公开(公告)号：KR1020090102677A

公开(公告)日：2009-09-30

申请号：KR1020090025056

申请日：2009-03-24

Applicant: 가부시키가이샤후지쿠라

Inventor： 이시이유우 ,  나오에구니히로

IPC: H05K1/02 ,  H01L23/12 ,  H05K3/34

CPC classification number: H05K3/4046 ,  H01L2224/16225 ,  H01R12/52 ,  H01R13/24 ,  H05K1/0313 ,  H05K1/036 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09081 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2201/10416 ,  H05K2201/10734 ,  H05K2203/063 ,  Y10T29/49124

Abstract: PURPOSE: An electronic component mounting board, a method for manufacturing the same and an electronic circuit unit are provided to obtain sufficient contact pressure even when an electronic component whose conductor height is different. CONSTITUTION: An electronic component mounting board includes gas, a conductive member(3), flexible substrates(4,4a), and an elliptic electrode(5). The gas is made of a flat elastic body. The gas has penetration holes arranged at an interval. The conductive member has the first protrusion(3a) and the second protrusion.

Abstract translation: 目的：提供电子部件安装板，其制造方法和电子电路单元，以便即使当导体高度不同的电子部件也能获得足够的接触压力。 构成：电子部件安装板包括气体，导电部件（3），柔性基板（4,4a）和椭圆形电极（5）。 气体由平坦的弹性体制成。 气体具有间隔开的贯通孔。 导电构件具有第一突起（3a）和第二突起。

公开(公告)号：KR1020080009019A

公开(公告)日：2008-01-24

申请号：KR1020070072994

申请日：2007-07-20

Applicant: 가부시키가이샤후지쿠라

Inventor： 니카이도신이치 ,  미야자와하루오 ,  야마가미가쓰야

IPC: H01R33/76

CPC classification number: H05K7/1069 ,  H01R12/52 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10378 ,  H05K2201/10719

Abstract: An IC socket, an IC socket assembly, and a manufacturing method for the IC socket are provided to enable all contact portions to be formed in a lump by resin molding, thereby solving a problem that the production time increases as the number of IC socket pins increases. An IC(Integrated Circuit) socket(1) comprises a plate-type socket base body(10) and a plated layer(20). The plate-type socket base body includes a through hole forming portion(12). The through hole forming portion has a plurality of contact housing holes and through holes(11,13). The plurality of contact housing holes is formed to penetrate the plate-like socket base in a front-to-back direction. The through holes are formed around each of the contact housing holes so as to penetrate the plate-type socket base in the front-to-back direction. A plate-type contact portion(14) has a base portion integrally formed on a side wall on a front side of the through hole forming portion and is formed in a state of facing the through holes. The plated layer is continuously formed on the inner wall of the through hole, on the front and back sides of the through hole forming portion, and on a surface of the contact portion.

Abstract translation: 提供一种用于IC插座的IC插座，IC插座组件和制造方法，以便通过树脂成型能够使所有的接触部分形成为一体，从而解决了生产时间随着IC插座销数量的增加而增加的问题 增加。 IC（集成电路）插座（1）包括板式插座底座（10）和镀层（20）。 板状插座基体包括通孔形成部（12）。 通孔形成部分具有多个接触容纳孔和通孔（11,13）。 多个接触容纳孔形成为沿着前后方向贯穿板状的插座基座。 在每个接触容纳孔周围形成通孔，以便在前后方向上穿透板状的插座基座。 板状接触部（14）具有一体地形成在通孔形成部的前侧的侧壁上的基部，并且形成为与通孔相对的状态。 电镀层连续地形成在通孔的内壁上，在通孔形成部分的正面和背面以及接触部分的表面上。

公开(公告)号：KR100384255B1

公开(公告)日：2003-08-19

申请号：KR1019970701682

申请日：1995-09-20

Applicant: 테세라, 인코포레이티드

Inventor： 즈래타코박 ,  토마스디스테파노 ,  크레익미첼

IPC: H05K1/02 ,  H01L21/60 ,  H05K1/11

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

Abstract: 본 발명은 반도체 칩과 그 지지 기판 사이의 열팽창 계수의 불일치를 조절하도록 반도체 칩(120)과 그 지지 기판 사이에 평면 컴플라이언트 인터페이스를 제공하는 방법 및 장치에 관한 것이다. 상기 컴플라이언트 인터페이스는 인접 패드들 사이의 통로(117)을 한정하는 복수의 컴플라이언트 패드(110)으로 구성된다. 상기 패드들은 가요성 막 칩 캐리어(100)와 상기 칩 사이에서 일반적으로 압축된다. 컴플라이언트 충전자(170)는 제어된 두께를 갖는 균일한 캡슐 봉입층을 형성하도록 상기 통로내에 추가로 배치된다.

