公开(公告)号：DE3856187T2

公开(公告)日：1999-02-04

申请号：DE3856187

申请日：1988-06-28

Applicant: IBM DEUTSCHLAND

Inventor： ASCH KARL ,  KEYSER JOACHIM ,  MEISSNER KLAUS ,  ZAPKA WERNER

IPC: B23K26/00 ,  B08B7/00 ,  G03F1/00 ,  G03F7/20 ,  H01L21/027 ,  H01L21/268 ,  H01L21/30 ,  H01L21/304

公开(公告)号：DE19538792A1

公开(公告)日：1997-04-24

申请号：DE19538792

申请日：1995-10-18

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN DR ,  MEISSNER KLAUS ,  STEINER WERNER ,  STOEHR ROLAND

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement 1 for electrically connecting a test system with the circular contact pads 2 of a device to be tested 3. In order to achieve a low contact resistance the contact probes 4 are orthogonally pressed onto the contact pads 2, and for adjusting height differences in the contact pads 2 caused by an uneven surface of the device to be tested 3 they may bend out laterally into the provided areas 6a, 6b. The contact probes 4 are located in guide grooves 5. The guide grooves 5 as well as the areas 6a, 6b are provided in a plane parallel to the surface of a guide plate 7 and are covered by a protective plate. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in electrical circuit arrays of microelectronic compounds.

公开(公告)号：DE102012203531A1

公开(公告)日：2012-09-27

申请号：DE102012203531

申请日：2012-03-06

Applicant: IBM

Inventor： GERWIG GUENTER ,  VON BUTTLAR JOACHIM ,  LEHNERT FRANK ,  ENGLER EBERHARD ,  MEISSNER KLAUS

IPC: G06F1/04

Abstract: Die Erfindung betrifft ein Verfahren zur kontinuierlichen Bereitstellung eines Präzisionssystemtakts, der einem Prozessorkern (2) zugeordnet ist, wobei der Systemtakt ein Host-Taktregister (5) umfasst, das mithilfe eines Präzisionsoszillators aktualisiert wird, das Verfahren die Schritte des Bereitstellens eines Firmware-Taktregisters (6), des Hochzählens des Firmware-Taktregisters (6) bei jedem Hochzählen des Host-Taktregisters (5), der Überwachung von Ausfällen des Host-Taktregisters (5) und bei einem Ausfall des Host-Taktregisters (5) das kontinuierliche Hochzählen des Firmware-Taktregisters (6) mithilfe von Zeitsignalen des Prozessorkerns (2) sowie bei Empfang einer Anforderung auf Bereitstellung eines Taktwertes das Bereitstellen des Inhalts des Host-Taktregisters (5) umfasst, wenn kein Ausfall festgestellt wurde, und andernfalls den Inhalt des Firmware-Taktregisters (6).

公开(公告)号：DE69427522T2

公开(公告)日：2002-03-28

申请号：DE69427522

申请日：1994-04-11

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER DR ,  MARTIN YVES ,  MEISSNER KLAUS ,  WEISS HELGA

IPC: G01N1/00 ,  G01B1/00 ,  G01B7/34 ,  G01N27/00 ,  G01N37/00 ,  G01Q40/02 ,  H01L21/20

Abstract: To allow faithfully the quantitative interpretation of the measuring results obtained by scanning force microscopes (STM) or atomic force microscopes (AFM) the probe tips used have to be exactly characterized before and after measuring since their size and shape may change during the measuring procedure. If the tips are cone-shaped, their diameter and their cone angle have to be known accurately. Described are calibration standards for profilometers, especially for STMs and AFMs, which are of high accuracy and which allow calibration measurements without frequently removing the probe tips. Methods of producing these calibration standards are shown and examples are given for the use of the calibration standards for measuring features in the sub-nanometer range or for calibrating profilometers.

公开(公告)号：GB2306804B

公开(公告)日：1999-07-14

申请号：GB9621500

申请日：1996-10-16

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：DE19710799A1

公开(公告)日：1998-10-01

申请号：DE19710799

申请日：1997-03-17

Applicant: IBM

Inventor： GRESCHNER JOHANN DR ,  KALT SAMUEL ,  MEISSNER KLAUS ,  PAUL RUDOLF

IPC: G03F1/16 ,  G03F1/20 ,  H01L21/027 ,  G03F1/08

Abstract: In an electron or particle beam structuring mask, consisting of a semiconductor wafer (2) with an apertured layer (1) on one surface and with a recess (3) extending from the other surface to the layer-bearing surface, the layer (1) is a preferably 0.1-2.0 mu m thick silicon nitride layer. Also claimed is a similar electron beam structuring mask having, between the apertured layer (31) and the wafer (32), a continuous layer (30) consisting of a combination of silicon dioxide (34), silicon nitride (35) and silicon dioxide (36) layers of relative thicknesses such that the combination is under a slight tensile stress preferably of about 10 dynes/cm . Also claimed is a mask production process involving plasma etching of the apertures in the mask-defining layer (1, 31) at -90 to -140 degrees C using a helicon source for plasma generation and an etching gas mixture of SF6 and O2 in a ratio resulting in perpendicular aperture walls.

公开(公告)号：GB2306804A

公开(公告)日：1997-05-07

申请号：GB9621500

申请日：1996-10-16

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.