公开(公告)号：MY136159A

公开(公告)日：2008-08-29

申请号：MYPI20042527

申请日：2004-06-25

Applicant: LAM RES CORP

Inventor： RAVKIN MIKE ,  BOYD JOHN M ,  DORDI YEZDI N ,  REDEKER FRED C ,  LARIOS JOHN M DE

IPC: C25D5/02 ,  C25D5/22 ,  C25D7/12 ,  H01L21/00 ,  H01L21/288

Abstract: AN ELECTROPLATING APPARATUS (100) FOR DEPOSITING A METALLIC LAYER ON A SURFACE OF A WAFER (104) IS PROVIDED. IN ONE EXAMPLE, A PROXIMITY HEAD (102) CAPABLE OF BEING ELECTRICALLY CHARGED AS AN ANODE IS PLACED IN CLOSE PROXIMITY TO THE SURFACE OF THE WAFER (104).A PLATING FLUID IS PROVIDED BETWEEN THE WAFER (104) AND THE PROXIMITY HEAD (102) TO CREATE LOCALIZED METALLIC PLATING.

公开(公告)号：MY135738A

公开(公告)日：2008-06-30

申请号：MYPI20001965

申请日：2000-05-05

Applicant: LAM RES CORP

Inventor： LI XU ,  ZHAO YUEXING ,  HYMES DIANE J ,  LARIOS JOHN M DE

IPC: C09K13/00

Abstract: A CLEANING SOLUTION, METHOD, AND APPARATUS FOR CLEANING SEMICONDUCTOR SUBSTRATES AFTER CHEMICAL MECHANICAL POLISHING OF COPPER FILMS IS DESCRIBED. THE PRESENT INVENTION INCLUDES A CLEANING SOLUTION WHICH COMBINES DEIONIZED WATER, AN ORGANIC COMPOUND, AND AN AMMONIUM COMPOUND IN AN ACIDIC PH ENVIRONMENT FOR CLEANING THE SURFACE OF A SEMICONDUCTOR SUBSTRATE AFTER POLISHING A COPPER LAYER. SUCH METHODS OF CLEANING SEMICONDUCTOR SUBSTRATES AFTER COPPER CMP ALLEVIATE THE PROBLEMS ASSOCIATED WITH BRUSH LOADING AND SURFACE AND SUBSURFACE CONTAMINATION.(FIG 3)

公开(公告)号：AU2003277052A8

公开(公告)日：2004-04-23

申请号：AU2003277052

申请日：2003-09-29

Applicant: LAM RES CORP

Inventor： REDEKER FRED C ,  WOODS CARL A ,  LARIOS JOHN M DE ,  GARCIA JAMES P ,  RAVKIN MICHAEL

IPC: H01L25/00 ,  B08B1/02 ,  B08B3/04 ,  H01L21/00

Abstract: A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.

公开(公告)号：MY152543A

公开(公告)日：2014-10-31

申请号：MYPI20064619

申请日：2006-12-04

Applicant: LAM RES CORP

Inventor： FREER ERIK M ,  LARIOS JOHN M DE ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

IPC: B08B3/00

Abstract: METHODS FOR CLEANING USING A TRI-STATE BODY (110) ARE DISCLOSED. A SUBSTRATE (112) HAVING A PARTICLE (102) DEPOSITED THEREON IS PROVIDED. A TRI-STATE BODY THAT HAS A SOLID PORTION (108), LIQUID PORTION (106) AND A GAS PORTION (104) IS GENERATED. A FORCE IS APPLIED OVER THE TRI-STATE BODY TO PROMULGATE AN INTERACTION BETWEEN THE SOLID PORTION AND THE PARTICLE. THE TRI-STATE BODY IS REMOVED ALONG WITH THE PARTICLE FROM THE SURFACE OF THE SUBSTRATE. THE INTERACTION BETWEEN THE SOLID PORTION AND THE PARTICLE CAUSING THE PARTICLE TO BE REMOVED ALONG WITH THE TRI-STATE BODY.

