公开(公告)号：WO2004038289A1

公开(公告)日：2004-05-06

申请号：PCT/JP2003/013664

申请日：2003-10-24

Applicant: 森山産業株式会社 ,  森山 秀男 ,  柳田 宗彦

Inventor： 森山 秀男 ,  柳田 宗彦

IPC: F21V19/00

CPC classification number: H05K3/202 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0287 ,  H05K1/0393 ,  H05K3/326 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10106 ,  Y10S362/80

Abstract: 第１の方向に隔置された複数の薄板状の導体（２）と、少なくとも一対の隣接する導体の間に接続された少なくとも１つの光源（４）と、複数の導体を機械的に連結する少なくとも１つの絶縁連結部材（３）とを有し、少なくとも１つの絶縁連結部材は、少なくとも光源が取り付けられる部分において、導体の両面を露出していることを特徴とする発光モジュールが提供される。

Abstract translation: 一种发光模块，其特征在于包括在第一方向上间隔开的多个薄片状导体（2），连接在至少一对相邻导体之间的至少一个光源（4）和至少一个绝缘连接 （3）机械地连接所述多个导体，其中至少一个绝缘连接构件至少在所述光源附接的部分暴露所述导体的两个表面。

公开(公告)号：WO2003036664A1

公开(公告)日：2003-05-01

申请号：PCT/EP2002/011839

申请日：2002-10-23

Applicant: SCHAFFNER EMV AG ,  SIPPOLA, Mika, Matti

Inventor： SIPPOLA, Mika, Matti

IPC: H01F27/28

CPC classification number: H05K3/46 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/2847 ,  H01F41/041 ,  H01F2027/2861 ,  H05K1/118 ,  H05K1/165 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/055

Abstract: The invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three-dimensional structure and its use as an electronics assembly substrate and as a winding for transformers and inductors. When a multilayer structure is manufactured by folding a conductor-insulator-conductor laminate, where the conductor layers to be separated from each other follow each other on opposite sides of the conductor-insulator-conductor laminate in the sections following each other and where the insulator has been removed from the places where the conductor layers are to be connected together after folding, it is possible to manufacture a wide range of three-dimensional multilayer structures where the volume occupied by the windings over the total volume can be maximized. Alternatively, by using the method it is also possible to manufacture a multilayer structure where components have been buried inside. The method makes it also possible to make connections between layers in a flexible manner. Among other issues, the method can be easily automated for mass-production.

Abstract translation: 本发明涉及多层结构的制造，特别涉及三维结构的制造及其作为电子组装基板和用于变压器和电感器的绕组的用途。 当通过折叠导体 - 绝缘体 - 导体层叠体来制造多层结构时，彼此分离的导体层在彼此相邻的部分中的导体 - 绝缘体 - 导体层叠体的相对侧彼此相对，并且绝缘体 已经从折叠后导体层要连接在一起的地方去除，可以制造宽范围的三维多层结构，其中绕组占用的体积可以最大化。 或者，通过使用该方法，也可以制造其中已经将部件埋入其中的多层结构。 该方法还可以以灵活的方式在层之间进行连接。 除了其他问题之外，该方法可以容易地自动化进行批量生产。

公开(公告)号：WO01065595A2

公开(公告)日：2001-09-07

申请号：PCT/IB2001/000555

申请日：2001-02-26

IPC: H01L21/60 ,  H01L21/48 ,  H05K3/00

CPC classification number: H05K3/0032 ,  H01L21/481 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2203/0207 ,  H05K2203/025 ,  H01L2924/00

Abstract: A method of forming an opening or cavity in a substrate (12), for receiving an electronic component, consists of or includes providing a patterned opaque masking layer (21a) on or adjacent a first major surface of the substrate (12), the masking layer (21a) having an opening overlying the position where the cavity is to be made, removing material from the substrate (12) by laser ablation through the opening thereby forming an opening or cavity of a suitable size for receiving said electronic component.

