Abstract:
Provided are a method for manufacturing a polymer which is a method for manufacturing a polysilazane having a Si-N linkage on a main chain, and comprises the step of polymerizing through a disproportionation reaction and rearrangement reaction by activating an amino silane monomer represented by the following chemical formula 1 with the existence of a nucleophilic compound capable of coordination of the Si atom of the amino silane, and a composition for forming an insulation film comprising the manufactured polymer. [Chemical formula 1] A polysilazne polymer not substantially comprising chlorine can be manufactured, and an insulation film with the significantly less number of defects, in the case of using the polymer as a component of the composition for forming a silica-based insulation film.
Abstract:
Provided are a method for manufacturing a polymer which is a method for manufacturing a polysilazane having a Si-N linkage on a main chain, and comprises the step of reacting an amino silane monomer represented by the following chemical formula 1 with a nitrogen contained compound represented by chemical formula 1 with the existence of a nucleophilic compound capable of coordination of the Si atom of the amino silane, and a method for manufacturing a polymer comprising comprising the manufactured polymer. [Chemical formula 1] A polysilazne or polysiloxazane polymer not substantially comprising chlorine can be manufactured, and an insulation film with the significantly less number of defects, in the case of using the polymer as a component of the composition for forming a silica-based insulation film.
Abstract:
The present invention relates to a photosensitive resin composition for an insulating film of a display device comprising: (A) an alkali-soluble resin comprising a polybezoxazole precursor, a polyamic acid, a polyimide, or the combination of the same; (B) a photosensitive diazoquinone compound; (C) a phthalocyanine compound having a maximum absorption wavelength of 600-720 nm; and (D) a solvent, to an insulating film using the same, and to a display device.
Abstract:
The present invention relates to a photosensitive resin composition for an insulating film of a display device which comprises (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, (C) a color material having 400-500 nm of maximum absorption wavelength, and (D) a solvent; and to the insulating film and the display device using the composition.
Abstract:
The present invention relates to a positive photosensitive resin composition which includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, (C) a compound including at least one of compounds represented by chemical formula 1 -3, and (D) a solvent; and to an insulator film and a display device using the same. [Chemical formula 1][Chemical formula 2][Chemical formula 3] (In chemical formula 3, R^1 and R^2 are defined as in the specification.).
Abstract:
Provided is a composition for forming silica based insulating layer which includes polysilazane hydroxide or polysiloxazane hydroxide, and has 1200 ppm or less of concentrate of cyclic compound having 400 or less of weight-average molecular weight. The composition for forming silica based insulating layer can reduce thickness dispersion when forming the silica based insulating layer, thereby reducing film deficiency after chemical mechanical polishing (CMP) when manufacturing a semiconductor.
Abstract:
본 발명의 일 구현예에 따른 포토레지스트 하층막용 조성물은(A) 하기 화학식 1로 표시되는 폴리실록산 수지, 및 (B) 용매를 포함한다. [화학식 1] {(SiO 1.5 Y-SiO 1.5 ) x (SiO 2 ) y (XSiO 1.5 ) z }(OH) e (OR 1 ) f 따라서, 우수한 보관 안정성 및 내에치성(etch resistance)을 가질 수 있고, 표면 물성의 조절이 용이할 수 있으며, 포토레지스트 패턴의 안정적인 형성을 가능하게 한다. 하층막, 포토레지스트, 실리콘, 폴리실록산
Abstract:
본 발명은 레지스트 하층막용 하드마스크 조성물에 관한 것이다. 본 발명은 유기 실란계 중합체(A); 및 1종 이상의 안정화제(B)를 포함하는 레지스트 하층막용 하드마스크 조성물을 제공한다. 본 발명의 레지스트 하층막용 하드마스크 조성물은 우수한 저장안정성을 가지며 하드마스크 특성이 우수하여 재료층에 훌륭한 패턴을 전사할 수 있다. 하드마스크, 유기 실란계 중합체, 안정화제, 저장안정성
Abstract:
PURPOSE: A composition for a resist underlayer film is provided to be able to form a resist underlayer film with an elaborate structure as the etching ability to CFx plasma, coating performance and storage stability are excellent, and the hardness is also good. CONSTITUTION: A composition for a resist underlayer film comprises organic silane polycondensate manufactured by condensation polymerization of hydrolysates produced from compounds of Chemical formula 1: [R^1O]3Si-X, Chemical formula 2: [R^2O]3Si-R^3, and Chemical formula 3: B[OR^4]3; and solvent. In Chemical formula 1, R^1 is substituted or non-substituted C1-6 alkyl, X is substituted or non-substituted C6-30 aryl. In Chemical 2, R^2 is substituted or non-substituted C1-6 alkyl, R^3 is substituted or non-substituted C1-12 alkyl. In Chemical 3, R^4 is substituted or non-substituted C1-6 alkyl. [Reference numerals] (AA) Example 1