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公开(公告)号：KR101351615B1
公开(公告)日：2014-01-15
申请号：KR1020100127236
申请日：2010-12-13
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J11/00 , H01L21/683 , B32B37/00
Abstract: 본 발명은 박리기재 중 미절단 부위의 두께와 미절단 부위 간의 거리를 특정 비율로 하고 단위면적 당 파단 강도가 40N/15mm 이상 90N/15mm 이하가 되도록 함으로써 필름 파단을 억제하고 롤 형태 안정성을 유지할 수 있는 반도체용 점접착시트 및 그의 제조 방법을 제공하는 것이다.
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公开(公告)号：KR1020120065892A
公开(公告)日：2012-06-21
申请号：KR1020100127234
申请日：2010-12-13
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J11/04 , H01L21/58 , H01L21/683
CPC classification number: C09J7/22 , C09J7/26 , C09J11/04 , C09J2201/36 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: An adhesive film for semiconductor is provided to have double-layered structure which have different physical properties from each other, thereby having excellent separation properties in dicing process and excellent wire penetration performance in packaging process, and capable of remarkably reducing foamable void. CONSTITUTION: An adhesive film for semiconductor comprises a first adhesive layer(102) in which silica(112) with first average diameter is contained, a second adhesive layer(104) in which silica(114) with second average diameter larger than the first average diameter, laminated on the first adhesive layer. The modulus ratio of the first adhesive layer to the second adhesive layer at 150°C is 1-5. The silica is spherical silica. The first average diameter is 0.01-1.0 micron. The second average diameter is 0.1-5.0 micron. The silica content of the first adhesive layer is 20-40 weight% based on the whole first adhesive layer.
Abstract translation: 目的：提供一种用于半导体的粘合膜以具有彼此具有不同物理性质的双层结构，从而在切割过程中具有优异的分离性能和优异的包装工艺中的丝穿透性能，并且能够显着降低发泡性空隙。 构成：用于半导体的粘合膜包括其中包含第一平均直径的二氧化硅（112）的第一粘合剂层（102），第二粘合剂层（104），其中第二平均直径大于第一平均直径的二氧化硅（114） 直径，层压在第一粘合剂层上。 第一粘合剂层与第二粘合层在150℃下的模量比为1-5。 二氧化硅是球形二氧化硅。 第一个平均直径为0.01-1.0微米。 第二平均直径为0.1-5.0微米。 第一粘合剂层的二氧化硅含量相对于整个第一粘合剂层为20-40重量％。
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公开(公告)号：KR1020100067558A
公开(公告)日：2010-06-21
申请号：KR1020080126166
申请日：2008-12-11
Applicant: 제일모직주식회사
IPC: C09J133/08
CPC classification number: C09J133/08 , C09J4/00 , C09J2203/30 , C09J2423/006
Abstract: PURPOSE: A photo-curable adhesive composition is provided to reduce delamination force of adhesive layers after UV hardening by including a UV-curable acrylate having a hydroxyl group and a vinyl group at the same time. CONSTITUTION: A photo-curable adhesive composition comprises UV-curable acrylate including a hydroxyl group and vinyl group 3-50 parts by weight, thermosetting material 0.5-5 parts by weight, and photopolymerization initiator 0.1-3 parts by weight based on 100.0 parts by weight of an acrylic adhesive binder including the vinyl group. The acrylic adhesive binder includes an acrylic monomer, a hydroxyl monomer, and an epoxy monomer. A dicing film includes a base film(100) and an adhesive layer which is formed on the base film.
Abstract translation: 目的：提供光固化性粘合剂组合物，以通过同时包含具有羟基和乙烯基的可紫外线固化的丙烯酸酯来降低UV硬化后的粘合剂层的分层力。 构成：光固化性粘合剂组合物包含含有羟基和3-50重量份乙烯基的紫外线固化性丙烯酸酯，0.5-5重量份的热固性物质，以及光聚合引发剂0.1-3重量份，基于100.0重量份 包含乙烯基的丙烯酸粘合剂粘合剂的重量。 丙烯酸类粘合剂粘合剂包括丙烯酸类单体，羟基单体和环氧单体。 切割膜包括基膜（100）和形成在基膜上的粘合层。
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公开(公告)号：KR1020090131222A
公开(公告)日：2009-12-28
申请号：KR1020080057089
申请日：2008-06-17
Applicant: 제일모직주식회사
IPC: C09J5/08 , C09D133/08
CPC classification number: C09J5/08 , C09J11/06 , C09J133/00 , C09J2203/326 , C09J2205/31
Abstract: PURPOSE: A photocurable pressure-sensitive adhesive composition is provided to ensure excellent adhesive force with a ring frame, wafer or die bonding film, good pickup property under a photocurable condition that energy quantity is not constant. CONSTITUTION: A photocurable pressure-sensitive adhesive composition comprises 100.0 parts by weight of an acrylic pressure-sensitive adhesive binder solid containing a vinyl group; 1-30 parts by weight of an esterified quinonediazide; 0.5-5 parts by weight of a thermosetting material; and 0.1-3 parts by weight of a photopolymerizable initiator. The dicing film comprises a base film(100) and a photocurable pressure-sensitive adhesive layer formed on the upper side of the base film.