Abstract translation: 在基板（12）中形成用于接收电子部件的开口或空腔的方法由或包括在基板（12）的第一主表面上或附近提供图案化的不透明掩模层（21a），掩模 层（21a）具有覆盖要形成空腔的位置的开口，通过激光烧蚀通过开口从衬底（12）去除材料，从而形成用于接收所述电子部件的合适尺寸的开口或空腔。

公开(公告)号：WO1996015458A1

公开(公告)日：1996-05-23

申请号：PCT/US1995014844

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R01/073

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: A probe card assembly (500) includes a probe card (502), a space transformer (506) having resilient contact structures (probe elements) (524) mounted directly to and extending from terminals (522) on a surface thereof, and an interposer (504) disposed between the space transformer (506) and the probe card (502). The space transformer (506) and interposer are "stacked up" so that the orientation of the space transformer (506), hence the orientation of the tips of the probe elements (524), can be adjusted without changing the orientation of the probe card. Suitable mechanisms (532, 536, 538, 546) for adjusting the orientation of the space transformer (506), and for determining what adjustments to make, are disclosed. Multiple die sites on a semiconductor wafer (508) are readily probed using the disclosed techniques, and the probe elements (524) can be arranged to optimize probing of an entire wafer (508). Composite interconnection elements (200) having a relatively soft core (206) covercoated by a relatively hard shell (218, 220) as the resilient contact structures are described.

Abstract translation: 探针卡组件（500）包括探针卡（502），具有弹性接触结构（探针元件）（524）的空间变换器（506），其直接安装在其表面上并从端子（522）延伸， （504），设置在所述空间变压器（506）和所述探针卡（502）之间。 空间变换器（506）和插入器被“堆叠”，使得可以调节空间变换器（506）的取向，从而可以调节探针元件（524）的尖端的取向而不改变探针卡的取向 。 公开了用于调整空间变换器（506）的取向并用于确定要做出什么调整的适当的机构（532,536,538,546）。 使用所公开的技术容易地探测半导体晶片（508）上的多个裸片位置，并且可以布置探针元件（524）以优化整个晶片（508）的探测。 描述具有由相对较硬的外壳（218,220）作为弹性接触结构覆盖的相对软的芯（206）的复合互连元件（200）。

公开(公告)号：WO1996002068A1

公开(公告)日：1996-01-25

申请号：PCT/US1995008182

申请日：1995-06-29

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  SMITH, John, W.

IPC: H01L21/60

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2224/48

Abstract: A microelectronic connection component includes a dielectric sheet (34) having an area array of elongated, strip-like leads (60). Each lead has a terminal end (66) fastened to the sheet and a tip end (68) detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer (86). The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

Abstract translation: 微电子连接部件包括具有细长带状引线（60）的区域阵列的电介质片（34）。 每个引线具有紧固到片材的末端（66）和可从片材上拆卸的尖端（68）。 每个引线从其终端到其尖端水平平行地延伸。 尖端附接到第二元件，例如另一个电介质片或半导体晶片（86）。 然后，第一和第二元件相对于彼此移动，以使每个引线的尖端垂直远离电介质片，并将引线变形成弯曲的垂直广泛配置。 优选的结构提供半导体芯片组件，其具有在芯片上的平面区域阵列的触点，片材上的端子阵列被定位成使得每个端子基本上在相应的触点上方，以及连接在端子之间的金属S形带阵列 和联系人。 柔性电介质材料可以设置在片和芯片之间，基本上围绕S形带。

公开(公告)号：WO8803356A3

公开(公告)日：1988-06-02

申请号：PCT/US8702300

申请日：1987-09-09

Applicant: BLACK & DECKER INC

Inventor： WHEELER DALE K

IPC: B21D39/03 ,  B29C65/56 ,  B29C65/60 ,  B29C65/64 ,  B29C69/00 ,  B32B43/00 ,  H01H11/06 ,  H01R9/16 ,  H01R12/04 ,  H01R43/20 ,  H05K1/00 ,  H05K3/04 ,  H05K3/20 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06 ,  H05K7/20

