公开(公告)号：US20140198471A1

公开(公告)日：2014-07-17

申请号：US14149864

申请日：2014-01-08

Applicant: FUJITSU LIMITED

Inventor： Naohiko Kajio ,  NAOFUMI KOSUGI ,  Yoshio Matsumoto

IPC: H05K1/14

CPC classification number: H05K1/142 ,  H05K1/144 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10568 ,  H05K2201/10803 ,  H05K2201/2036 ,  H05K2203/167

Abstract: First and second tapered holes are provided at facing positions of the first and second circuit boards. The elastic spacer including first and second spacers is attached between them to couple the two in parallel and thereby facilitate attachment of the two to a back panel. The first spacer is provided at one end part with a tapered part which fits with the first tapered hole and the second spacer is provided at one end part with a tapered part which fits with the second tapered hole. A spring is inserted between the two spacers. The first spacer is fit in the tapered hole and fastened by a screw to the first circuit board. The second circuit board is fastened by a screw to the first spacer in a state fitting the second tapered hole over the second spacer with the second circuit board approaching the first circuit board.

Abstract translation: 第一和第二锥形孔设置在第一和第二电路板的相对位置处。 包括第一和第二间隔件的弹性间隔件连接在它们之间以使两者平行连接，从而便于将两者附接到后面板。 第一间隔件在一端部设置有与第一锥形孔配合的锥形部，第二间隔件在一端部设置有与第二锥形孔配合的锥形部。 弹簧插入两个间隔件之间。 第一间隔件装配在锥形孔中，并通过螺钉固定在第一电路板上。 第二电路板通过螺钉固定在第一间隔件上，其状态是将第二锥形孔装配在第二间隔件上，而第二电路板接近第一电路板。

公开(公告)号：US20100099274A1

公开(公告)日：2010-04-22

申请号：US12495265

申请日：2009-06-30

Applicant: Sung-Yu Hsieh ,  Wen-Chin Wu

Inventor： Sung-Yu Hsieh ,  Wen-Chin Wu

IPC: H01R12/00 ,  H05K3/30

CPC classification number: H01R12/7005 ,  H01R12/7052 ,  H01R12/716 ,  H05K1/182 ,  H05K3/306 ,  H05K2201/09063 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2203/167 ,  Y10T29/49139

Abstract: A sinking type electrical connector is adapted for coupling to a circuit board. The sinking type electrical connector includes a body and at least one limiting unit. The body has a front end portion, a connecting portion provided in the front end portion, and a top surface. The limiting unit is provided at one side of the body and includes a plurality of limiting portions respectively located at different levels. A selected one of the limiting portions of the limiting unit which are at different levels is brought to engage the circuit board so that a distance from the top surface of the body to the circuit board is changeable.

Abstract translation: 沉没式电连接器适于耦合到电路板。 沉没式电连接器包括主体和至少一个限制单元。 主体具有前端部，设置在前端部的连接部和顶面。 限制单元设置在主体的一侧，并且包括分别位于不同级别的多个限制部分。 限制单元的不同级别的限定部分中的选定的一个使得电路板接合，使得从主体的顶表面到电路板的距离是可变的。

公开(公告)号：US20090233468A1

公开(公告)日：2009-09-17

申请号：US12285893

申请日：2008-10-16

Applicant: Shiro Yamashita ,  Hideto Yoshinari

Inventor： Shiro Yamashita ,  Hideto Yoshinari

IPC: H01R12/00

CPC classification number: H05K1/119 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/141 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10803 ,  Y10S439/941

Abstract: In a module, press-fit connection using a pin terminal including a connection part separated into two parts and a flat plane parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal is performed. A through-hole of a board is structured so that an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board and the length of the middle part of the through-hole connected to the pin terminal is shorter than the length of the flat plane of the pin terminal.

Abstract translation: 在模块中，使用包括分离成两部分的连接部分的引脚端子和在分离部分中与长度方向平行的平面并且垂直于引脚端子的分离方向的压配合连接。 板的通孔的结构使得板的厚度方向中间部分处的通孔的内径小于板的正面和反面以及中间部分的长度 连接到引脚端子的通孔比引脚端子的平面的长度短。

公开(公告)号：US20170149154A1

公开(公告)日：2017-05-25

申请号：US15423269

申请日：2017-02-02

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/58 ,  H05K1/02 ,  H01R12/71

CPC classification number: H01R12/716 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/58 ,  H01R12/714 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US09106005B2

公开(公告)日：2015-08-11

申请号：US13356791

申请日：2012-01-24

Applicant: Takeshi Okuyama ,  Toshihiro Kusagaya ,  Tohru Yamakami

Inventor： Takeshi Okuyama ,  Toshihiro Kusagaya ,  Tohru Yamakami

IPC: H01L23/48 ,  H01R12/57 ,  H01R4/02 ,  H05K3/34 ,  H01R12/72 ,  H01R13/6587 ,  H05K1/02

CPC classification number: H05K3/3426 ,  H01R4/028 ,  H01R12/57 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/025 ,  H05K3/3494 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10803 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/04 ,  Y02P70/613

Abstract: Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.

