(350). The second dielectric layer is formed on the second metal layer. The metal plate is formed on the second dielectric layer. The first via connects the first metal layer and the metal plate through the hole. The third dielectric layer is formed on the metal plate and the second dielectric layer. The third metal layer is formed on the third dielectric layer. The second via connects the metal layer and the third metal layer.
Abstract translation: 提供电磁带隙结构和印刷电路板以防止具有RF电路和数字电路的电子设备中的混合信号在同一基板上。 电磁带隙结构包括第一至第三金属层（210-1,210-2,210-3），第一至第三电介质层（220a，220b，220c），金属板（330）以及第一和第二通孔（340,360）。 第一介电层形成在第一金属层上。 第二金属层形成在第一介电层上并具有孔（350）。 第二介电层形成在第二金属层上。 金属板形成在第二电介质层上。 第一通孔通过孔连接第一金属层和金属板。 第三电介质层形成在金属板和第二电介质层上。 第三金属层形成在第三介电层上。 第二通孔连接金属层和第三金属层。
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公开(公告)号：KR1020080009967A
公开(公告)日：2008-01-30
申请号：KR1020060069811
申请日：2006-07-25
Applicant: 삼성전기주식회사
IPC: C25D17/06
Abstract: A jig for plating a PCB is provided to compensate dispersion of the PCB size by allowing the PCB to be elastically extended. A jig for plating a PCB(10) comprises horizontal frames(11,13) and vertical frames(15,17), and an elastic member(30). The horizontal frames are aligned at predetermined distance from each other. The vertical frames are vertically connected at two ends of the horizontal frame. One end of an elastic member is hung to a standard hole of the PCB and the other end of the elastic member is connected with the horizontal frame or the vertical frame. The elastic member is a coil spring of which one end is forming a hook-shaped hanging piece and being inserted to the standard hole of the PCB.
Abstract translation: 提供用于电镀PCB的夹具，以通过允许PCB弹性伸长来补偿PCB尺寸的分散。 用于电镀PCB（10）的夹具包括水平框架（11,13）和垂直框架（15,17）和弹性构件（30）。 水平框架彼此以预定距离对齐。 垂直框架在水平框架的两端垂直连接。 弹性构件的一端悬挂在PCB的标准孔上，弹性构件的另一端与水平框架或垂直框架连接。 弹性构件是螺旋弹簧，其一端形成钩形悬挂件并插入到PCB的标准孔中。
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公开(公告)号：KR101963282B1
公开(公告)日：2019-03-28
申请号：KR1020160172790
申请日：2016-12-16
Applicant: 삼성전기주식회사
IPC: H01L23/31 , H01L23/498 , H01L23/525 , H01L23/538 , H01L23/00
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Patent Agency Ranking
公开(公告)号：KR101901695B1
公开(公告)日：2018-09-27
申请号：KR1020140082510
申请日：2014-07-02
Applicant: 삼성전기주식회사
CPC classification number: H01P3/026 , H01P3/085 , H04N5/2257 , H05K1/0245 , H05K1/0253 , H05K2201/09263 , H05K2201/10204
Abstract: 본발명은인쇄회로기판및 이를이용한카메라모듈용인쇄회로기판에관한것이다. 본발명에따른인쇄회로기판은, 절연층을사이에두고신호전송부와접지부가배치된인쇄회로기판으로서, 상기접지부는임피던스조정부및 더미부를포함한다.
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公开(公告)号：KR1020130046254A
公开(公告)日：2013-05-07
申请号：KR1020110110731
申请日：2011-10-27
Applicant: 삼성전기주식회사
Abstract: PURPOSE: An inductor is provided to shield electromagnetic interference noise radiating from a pattern for an inductor. CONSTITUTION: An inductor(100) includes an inductor pattern(110), a shielding plate and a plurality of shielding vias(130). The inductor pattern is implemented in a spiral form, and is implemented in a meander or loop form. The inductor pattern includes a plurality of coil patterns(110a-110d), a plurality of coil vias(111a,111b) and two lead-out patterns. The pair of shielding plates are formed in an upper part or a lower part of the inductor pattern. The plurality of shielding vias electrically or mechanically connect the pair of shielding plate located in the upper part or the lower part.