公开(公告)号：IL209737A

公开(公告)日：2011-12-29

申请号：IL20973710

申请日：2010-12-02

Applicant: LAM RES CORP ,  LARIOS JOHN M DE ,  GARCIA JAMES P ,  WOODS CARL A ,  RAVKIN MICHAEL ,  REDEKER FRED C

Inventor： LARIOS JOHN M DE ,  GARCIA JAMES P ,  WOODS CARL A ,  RAVKIN MICHAEL ,  REDEKER FRED C

公开(公告)号：MY144394A

公开(公告)日：2011-09-15

申请号：MYPI20045300

申请日：2004-12-22

Applicant: LAM RES CORP

Inventor： LARIOS JOHN M DE ,  OWCZARZ ALEKSANDER ,  SCHOEPP ALAN ,  REDEKER FRITZ

IPC: B08B11/02 ,  B08B3/00 ,  H01L21/00

Abstract: AN APPARATUS FOR USE IN PROCESSING A SUBSTRATE (216) INCLUDES A BRUSH ENCLOSURE (212) EXTENDING OVER A LENGTH (218). THE BRUSH ENCLOSURE (212) IS CONFIGURED TO BE DISPOSED OVER A SURFACE OF THE SUBSTRATE AND HAS AN OPEN REGION (222) THAT IS CONFIGURED TO BE DISPOSED IN PROXIMITY TO THE SUBSTRATE. THE OPEN REGION EXTENDS OVER THE LENGTH OF THE BRUSH ENCLOSURE AND ENABLES FOAM (410) FROM WITHIN THE BRUSH ENCLOSURE TO CONTACT THE SURFACE OF THE SUBSTRATE. A SUBSTRATE CLEANING SYSTEM AND METHOD FOR CLEANING A SUBSTRATE ARE ALSO DESCRIBED.

公开(公告)号：MY142184A

公开(公告)日：2010-10-15

申请号：MYPI20062783

申请日：2006-06-13

Applicant: LAM RES CORP

Inventor： LARIOS JOHN M DE ,  RAVKIN MIKE ,  PARKS JOHN ,  KOROLIK MIKHAIL ,  REDEKER FRED C

IPC: B65G51/16

Abstract: A METHOD FOR TRANSPORTING A SUBSTRATE IS PROVIDED. IN THIS METHOD, A NON-NEWTONIAN FLUID (210) IS PROVIDED AND THE SUBSTRATE (212) IS SUSPENDED IN THE NON-NEWTONIAN FLUID. THE NON-NEWTONIAN FLUID IS CAPABLE OF SUPPORTING THE SUBSTRATE. THEREAFTER, A SUPPLY FORCE IS APPLIED ON THE NON-NEWTONIAN FLUID TO CAUSE THE NON-NEWTONIAN FLUID TO FLOW, WHEREBY THE FLOW IS CAPABLE OF MOVING THE SUBSTRATE ALONG A DIRECTION OF THE FLOW. APPARATUSES AND SYSTEMS FOR TRANSPORTING THE SUBSTRATE USING THE NON-NEWTONIAN FLUID ALSO ARE DESCRIBED.

公开(公告)号：MY140370A

公开(公告)日：2009-12-31

申请号：MYPI20045251

申请日：2004-12-20

Applicant: LAM RES CORP

Inventor： LARIOS JOHN M DE ,  RAVKIN MIKE ,  FARBER JEFFREY ,  KOROLIK MIKHAIL ,  REDEKER FRITZ ,  OWCZARZ ALEKSANDER

IPC: B08B3/00 ,  H01L21/00

Abstract: An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer. such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer. is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

公开(公告)号：MY139627A

公开(公告)日：2009-10-30

申请号：MYPI20051481

申请日：2005-04-01

Applicant: LAM RES CORP

Inventor： RAVKIN MICHAEL ,  SMITH MICHAEL G R ,  LARIOS JOHN M DE ,  REDEKER FRITZ ,  KOROLIK MIKHAIL ,  DIPIETRO CHRISTIAN

IPC: B08B3/00 ,  B08B3/04 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306

Abstract: AMONG THE MANY EMBODIMENT, IN ONE EMBODIMENT, A METHOD FOR PROCESSING A SUBSTRATE (108) IS DISCLOSED WHICH INCLUDES GENERATING A FLUID LAYER ON A SURFACE OF THE SUBSTRATE (108), THE FLUID LAYER DEFINING A FLUID MENISCUS (116). THE GENERATING INCLUDES MOVING A HEAD (106) IN PROXIMITY TO THE SURFACE, APPLYING A FLUID FROM THE HEAD (106) TO THE SURFACE WHILE THE HEAD (106) IS IN PROXIMITY TO THE SURFACE OF THE SUBSTRATE (108) TO DEFINE THE FLUID LAYER, AND REMOVING THE FLUID FROM THE SURFACE THROUGH THE PROXIMITY HEAD BY A VACUUM (312). THE FLUID TRAVELS ALONG THE FLUID LAYER BETWEEN THE HEAD (106) AND THE SUBSTRATE (108) AT A VELOCITY THAT INCREASES AS THE HEAD (106) IS IN CLOSER PROXIMITY TO THE SURFACE.

公开(公告)号：SG149849A1

公开(公告)日：2009-02-27

申请号：SG2009003047

申请日：2006-06-14

Applicant: LAM RES CORP

Inventor： LARIOS JOHN M DE ,  RAVKIN MIKE ,  FARBER JEFFREY ,  KOROLIK MIKHAIL ,  REDEKER FRED C

Abstract: METHOD AND APPARATUS FOR CLEANING A SUBSTRATE USING NON-NEWTONIAN FLUIDS A method for cleaning a substrate is provided. In this method, a flow of non- Newtonian fluid is provided where at least a portion of the flow exhibits plug flow. To remove particles from a surface of the substrate, the surface of the substrate is placed in contact with the portion of the flow that exhibits plug flow such that the portion of the flow exhibiting plug flow moves over the surface of the substrate. Additional methods and apparatuses for cleaning a substrate also are described.