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11.发明专利
公开(公告)号：CA2472750A1
公开(公告)日：2003-07-24
申请号：CA2472750
申请日：2002-12-19
Applicant: IBM
Inventor： WALKER GEORGE FREDERICK , VOLANT RICHARD PAUL , MAGERLEIN JOHN HAROLD , SAMBUCETTI CARLOS JUAN , PURUSHOTHAMAN SAMPATH , PETRARCA KEVIN SHAWN
IPC: H01L21/60 , H01L21/00 , H01L23/485 , H01L23/498 , H05K1/03 , H05K1/11 , H05K3/34 , H05K3/38
Abstract: A system for interconnecting a set of device chips by means of an array of microjoints disposed on an interconnect carrier is taught. The carrier is provided with a dense array of microjoint receptacles with an adhesion layer, barrier layer and a noble metal layer; the device wafers are fabricated with an array of microjoining pads comprising an adhesion layer, barrier layer and a fusible solder layer with pads being located at matching locations in reference to the barrier receptacles; said device chips are joined to said carrier through the microjoint arrays resulting in interconnections capable of very high input/output density and inter-chip wiring density.
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公开(公告)号：HK1006241A1
公开(公告)日：1999-02-19
申请号：HK98105469
申请日：1998-06-17
Applicant: IBM
Inventor： BROUILLETTE GUY PAUL , DANOVITCH DAVID HIRSCH , LIEHR MICHAEL , MOTSIFF WILLIAM THOMAS , ROLDAN JUDITH MARIE , SAMBUCETTI CARLOS JUAN
Abstract: An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.
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公开(公告)号：BR8900664A
公开(公告)日：1989-10-10
申请号：BR8900664
申请日：1989-02-15
Applicant: IBM
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公开(公告)号：DE3375588D1
公开(公告)日：1988-03-10
申请号：DE3375588
申请日：1983-07-04
Applicant: IBM
Inventor： BUPP JAMES RUSSELL , MARKOVICH VOYA , NAPP TRACY ELLEN , SAMBUCETTI CARLOS JUAN
Abstract: A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and or on the surfaces of the substrate.
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Patent Agency Ranking16.发明专利
公开(公告)号：CA2472750C
公开(公告)日：2009-02-03
申请号：CA2472750
申请日：2002-12-19
Applicant: IBM
Inventor： VOLANT RICHARD PAUL , SAMBUCETTI CARLOS JUAN , PURUSHOTHAMAN SAMPATH , PETRARCA KEVIN SHAWN , WALKER GEORGE FREDERICK , MAGERLEIN JOHN HAROLD
IPC: H01L21/60 , H01L21/00 , H01L23/485 , H01L23/498 , H05K1/03 , H05K1/11 , H05K3/34 , H05K3/38
Abstract: A system for interconnecting a set of device chips by means of an array of microjoints disposed on an interconnect carrier is taught. The carrier is provided with a dense array of microjoint receptacles with an adhesion layer , barrier layer and a noble metal layer; the device wafers are fabricated with an array of microjoining pads comprising an adhesion layer, barrier layer an d a fusible solder layer with pads being located at matching locations in reference to the barrier receptacles; said device chips are joined to said carrier through the microjoint arrays resulting in interconnections capable of very high input/output density and inter-chip wiring density.
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公开(公告)号：MY125463A
公开(公告)日：2006-08-30
申请号：MYPI9703540
申请日：1997-08-04
Applicant: IBM
Inventor： BROUILLETTE GUY PAUL , DANOVITCH DAVID HIRSCH , LIEHR MICHAEL , MOTSIFF WILLIAM THOMAS , ROLDAN JUDITH MARIE , SAMBUCETTI CARLOS JUAN , SARAF RAVI F
Abstract: AN INTERCONNECT SYSTEM THAT HAS LOW ALPHA PARTICLE EMISSION CHARACTERISTICS FOR USE IN AN ELECTRONIC DEVICE INCLUDES A SEMICONDUCTOR CHIP (12) THAT HAS AN UPPER SURFACE AND SPACED APART ELECTRICALLY RESISTIVE BUMPS (26,36) POSITIONED ON CONDUCTIVE REGIONS OF THE UPPER SURFACE, THE ELECTRICALLY RESISTIVE BUMPS ARE MADE OF A COMPOSITE MATERIAL OF A POLYMER AND METAL PARTICLES, AND A SUBSTRATE (10) THAT HAS CONDUCTIVE REGIONS BONDED TO THE ELECTRICALLY RESISTIVE BUMPS IN A BONDING PROCESS WHEREIN THE ELECTRICALLY RESISTIVE BUMPS CONVERT TO ELECTRICALLY CONDUCTIVE BUMPS AFTER THE BONDING PROCESS.(FIG.3)
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公开(公告)号：DE3770493D1
公开(公告)日：1991-07-11
申请号：DE3770493
申请日：1987-02-27
Applicant: IBM
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公开(公告)号：IT1149832B
公开(公告)日：1986-12-10
申请号：IT2131980
申请日：1980-04-11
Applicant: IBM
Inventor： SAMBUCETTI CARLOS JUAN
Abstract: An improved electrolytic printing fluid is described. The printing fluid is comprised of an agent for the catalyzation of the electro-oxidation of a color forming agent therein. The fluid may include an agent which can form a clathrate complex with the color forming agent, as well as an agent which prevents discoloring of the paper when said fluid is coated on the same. The coated paper is subjected to an electrolytic printing method using non-consumable electrode.
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