Abstract translation: 目的：提供一个电感器来屏蔽从电感器图案辐射的电磁干扰噪声。 构成：电感器（100）包括电感器图案（110），屏蔽板和多个屏蔽通孔（130）。 电感器图案以螺旋形式实现，并且以曲折或环形式实现。 电感图案包括多个线圈图案（110a-110d），多个线圈通孔（111a，111b）和两个引出图案。 该对屏蔽板形成在电感图案的上部或下部。 多个屏蔽通孔电或机械地连接位于上部或下部的一对屏蔽板。
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公开(公告)号：KR1020110134200A
公开(公告)日：2011-12-14
申请号：KR1020100054057
申请日：2010-06-08
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0236 , H01L2224/16227 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/15313 , H01L2924/16251 , H01L2924/3025 , H05K3/4694
Abstract: PURPOSE: An electromagnetic interference(EMI) noise shielding substrate which includes an electromagnetic band gap structure is provided to use an EBG(Electromagnetic Band Gap), thereby effectively shielding radiation noise emitted to the outside. CONSTITUTION: An electronic product is mounted in the upper surface of a first substrate region. A circuit for signal and power transmission to the electronic product is arranged in the first substrate region. A second substrate region is placed in the lower surface of the first substrate region. An electromagnetic band gap structure is inserted in the second substrate region. The electromagnetic band gap structure includes a band block frequency characteristic in order to shield electromagnetic interference(EMI) noise.
Abstract translation: 目的：提供包括电磁带隙结构的电磁干扰（EMI）噪声屏蔽衬底，以使用EBG（电磁带隙），从而有效地屏蔽发射到外部的辐射噪声。 构成：电子产品安装在第一基底区域的上表面。 用于向电子产品发送信号和电力的电路布置在第一衬底区域中。 第二衬底区域被放置在第一衬底区域的下表面中。 电磁带隙结构被插入到第二衬底区域中。 电磁带隙结构包括带阻频率特性，以屏蔽电磁干扰（EMI）噪声。
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公开(公告)号：KR101092590B1
公开(公告)日：2011-12-13
申请号：KR1020090090166
申请日：2009-09-23
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: 전자기 밴드갭 구조를 구비하는 인쇄회로기판이 개시된다. 상기 인쇄회로기판은, 노이즈를 차폐하는 전자기 밴드갭 구조물이 내부에 삽입되는 인쇄회로기판으로서, 상기 밴드갭 구조물은, 서로 상이한 평면 상에 배치되는 제1 및 제2 도전체부; 상기 제2 도전체부와 상이한 평면 상에 배치되는 제3 도전체부; 상기 제2 도전체부가 배치된 평면을 경유하여 상기 제1 도전체부와 상기 제3 도전체부를 연결하고, 상기 제2 도전체부와는 전기적으로 분리되는 제1 스티칭 비아부를 포함한다. 상기 제1 도전체부는, 제1 플레이트; 상기 제1 플레이트와 이격되는 제2 플레이트; 상기 제1 플레이트 및 상기 제2 플레이트와 상이한 평면을 경유하여, 상기 제1 플레이트와 상기 제2 플레이트를 전기적으로 연결하는 제2 스티칭 비아부를 포함한다.
기판, 노이즈, 전자기 밴드갭 구조, 차폐Abstract translation: 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。
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公开(公告)号：KR1020110015971A
公开(公告)日：2011-02-17
申请号：KR1020090073444
申请日：2009-08-10
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: PURPOSE: An EMI noise reduction printed circuit board is provided to easily block the radiation noise radiated from an edge of a substrate by modifying the simple structure of the substrate. CONSTITUTION: A ground layer and a power layer are prepared on the first area. A second area(200) having electromagnetic band gap structure is located on a side of the first area. The second area comprises the electromagnetic band gap structure in order to shield the EMI noise emitting through the side of the first area to outside.
Abstract translation: 目的：提供EMI降噪印刷电路板，通过改变基板的简单结构，容易地阻挡从基板边缘辐射的辐射噪声。 构成：在第一个区域准备接地层和电源层。 具有电磁带隙结构的第二区域（200）位于第一区域的一侧。 第二区域包括电磁带隙结构，以便屏蔽通过第一区域的一侧发射到外部的EMI噪声。
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