公开(公告)号：DE68918380D1

公开(公告)日：1994-10-27

申请号：DE68918380

申请日：1989-07-12

Applicant: IBM

Inventor： ARLDT BRIAN D ,  BRUHN PETER H ,  BULLER LAWRENCE M ,  LEDERMANN PETER G ,  LINAM STEPHEN D ,  MCNELIS BARBARA J ,  MOK LAWRENCE S ,  MOSKOWITZ PAUL A

IPC: H01L23/36 ,  H01L23/40

Abstract: An integrated circuit chip package is described wherein the chip (18) has an active face including a plurality of input and output pads (30). The chip is mounted face down on a plurality of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board (26). A convective heat sink (32) is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden accelerations. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points (60) which are physically connected to the underlying circuit board via resilient connecting means.

公开(公告)号：BR9301497A

公开(公告)日：1993-10-26

申请号：BR9301497

申请日：1993-04-12

Applicant: IBM

Inventor： BRADY MICHAEL J ,  FARREL CURTIS E ,  KANG SUNG K ,  MARINO JEFFREY R ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  TOOLE TERRENCE R O ,  PURUSHOTHAMAN SAMPATH ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L21/40

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：CA2089791A1

公开(公告)日：1993-10-25

申请号：CA2089791

申请日：1993-02-18

Applicant: IBM

Inventor： BRADY MICHAEL J ,  FARRELL CURTIS E ,  KANG SUNG K ,  MARINO JEFFREY R ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  O'TOOLE TERRENCE R ,  PURUSHOTHAMAN SAMPATH ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.