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    21.
    发明专利
    未知

    公开(公告)号：DE10051159A1

    公开(公告)日：2002-05-02

    申请号：DE10051159

    申请日：2000-10-16

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： MARCHL WERNER ,  SPAETH WERNER ,  WAITL GUENTER

    IPC: H01L25/075 ,  F21K7/00 ,  H01L23/48

    Abstract: The invention relates to an LED module (1), comprising a support (2), which contains a semiconductor layer (5) and which has an even main surface on which a plurality of LED semiconductor bodies (11) are mounted. The LED semiconductor bodies (11) that are used preferably emit light of different central wavelengths during operation, so that the LED module (1) is suitable for producing mixed colour light and especially for producing white light.

    26.
    发明专利
    未知

    公开(公告)号：DE59708327D1

    公开(公告)日：2002-10-31

    申请号：DE59708327

    申请日：1997-03-21

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： SCHNEIDER HARTMUT ,  SPAETH WERNER ,  GROETSCH STEFAN

    IPC: G02B6/122 ,  G02B6/13 ,  G02B6/136 ,  G02B6/42

    Abstract: Process for the production of a waveguide beam converter for shaping a laser beam collection. A plurality of waveguides are produced and arranged in such a way that at least one individual laser beam can be injected into each waveguide. The waveguides are firstly produced on a substrate using planar technology, and subsequently detached from the substrate over a part of their length, starting from their beam exit ends. The free ends are then arranged and fixed in accordance with an intended output beam arrangement of the output laser beam collection.

    27.
    发明专利
    未知

    公开(公告)号：DE59707787D1

    公开(公告)日：2002-08-29

    申请号：DE59707787

    申请日：1997-01-31

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： GRAMANN WOLFGANG ,  SPAETH WERNER ,  WAITL GUENTHER ,  BRUNNER HERBERT

    IPC: G09F9/33 ,  H01L25/075 ,  H01L33/00 ,  H01L33/38 ,  H01L33/40

    Abstract: The invention concerns an LED device (1) comprising at least one LED chip (2), wherein front contact plating (8) is disposed on a light outlet surface of a light-emitting body (5) and rear contact plating (6) is disposed on a side of the light-emitting body (5) lying opposite the light outlet surface. The LED chip (2) is disposed between a first (15) and a second strip conductor carrier (31), the first strip conductor (15) being transparent and comprising at least one first electrical conductor (16) which contacts the front contact plating (8), and the second strip conductor carrier (31) comprising at least one second electrical conductor (13) which contacts the rear contact plating (6). The LED device (1) according to the invention has inter alia the particular advantage that the size of the LED chip (2) is reduced with respect to conventional LED devices and hence the beam density can be increased.

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