Abstract translation: 目的：提供可光固化的压敏粘合剂组合物，以确保环形框架，晶片或芯片接合薄膜具有优异的粘合力，在能量不恒定的光固化条件下具有良好的拾取性能。 构成：可光固化的压敏粘合剂组合物包含100.0重量份的含乙烯基的丙烯酸类压敏粘合剂粘合剂固体; 1-30重量份的酯化醌二叠氮化物; 0.5-5重量份的热固性材料; 和0.1-3重量份的光聚合引发剂。 切割膜包括基膜（100）和形成在基膜上侧的光固化性粘合剂层。
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公开(公告)号：KR1020090068822A
公开(公告)日：2009-06-29
申请号：KR1020070136593
申请日：2007-12-24
Applicant: 제일모직주식회사
IPC: C09J133/00 , C09J163/00 , C09J183/04 , C09J7/02
CPC classification number: C09J133/06 , C09J7/35 , C09J163/00 , C09J183/04 , C09J2203/326
Abstract: An adhesive film for die bonding in a semiconductor assembly is provided to prevent burrs generated through deformation of an adhesive film due to excellent cuttability and flexibility and to ensure excellent pick-up property. An adhesive film for die bonding in a semiconductor assembly has 50-150 % of elongation at break measured at 1000 mm/min tension rate in a tension condition of 25°C and 10-1000 mm/min, and satisfies chemical formula: (E10-E1000 ) / (log10 10 - log10 1000)
Abstract translation: 提供了一种用于半导体组件中的芯片接合的粘合膜，用于防止由于良好的可切割性和柔性而使粘合剂膜变形而产生的毛刺，并且确保优异的拾取性能。 在25℃和10-1000mm / min的张力条件下，用于在半导体组件中的芯片粘合的粘合膜具有在1000mm / min的拉伸速率下测量的断裂伸长率的50-150％，并且满足化学式：（E10 -E1000）/（log10 10-log10 1000）<= -200，断裂伸长率E100以10mm / min的断裂伸长率E1000。 用于半导体组件中的芯片接合的粘合膜组合物包括丙烯酸聚合物10-85重量％，环氧树脂5-40重量％，酚型硬化树脂5-40重量％，固化催化剂0.01-10重量％，硅烷偶联剂 0.01-10重量％和填料0.1-60重量％。
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Patent Agency Ranking
公开(公告)号：KR1020090055267A
公开(公告)日：2009-06-02
申请号：KR1020070122101
申请日：2007-11-28
Applicant: 제일모직주식회사
CPC classification number: H01L24/27 , C08L2666/14 , C09J7/20 , C09J133/062 , C09J163/00 , C09J2203/326 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/29393 , H01L2224/83191 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01072 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , H01L2924/181 , Y10T428/2848 , H01L2924/0635 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/05432 , H01L2924/0532 , H01L2924/05032 , H01L2924/05442 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
Abstract: An adhesive composition is provided to minimize the generation of gap or void generated form the interface in bonding an adhesive film for die bonding and a semiconductor wafer and to form a film by increasing tensile strength of the film. An adhesive composition for semiconductor assembly comprises a binder part, a hardened part and solvent. The solvent is a binary mixed solvent consisting of low-boiling-point solvent of 40-100 °C and high-boiling-point solvent of 140-200 °C. The binder part is an acrylic polymer, an NCO-added polymer or an epoxy-added polymer. The hardened part is epoxy resin, phenol type hardened resin, urethane resin, silicon resin, polyester resin, amine-based hardened resin, melanin hardened resin, urea hardened resin or acid anhydride-based hardened resin.
