公开(公告)号：DE10240461A1

公开(公告)日：2004-03-11

申请号：DE10240461

申请日：2002-08-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L21/60 ,  H01L25/065

Abstract: Electronic component comprises a semiconductor chip (3) having chip contacts (4) on its contact surfaces. The chip contacts are mechanically fixed on contact connecting surfaces (5) of a rewiring structure (6) and electrically connected to the rewiring structure. The rewiring structure is formed as a region of a structured metal plate or structured metal layer of a metal-laminated base plate. Independent claims are also included for the following: (1) Process for the production of an electronic component; and (2) Panel for the electronic component having a shape-stable plastic plate.

公开(公告)号：DE102017206744B4

公开(公告)日：2022-07-28

申请号：DE102017206744

申请日：2017-04-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  STEIERT MATTHIAS

IPC: B81B7/02 ,  B81B1/00 ,  B81C1/00 ,  H01L23/34

Abstract: Vorrichtung (10, 20, 30, 40) mit:einem Substrat (11), wobei auf einer ersten Seite (11A) des Substrats (11) ein MEMS-Baustein (12) angeordnet ist, dessen Ausgangssignal sich bei einer Temperaturänderung verändert, wobei ein Loch (18) in dem Substrat (11) vorgesehen ist, das zum Austausch von Luft mit der Umgebung dient und wobei der MEMS-Baustein (12) ein MEMS-Mikrofon ist,eine auf der ersten Seite (11A) des Substrats (11) angeordnete Gehäusestruktur (13) mit einer Ausnehmung (14) in der der MEMS-Baustein (12) angeordnet ist, wobei die Gehäusestruktur (13) Metall aufweist und eine Abschirmung gegen externe elektromagnetische Strahlung bereitstellt, undeine an zumindest der oberen Außenseite (19) der Gehäusestruktur (13) angebrachte thermisch aktive Schicht (15), die die Wärmekapazität der Vorrichtung (10, 20, 30, 40) erhöht,wobei die Schicht (15) eine Temperaturleitfähigkeit von weniger als1,0⋅10−6m2s,oder von weniger als0,5⋅10−6m2s,oder von weniger als0,2⋅10−6m2saufweist.

公开(公告)号：DE102009010199A1

公开(公告)日：2009-09-10

申请号：DE102009010199

申请日：2009-02-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LEE TECK SIM ,  YONG WAE CHET ,  GOLLER BERND ,  LIM BOON KIAN

IPC: H01L23/31 ,  H01L21/56

公开(公告)号：DE50311482D1

公开(公告)日：2009-06-10

申请号：DE50311482

申请日：2003-06-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER ROBERT ,  ERTLE WERNER ,  FROHNMUELLER TILL ,  GOLLER BERND ,  GREIDERER REINHARD ,  NAGLER OLIVER ,  SCHMECKEBIER OLAF ,  STADLER WOLFGANG

IPC: H01L23/485

Abstract: An integrated semiconductor structure has a substrate, a semiconductor element located on the substrate, a pad metal, metal layers located between the pad metal and the substrate, and insulation layers that separate the metal layers from one another. The pad metal extends over at least-part of the semiconductor element. Below the surface of the pad metal, at least the top two metal layers include two or more adjacent interconnects.

公开(公告)号：DE50310810D1

公开(公告)日：2009-01-02

申请号：DE50310810

申请日：2003-07-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ERTLE WERNER ,  GOLLER BERND ,  HORN MICHAEL ,  KOTHE BERND

IPC: H01L23/58

Abstract: A semiconductor wafer having many chips has electrically connected contact (1) and test (2) surfaces with the contacts being in a passive region (5) of the upper chip (1) where there are no IC components. The test surfaces are in a second, active, region (7) which comprise active components. An Independent claim is also included for an after treatment process for the wafer above.

公开(公告)号：DE10142118B4

公开(公告)日：2007-07-12

申请号：DE10142118

申请日：2001-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L25/065 ,  H01L23/50

Abstract: An electronic component has a carrier substrate to accommodate two semiconductor chips that are connected to each other. The second semiconductor chip rests with two opposite marginal supporting regions on an upper side of the carrier substrate. The first semiconductor chip is disposed at a distance from a frame of the carrier substrate, in a central recess in the latter. A process for the production of the electronic component is further described.

公开(公告)号：DE102005056569A1

公开(公告)日：2007-06-06

申请号：DE102005056569

申请日：2005-11-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  GOLLER BERND ,  OFNER GERALD

IPC: H01L23/50 ,  H01L23/498

Abstract: An electronic component includes a substrate having contacts and a chip having contacts and a passivation layer disposed on an active side of the chip. The active side of the chip is mounted on a first surface of the substrate by flip chip technology such that the contacts of the chip are electrically connected to the contacts of the substrate by means of connecting elements. Elastic elevations are disposed between the contacts of the chip and the contacts of the substrate and an underfiller is disposed in an intermediate space between the chip and the substrate and between the elastic elevations. The underfiller and the elastic elevations have substantially the same modulus of elasticity.

公开(公告)号：DE10243947B4

公开(公告)日：2007-02-01

申请号：DE10243947

申请日：2002-09-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/31 ,  H01L23/49

Abstract: The electronic component (2) comprises a flat chip carrier (6) assigned to a semiconductor chip (4). The contact areas (43) on active chip surface (41) and the contact terminal areas (63) on an upper side (61) of the chip carrier, are formed by elastic strips (81) of material that can undergo microstructuring. The strips are provided with an electrically conductive coating. An Independent claim is also included for electronic component manufacturing method.

公开(公告)号：DE10328265A1

公开(公告)日：2005-01-27

申请号：DE10328265

申请日：2003-06-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: G01J1/02 ,  H01L23/48 ,  H01L23/538 ,  H01L31/0203 ,  H04N5/225

Abstract: A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

公开(公告)号：DE10240460A1

公开(公告)日：2004-03-11

申请号：DE10240460

申请日：2002-08-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/58 ,  H01L21/60 ,  H01L25/065