公开(公告)号：DE69115106D1

公开(公告)日：1996-01-18

申请号：DE69115106

申请日：1991-02-07

Applicant: IBM

Inventor： BEAMAN BRIAN SAMUEL ,  FOGEL KEITH EDWARD ,  KIM JUNGIHL ,  MAYR WOLFGANG ,  SHAW JANE MARGARET ,  WALKER GEORGE FREDERICK

IPC: G01R1/067 ,  G01R1/04 ,  G01R1/073 ,  G01R31/26 ,  H01R4/26 ,  H01R13/24 ,  H01R23/72

Abstract: An electrical connector is described for making contact with a plurality of convex and deformable contacts (40, 46) on an electronic device (38). The electrical connector comprises a substrate having a plurality of conductors (10, 12, 14) which extend above its surface. A polymeric material (20) is disposed on the surface of the substrate and has openings which expose the conductors, each opening sized to receive one of the convex, deformable contacts, and to enable electrical connection between the exposed conductors and the deformable contacts. A mechanism is provided for urging the deformable contacts on the electronic device against the exposed conductors. The mechanism exerts sufficient force between the device and the conductors to cause some deformation of the convex contact areas by the conductors.

公开(公告)号：DE3853094T2

公开(公告)日：1995-08-10

申请号：DE3853094

申请日：1988-03-15

Applicant: IBM

Inventor： CUOMO JEROME JOHN ,  GUARNIERI C RICHARD ,  ROSENBERG ROBERT ,  SEK-ON YEE DENNIS ,  WALKER GEORGE FREDERICK

IPC: C01G1/00 ,  C04B41/87 ,  C23C4/10 ,  H01B12/06 ,  H01B13/00 ,  H01L39/24 ,  H01L39/12

公开(公告)号：DE68913823D1

公开(公告)日：1994-04-21

申请号：DE68913823

申请日：1989-04-27

Applicant: IBM

Inventor： CUOMO JEROME JOHN ,  KANG SUNG KWON ,  KIM JUNGIHL ,  LAURO PAUL ,  MIERSCH EKKEHARD FRITZ ,  RITSKO JOHN JAMES ,  SAXENMEYER GEORGE JOHN ,  WALKER GEORGE FREDERICK

IPC: H01R13/02 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H05K3/32

公开(公告)号：HUT76997A

公开(公告)日：1998-01-28

申请号：HU9700404

申请日：1995-08-08

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  COFINO THOMAS ,  HEINRICH HARLEY KENT ,  JOHNSON GLEN WALDEN ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK

IPC: H01Q1/40 ,  G01V15/00 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/26 ,  H01Q21/28 ,  H04B1/38 ,  H04B1/59

Abstract: A radiofrequency identification tag has a semiconductor chip with radio frequency circuit, logic, memory circuits, and further includes an antenna that is mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination can be sealed with an organic film covering.

公开(公告)号：HUT76992A

公开(公告)日：1998-01-28

申请号：HU9701699

申请日：1995-09-20

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  COFINO THOMAS ANTHONY ,  HEINRICH HARLEY KENT ,  JOHNSON GLEN WALDEN ,  MOSKOWITZ PAUL ANDREW ,  MURHPY PHILIP ,  WALKER GEORGE FREDERICK

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59

Abstract: A radio frequency tag and its antenna structure are manufactured using wire bonding. A semiconductor chip is placed and attached upon an organic film substrate. The antenna consisting of one or more thin wires is created on the substrate and connected to contacts on the chip using a wire bonding machine. Alternate embodiments using a plurality of semiconductors on a strip of substrate are also disclosed. The chip may be protected with encapsulant and the chip and antenna combination may be sealed between layers of organic film.

公开(公告)号：ZA957085B

公开(公告)日：1996-03-11

申请号：ZA957085

申请日：1995-08-23

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  HEINRICH HARLEY KENT ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK ,  COFINO THOMAS ANTHONY ,  JOHNSON GLEN WALDEN ,  MURPHY PHILIP

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59 ,  H05K

Abstract: A radio frequency tag and its antenna structure are manufactured using wire bonding. A semiconductor chip is placed and attached upon an organic film substrate. The antenna consisting of one or more thin wires is created on the substrate and connected to contacts on the chip using a wire bonding machine. Alternate embodiments using a plurality of semiconductors on a strip of substrate are also disclosed. The chip may be protected with encapsulant and the chip and antenna combination may be sealed between layers of organic film.

公开(公告)号：ZA9507085B

公开(公告)日：1996-03-11

申请号：ZA9507085

申请日：1995-08-23

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  HEINRICH HARLEY KENT ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK ,  COFINO THOMAS ANTHONY ,  JOHNSON GLEN WALDEN ,  MURPHY PHILIP

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59 ,  H05K

CPC classification number: H01L24/85 ,  G06K7/086 ,  G06K19/067 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01Q1/2225 ,  H01Q7/00 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：MY134716A

公开(公告)日：2007-12-31

申请号：MYPI9300721

申请日：1993-04-21

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  RIELEY SHELDON COLE ,  WALKER GEORGE FREDERICK ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT ,  MIKALSEN DONALD JOSEPH ,  MOSKOWITZ PAUL ANDREW ,  O'SULLIVAN EUGENE JOHN ,  O'TOOLE TERRENCE ROBERT ,  PURUSHOTHAMAN SAMPATH

IPC: H01L21/60 ,  H01L23/485 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: SILICON AND GERANIUM CONTAINING MATERIALS ARE USED AT SURFACE OF CONDUCTORS IN ELECTRONIC DEVICES. SOLDER CAN BE FLUXLESSLY BONDED AND WIRES CAN BE WIRED BONDED TO THESE SURFACES. THESE MATERIAL ARE USED AS A SURFACE COATING FOR LEAD FRAMES FOR PACKAGING INTEGRATED CIRCUIT CHIPS. THESE MATERIALS CAN BE DECAL TRANSFERRED ONTO CONDUCTOR SURFACES OR ELECTROLESSLY OR ELECTROLYTICALLY DISPOSED THEREON.(FIG. 1)

公开(公告)号：SG33351A1

公开(公告)日：1996-10-18

申请号：SG1995000334

申请日：1995-04-26

Applicant: IBM

Inventor： WALKER GEORGE FREDERICK ,  JOHNSON GLEN WALDEN ,  HEINRICH HARLEY KENT ,  BRADY MICHAEL JOHN ,  MOSKOWITZ PAUL ANDREW ,  COFINO THOMAS

IPC: H01Q23/00

公开(公告)号：DE68918927T2

公开(公告)日：1995-04-20

申请号：DE68918927

申请日：1989-12-18

Applicant: IBM

Inventor： AHN KIE YEUNG ,  KIM JUNGIHL ,  LAURO PAUL ,  WALKER GEORGE FREDERICK

IPC: B41M5/26 ,  G11B7/24 ,  G11B7/242 ,  G11B7/243 ,  G11B7/244 ,  G11B7/251 ,  G11B7/26

Abstract: A structure, and method of fabrication thereof, having a polymeric layer (20) containing a pattern of oxide particles (44) embedded therein. The regions (26, 28, 32, 38, 40) of the polymeric material (20) having the oxide particles (44) therein have an optical reflectivity or transmitivity which is different than the optical reflectivity or transmitivity of the regions (30, 34, 36, 42) of the polymeric material (20) without the oxide particles (44). The structure can be used as an optical storage device.