Abstract translation: 提供粘合剂组合物以最小化在粘合用于芯片接合的粘合剂膜和半导体晶片时从界面产生的间隙或空隙的产生，并且通过增加膜的拉伸强度来形成膜。 用于半导体组件的粘合剂组合物包括粘合剂部分，硬化部分和溶剂。 溶剂是由40-100℃的低沸点溶剂和140-200℃的高沸点溶剂组成的二元混合溶剂。 粘合剂部分是丙烯酸聚合物，加入NCO的聚合物或加入环氧树脂的聚合物。 硬化部分是环氧树脂，苯酚型硬化树脂，聚氨酯树脂，硅树脂，聚酯树脂，胺类硬化树脂，黑色素硬化树脂，尿素硬化树脂或酸酐类硬化树脂。
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公开(公告)号：KR1020090025821A
公开(公告)日：2009-03-11
申请号：KR1020070090953
申请日：2007-09-07
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/10 , C09J163/00 , C09J11/00
CPC classification number: C09J133/08 , C09J11/06 , C09J163/00
Abstract: A photo-curable adhesive composition is provided to excellent adhesive force to a ring frame, wafer or adhesive film for die bonding, and to ensure excellent curability and releasability. A photo-curable adhesive composition comprise (A) photo-curable acrylic adhesion binder 90~97 parts by weight containing a vinyl group, (B) photoinitiator 0.5~1 parts by weight and (C) thermosetting material 3~7 parts by weight. The photo-curable acrylic adhesion binder containing a vinyl group comprises an epoxy group 2~5 mole % and has the hydroxyl value of 15~30 and the acid value of 1 or less.
Abstract translation: 提供光固化性粘合剂组合物，用于对环形框架，晶片或用于芯片接合的粘合剂膜具有优异的粘附力，并且确保优异的固化性和脱模性。 光固化性粘合剂组合物包含（A）含有乙烯基的90〜97重量份的光固化丙烯酸粘合粘合剂，（B）0.5〜1重量份的光引发剂和（C）热固性材料3〜7重量份。 含有乙烯基的光固化型丙烯酸类粘合粘合剂包含2〜5摩尔％的环氧基，羟基值为15〜30，酸值为1以下。
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公开(公告)号：KR100884079B1
公开(公告)日：2009-02-19
申请号：KR1020060136694
申请日：2006-12-28
Applicant: 제일모직주식회사
IPC: C09D133/08 , C09D133/06 , C09D5/00
Abstract: 투명재질의 고분자 플라스틱 기재의 표면에 흘림코팅을 이용하여 코팅한 후 자외선 경화시켜 주었을 때, 내스크래치성, 내열성, 강도, 및 광학적 성질에서 모두 우수한 코팅막을 얻을 수 있는 하드코팅용 조성물이 제공된다. 본 발명의 하드코팅용 조성물은 다관능 아크릴레이트 올리고머 1~30 중량%, 다관능 아크릴레이트 모노머 5~40중량%, 다관능 포스파젠계 모노머 5~40중량%, 광개시제 0.1~10 중량%, 및 잔량으로서 용제를 포함한다.
하드코팅, 내스크래치성, 내열성, 고강도, 다관능 아크릴레이트, 다관능 포스파젠-
公开(公告)号：KR1020080064517A
公开(公告)日：2008-07-09
申请号：KR1020070001510
申请日：2007-01-05
Applicant: 제일모직주식회사
CPC classification number: G01N3/46 , G01N27/041 , G01R1/067
Abstract: A probe needle capable of detecting an oxidized layer on a metal plate is provided to easily and accurately provide a worker with information about the oxidized layer on the metal. A probe needle capable of detecting an oxidized layer on a metal plate includes a body(102), a needle(104), and a coating layer(106). The body is a stick made of a hard material such as stainless steel. The needle is elongated from the body and comes into contact with the oxidized layer on the metal plate for measuring resistance of the oxidized layer. The coating layer is coated on the needle and is made of soft conductive material for preventing damage to the oxidized layer.
Abstract translation: 提供能够检测金属板上的氧化层的探针，以容易且准确地向工作者提供关于金属上的氧化层的信息。 能够检测金属板上的氧化层的探针包括主体（102），针（104）和涂层（106）。 身体是由硬质材料如不锈钢制成的棍子。 针从身体伸长并与金属板上的氧化层接触以测量氧化层的电阻。 涂层涂覆在针上，由柔软的导电材料制成，以防止氧化层损坏。
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公开(公告)号：KR101374365B1
公开(公告)日：2014-03-17
申请号：KR1020100136071
申请日：2010-12-27
Applicant: 제일모직주식회사
IPC: C09J9/00 , C09J163/00 , C09J133/04 , C09J7/02
CPC classification number: H01L24/29
Abstract: 본 발명의 반도체용 접착 조성물은 125℃에서 60분 경화후 압축강도가 100~1500 gf/mm
2 인 것을 특징으로 한다. 상기 반도체용 접착 조성물은 동종 칩 접착 후 반드시 거쳐야 하는 경화(semi-cure)공정을 단축 및 생략할 수 있는 특성을 지닌다. 상기 반도체용 접착 조성물은 다이 접착 후 와이어 본딩시 최소한의 모듈러스를 확보함으로서, 발포성 보이드를 최소화하고, 다이 접착 후 실시하는 다양한 경화공정 후에도 잔존 경화율을 부여하여 EMC 몰딩시 원활한 보이드 제거를 달성할 수 있다.
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