Abstract translation: 制造包括柔性界面的微电子组件的方法包括提供第一支撑结构，诸如柔性电介质片，其具有第一表面和在第一支撑结构的第一表面上的多孔弹性层，拉伸第一支撑结构和 将拉伸的第一支撑结构接合到环结构。 然后，第二支撑结构（例如半导体晶片）的第一表面抵靠多孔层，并且理想地在邻接步骤之后，将第一可固化液体设置在第一支撑结构和第二支撑结构之间以及多孔层内。 然后可以使第一可固化液体至少部分固化。

公开(公告)号：KR1019970003992B1

公开(公告)日：1997-03-24

申请号：KR1019920005750

申请日：1992-04-07

Applicant: 몰렉스 엘엘씨

Inventor： 티모시알.폰

IPC: H05K3/00

CPC classification number: H05K1/189 ,  H01R13/719 ,  H05K1/182 ,  H05K3/326 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49153

Abstract: 요약 없음.

公开(公告)号：KR1019940004052B1

公开(公告)日：1994-05-11

申请号：KR1019910017143

申请日：1991-09-28

Applicant: 가부시끼가이샤 도시바

Inventor： 시미즈세이자브로 ,  사사키오사무 ,  요시즈미아키라 ,  오타히데오

IPC: H05K3/00

CPC classification number: H05K3/10 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/041 ,  H05K3/20 ,  H05K3/4084 ,  H05K3/4617 ,  H05K3/4632 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2203/0108 ,  H05K2203/0156 ,  H05K2203/0195 ,  H05K2203/085 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T29/532 ,  Y10T156/107 ,  Y10T156/109

公开(公告)号：KR1019930006807B1

公开(公告)日：1993-07-23

申请号：KR1019900021257

申请日：1990-12-19

Applicant: 가부시끼가이샤 도시바

Inventor： 나까무라고오이찌로오

IPC: G06K19/06

CPC classification number: G06K19/07728 ,  G06K19/077 ,  H05K1/0271 ,  H05K1/184 ,  H05K1/189 ,  H05K3/326 ,  H05K3/3442 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10075 ,  H05K2201/10636 ,  Y02P70/611

Abstract: 내용 없음.

公开(公告)号：US20180080610A1

公开(公告)日：2018-03-22

申请号：US15822574

申请日：2017-11-27

Applicant: Molex, LLC

Inventor： Daniel B. McGowan ,  Michael C. Picini

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H05K1/18 ,  H01L33/64 ,  H05K3/00 ,  H05K1/05 ,  H05K3/12 ,  H01L33/62 ,  H05K1/11

CPC classification number: F21K9/20 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/05 ,  H05K1/117 ,  H05K1/183 ,  H05K3/0026 ,  H05K3/12 ,  H05K2201/09018 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

公开(公告)号：US09844148B2

公开(公告)日：2017-12-12

申请号：US15379177

申请日：2016-12-14

Applicant: CelLink Corporation

Inventor： Kevin Coakley ,  Malcolm Brown

IPC: H01L21/00 ,  H01M2/34 ,  H05K3/00 ,  H01L23/538 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H01M2/20 ,  H01M10/48 ,  H05K1/02 ,  H01M10/42

CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

Abstract: Provided are interconnect circuits for interconnecting arrays of devices and methods of forming these interconnect circuits as well as connecting these circuits to the devices. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different electrical terminal of the interconnected devices. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

公开(公告)号：US09780471B2

公开(公告)日：2017-10-03

申请号：US15313401

申请日：2015-05-18

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Nicolaas Antonie Van Rijswijk

IPC: H01R12/73 ,  H05K1/14 ,  H05K1/11 ,  H05K3/36 ,  H01R12/70

CPC classification number: H01R12/737 ,  H01R12/7023 ,  H05K1/11 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: A printed circuit board arrangement and a method for mounting a product to a main printed circuit board (100) at a substantially perpendicular angle, the printed circuit board arrangement comprises a main printed circuit board (100) comprising an elongated slot (102), and a product (128) comprising a connector portion (130) configured to be inserted into the elongated slot (102). The connector portion (130) is such that the product (128) may be attached at a substantially perpendicular angle to the main printed circuit board (100). The elongated slot (102) comprises a protrusion (104), and the connector portion (130) comprises a spring portion (132) configured to engage with the protrusion (104) when the connector portion (130) is inserted into the elongated slot (102). This results in a force pressing the connector portion (130) of the product (128) to at least one side wall of the elongated slot (102).

公开(公告)号：US09686866B2

公开(公告)日：2017-06-20

申请号：US14833129

申请日：2015-08-23

Applicant: Unimicron Technology Corp.

Inventor： Hung-Lin Chang ,  Ta-Han Lin

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/186 ,  H01L23/3121 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2924/15153 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/0346 ,  H05K1/111 ,  H05K1/115 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/09081 ,  H05K2201/09545

Abstract: A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.