CPC classification number: B29C65/606 ,  B29C65/56 ,  B29C65/567 ,  B29C65/60 ,  B29C66/1122 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8161 ,  B29C66/8322 ,  H01R43/20 ,  H05K1/0284 ,  H05K3/041 ,  H05K3/202 ,  H05K3/306 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/091 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/063 ,  H05K2203/1572 ,  H05K2203/167

Abstract: Method and apparatus (10) for forming power distribution systems or parts thereof during punching operations. A planar member (16) of conductive material is located proximate to a substrate (14) upon which the power distribution system or part thereof is to be formed. A punch (18) is used to form the conductors (12) from the planar member (16) and deposit the conductors (12) on the substrate (14). The action of the punch (18) causes mechanical interference between the conductor (12) and the substrate (14) thereby securing the conductor to the substrate. The power distribution system or part thereof may comprise a terminal assembly, an electric switch, a heat sink of an electronic module, or an electrical circuit board.

公开(公告)号：NO975843A

公开(公告)日：1998-02-16

申请号：NO975843

申请日：1997-12-11

Applicant: MINNESOTA MINING & MFG

Inventor： SCHUELLER RANDOLPH D ,  WINDSCHITL DAVID J

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/363 ,  H01L23/49816 ,  H01L24/50 ,  H01L2924/14 ,  H05K1/0271 ,  H05K3/0058 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0397 ,  H05K2201/09109 ,  H05K2201/09172 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/00

公开(公告)号：SE7714746A

公开(公告)日：1978-06-28

申请号：SE7714746

申请日：1977-12-23

Applicant: AMP INC

Inventor： GRABBE D G

IPC: G04G99/00 ,  G04G17/02 ,  G04G17/06 ,  H05K1/18 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K7/02 ,  H01R9/12

CPC classification number: H05K3/326 ,  G04G17/02 ,  G04G17/06 ,  H01L2924/0002 ,  H05K1/182 ,  H05K3/202 ,  H05K3/306 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10037 ,  H05K2201/10136 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  Y02P70/611 ,  Y10T29/49121 ,  Y10T29/49579 ,  H01L2924/00

公开(公告)号：DE1590615B

公开(公告)日：1970-10-01

申请号：DE1590615D

申请日：1966-08-10

Applicant: STANDARD ELEKTRIK LORENZ AG

Inventor： WILDE HELMUT

IPC: G05B19/08 ,  H01R12/58 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01R12/523 ,  H05K1/0286 ,  H05K1/118 ,  H05K3/306 ,  H05K3/326 ,  H05K3/4046 ,  H05K3/4611 ,  H05K2201/0397 ,  H05K2201/091 ,  H05K2201/0919 ,  H05K2201/0979 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/1189

公开(公告)号：WO2016040040A1

公开(公告)日：2016-03-17

申请号：PCT/US2015/047821

申请日：2015-08-31

Applicant: CELLINK CORPORATION

Inventor： COAKLEY, Kevin Michael ,  BROWN, Malcolm

IPC: H01M2/20 ,  H01M2/26 ,  H01M2/10

CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

Abstract: Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

Abstract translation: 提供了用于互连电池单元阵列的互连电路以及形成这些互连电路的方法以及将这些电路连接到电池单元。 互连电路可以包括导电层和一个或多个绝缘层。 导电层可以用限定接触焊盘的开口图案化，使得每个焊盘用于连接到不同的电池单元端子。 在一些实施例中，每个接触垫通过由与接触垫相同的导电层形成的可熔连接件附接到导电层的其余部分。 熔断链路控制来自该接触焊盘的电流。 绝缘层被层压到导电层上并提供对接触垫的支撑。 绝缘层也可以用开口图案化，这允许通过绝缘层在接触焊盘和电池端子之间形成电连接。