12.
    发明专利
    未知

    公开(公告)号:DE19947117A1

    公开(公告)日:2001-04-12

    申请号:DE19947117

    申请日:1999-09-30

    Abstract: According to the invention, a first source-drain region (121), a channel region (13) and a second source-drain region (122) are located in a semiconductor substrate (11). A dielectric layer (14) covers at least the surface of the channel region and parts of the first source-drain region. On the surface of said dielectric layer, a ferroelectric layer (17) is provided between two polarization electrodes (16, 18). A gate electrode is positioned on the surface of the dielectric layer. The thickness of the dielectric layer is measured in such a way that a remanent polarization of the ferroelectric layer which is aligned between the two polarization electrodes, generates compensation charges in one section of the channel region. The ferroelectric transistor is suitable for use a memory cell in a memory cell arrangement.

    13.
    发明专利
    未知

    公开(公告)号:DE19821901C2

    公开(公告)日:2002-05-08

    申请号:DE19821901

    申请日:1998-05-15

    Abstract: An integrated electrical circuit has at least one memory cell, in which the memory cell is disposed in the region of a surface of a semiconductor substrate. The memory cell contains at least two inverters that are electrically connected to one another. The inverters each contain two complementary MOS transistors having a source, a drain and a channel, the channels of the complementary MOS transistors having different conductivity types. According to the invention, the integrated electrical circuit is constructed in such a way that the inverters are disposed perpendicularly to the surface of the semiconductor substrate. The source, the drain and the channel of the complementary MOS transistors are formed by layers which lie one on top of the other and are disposed in such a way that the complementary MOS transistors are situated one above the other. The invention furthermore relates to a method for fabricating the integrated electrical circuit.

    19.
    发明专利
    未知

    公开(公告)号:DE59906526D1

    公开(公告)日:2003-09-11

    申请号:DE59906526

    申请日:1999-05-03

    Abstract: A substrate made from silicon has a first region and a second region. Through pores are formed in the first region. Pores that do not traverse the substrate are provided in the second region. The production of the work piece is performed with the aid of electrochemical etching of the pores. The entire surface of the substrate is covered with a mask layer that is structured photolithographically on the rear of the substrate. The bottoms of the pores in the second region are etched clear, preferably using KOH.

Patent Agency Ranking