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    Hybrid circuits
    221.
    发明公开
    Hybrid circuits 失效
    混合电路

    公开(公告)号：EP0359413A3

    公开(公告)日：1990-09-05

    申请号：EP89308418.6

    申请日：1989-08-18

    Applicant: STC PLC

    Inventor： McDougall, Andrew Murry ,  Winster, Anthony Eric

    IPC: H01L23/538 ,  H01L25/16

    CPC classification number: H05K3/4061 ,  H01L23/49866 ,  H01L23/5384 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/035 ,  H05K2201/0769 ,  H01L2924/00

    Abstract: A co-fired hybrid circuit includes silver internal connections, such as vias (1,4) and patterns (3), and gold-based external connections (6). A diffusion barrier (9′), for example of palladium-silver, covers a via (4) which extends towards an external surface of an outermost layer (5) of a stack of ceramic sheets (2, 5). The diffusion barrier (9′) can be screen printed onto layer (5) following formation of the via (4) and prior to lamination, burn out and firing of the stack. The gold external connections are applied subsequently to firing.

    Abstract translation: 共烧混合电路包括银内部连接，例如通孔（1,4）和图案（3）以及金基外部连接（6）。 扩散阻挡层（9分钟），例如钯 - 银覆盖了朝向陶瓷片（2,5）的最外层（5）的外表面延伸的通孔（4）。 在形成通孔（4）之后并且在层压之前，扩散阻挡层（9分钟）可以丝网印刷到层（5）上，烧结和烧制堆叠。 黄金外部连接随后应用于点火。

    Post-termination process for thick-film resistors of printed-circuit boards
    222.
    发明公开
    Post-termination process for thick-film resistors of printed-circuit boards 失效
    Post-BeendungsverfahrenfürDickschichtwiderständevon Leiterplatten。

    公开(公告)号：EP0364095A2

    公开(公告)日：1990-04-18

    申请号：EP89308931.8

    申请日：1989-09-04

    Applicant: DELCO ELECTRONICS CORPORATION (a Delaware corp.)

    Inventor： Palanisamy, Ponnusamy

    IPC: H01C17/28 ,  H01C1/142 ,  H05K1/16 ,  H01C7/00

    CPC classification number: H05K1/167 ,  H01C1/142 ,  H01C7/003 ,  H01C17/281 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2203/1453 ,  H05K2203/1461

    Abstract: A printed circuit board (10) includes both high and low resistive value thick film resistors interconnected by a copper film (18). To lower the contact resistance to the thick film resistors (12) of high value, each is provided at its ends with a termination (16A,16B) of a composition similar to that used for the low value resistors (16). This provides a relatively low-resistance contact region which overcomes the difficulty that a copper thick film conductor has in making electrical connections to compositions generally used for making high value thick film resistors. The compositions of high and low resistivities are adapted to permit firing of both compositions in a single firing step.

    Abstract translation: 印刷电路板（10）包括通过铜膜（18）互连的高电阻值和低电阻值厚膜电阻器。 为了降低对高值的厚膜电阻器（12）的接触电阻，它们的端部设置有与用于低值电阻器（16）的组成类似的组合的终端（16A，16B）。 这提供了一种相对低电阻的接触区域，其克服了铜厚膜导体与通常用于制造高价值厚膜电阻器的组合物的电连接的困难。 高电阻率和低电阻率的组合物适于允许在单个烧制步骤中对两种组合物进行烧制。

    Copper conductor compositions
    225.
    发明公开
    Copper conductor compositions 失效
    LeitfähigeZusammensetzungen auf Kupferbasis。

    公开(公告)号：EP0240654A1

    公开(公告)日：1987-10-14

    申请号：EP87100930.4

    申请日：1987-01-23

    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

    Inventor： Siuta, Vincent Paul

    IPC: H01B1/16 ,  H01L49/02 ,  H05K1/09

    CPC classification number: H05K3/248 ,  H01B1/026 ,  H01L23/49866 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H01L2924/00

    Abstract: A fritiess copper conductor composition suitable tor overprinting on copper consisting essentially of (a) 10-50% wt. finely divided copper particles, (b) 90-50% wt. coarse copper particles, (c) 0.2-2% wt. reducible heavy metal oxide, (d) 0-1.0% refractory metal and (e) 0-5.0% of a high surface area noble metal, all the particles being dispersed in an organic medium.

    Abstract translation: 一种适用于在铜上套印的无油铜导体组合物，其基本上由（a）10-50重量％ 细分铜颗粒，（b）90-50％wt。 粗铜颗粒，（c）0.2-2％ （d）0-1.0％的难熔金属和（e）0-5.0％的高表面积贵金属，所有的颗粒都分散在有机介质中。

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