Abstract translation: 公开了一种表面安装装置，其安装在基座构件上，包括多个引线单元，所述多个引线单元中的每一个包括：引线，其包括形成在引线端部的主体部分和脚部; 形成在引脚的脚部处的焊料部分朝向基部构件的方向突出以具有顶部部分，以及设置在引线上的防止扩散部分，用于防止焊料沿引线的主体部分扩散。

公开(公告)号：US20150222265A1

公开(公告)日：2015-08-06

申请号：US14606447

申请日：2015-01-27

Applicant: Anden Co., Ltd.

Inventor： Hideyuki OHTANI ,  Naoyuki YASUDA

IPC: H03K17/693 ,  H03K17/687

CPC classification number: H03K17/693 ,  H03K17/6874 ,  H03K17/6877 ,  H05K3/3426 ,  H05K2201/10053 ,  H05K2201/10295 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10833 ,  H05K2201/10871 ,  Y02P70/613

Abstract: In a relay module device, a signal converting section transmits driving signals of switching elements when receiving input signals from an external device and sets a relationship between the input signals and the driving signals. The relationship includes a first mode in which the signal converting section transmits the driving signals to separately control one of the switching elements with respect to one of the input signals, and a second mode in which the signal converting section transmits the driving signals to concurrently control two or more of the switching elements with respect to one of the input signals.

Abstract translation: 在继电器模块装置中，当从外部装置接收输入信号时，信号转换部分传输开关元件的驱动信号，并设定输入信号与驱动信号之间的关系。 该关系包括第一模式，其中信号转换部分发送驱动信号以相对于输入信号之一单独控制开关元件之一;以及第二模式，其中信号转换部分将驱动信号传输到同时控制 相对于输入信号之一的两个或多个开关元件。

公开(公告)号：US20130133193A1

公开(公告)日：2013-05-30

申请号：US13305502

申请日：2011-11-28

Applicant: Chih-Tai Hsu ,  Nan-Cheng Chen ,  Chih-Ming Chiang ,  Hung-Chang Hung ,  Xin Zhong

Inventor： Chih-Tai Hsu ,  Nan-Cheng Chen ,  Chih-Ming Chiang ,  Hung-Chang Hung ,  Xin Zhong

IPC: H05K3/34 ,  H05K3/12

CPC classification number: H01L23/49503 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00015 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/1225 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/09427 ,  H05K2201/10803 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53174 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a surface mount technology process for an advanced quad flat no-lead package process and a stencil used therewith. The surface mount technology process for an advanced quad flat no-lead package includes providing a printed circuit board. A stencil with first openings is mounted over the printed circuit board. A solder paste is printed passing the first openings to form first solder paste patterns. The stencil is taken off. A component placement process is performed to place the advanced quad flat no-lead package comprising a die pad on the printed circuit board, wherein the first solder paste patterns contact a lower surface of the die pad, and an area ratio of the first openings to the lower surface of the die pad is between 1:2 and 1:10. A reflow process is performed to melt the first solder paste patterns to surround a sidewall of the die pad.

Abstract translation: 本发明提供了一种用于高级四边形扁平无铅封装工艺的表面贴装技术工艺和与其一起使用的模板。 用于高级四边形扁平无铅封装的表面贴装技术工艺包括提供印刷电路板。 具有第一开口的模板安装在印刷电路板上。 印刷焊膏通过第一开口形成第一焊膏图案。 模具被取下。 执行部件放置处理以将包括管芯焊盘的高级四边形扁平无引线封装放置在印刷电路板上，其中第一焊膏图案接触管芯焊盘的下表面，并且将第一开口与 芯片焊盘的下表面在1:2与1:10之间。 进行回流处理以熔化第一焊膏图案以围绕管芯焊盘的侧壁。

公开(公告)号：US20080144260A1

公开(公告)日：2008-06-19

申请号：US11979972

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H05K7/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

Abstract translation: 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二个土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。

公开(公告)号：US3362005A

公开(公告)日：1968-01-02

申请号：US64904967

申请日：1967-06-26

Applicant: BERG ELECTRONICS INC

Inventor： CORNS WILLIAM M

IPC: H01R4/02 ,  H01R12/52 ,  H01R12/59 ,  H02B1/20 ,  H02J7/14 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/59 ,  H01R12/52 ,  H05K1/148 ,  H05K3/308 ,  H05K3/361 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10803

公开(公告)号：US3059152A

公开(公告)日：1962-10-16

申请号：US79225259

申请日：1959-02-05

Applicant: GLOBE UNION INC

Inventor： KHOURI ALFRED S

IPC: H01R12/00 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10696 ,  H05K2201/10803 ,  H05K2201/10818 ,  H05K2201/10871 ,  H05K2201/10878 ,  Y10T29/49945