Abstract:
상변화메모리소자의형성방법을제공할수 있다. 이를위해서, 하부전극및 층간절연막을가지는반도체기판이준비될수 있다. 상기하부전극은층간절연막으로둘러싸일수 있다. 상기반도체기판을반도체증착장비의공정챔버내 안착시킬수 있다. 상기공정챔버내 소오스가스들, 반응가스및 퍼지가스를주입해서반도체기판상에상변화물질막을형성할수 있다. 상기소오스가스들은공정챔버에동시에주입될수 있다. 상기상변화물질막은층간절연막을통해서하부전극과접촉할수 있다. 상기층간절연막을노출시키도록상변화물질막을식각해서층간절연막에상변화메모리셀을형성할수 있다. 상기상변화메모리셀 상에상부전극을형성할수 있다.
Abstract:
A multichannel audio system is disclosed. The multichannel audio system includes: a pulse width modulation unit which generates a PWM signal by comparing a carrier signal with an audio signal; a compression unit which detects an envelope of the audio signal using the PWM signal, generates a front-channel PWM signal by compressing the PWM signal at a first compression strength according to the envelope, and generates a rear-channel PWM signal by compressing the PWM signal at a second compression strength higher than a first compression level; an amplification unit which filters a front-channel audio signal and a rear-channel audio signal from the front-channel PWM signal and the rear-channel PWM signal, respectively, and amplifies the front-channel audio signal and the rear-channel audio signal; a front speaker unit which outputs the amplified front-channel audio signal; and a rear speaker unit which outputs the amplified rear-channel audio signal. Accordingly, power consumed by the multichannel audio system can be reduced.
Abstract:
PURPOSE: A phase change memory device and a manufacturing method thereof are provided to reduce cell resistance between word lines by burying a metal silicide pattern in an active region. CONSTITUTION: An impurity region(135) is formed on the upper side of an active region of a substrate. A metal silicide pattern(130) is buried in the impurity region. A diode(149) is formed on the impurity region. A bottom electrode is formed on the diode. A phase change film pattern is formed on the bottom electrode. [Reference numerals] (AA) Second direction; (BB) First direction
Abstract:
PURPOSE: A method for manufacturing a semiconductor device is provided to maximize the high integration of the semiconductor device by rapidly processing high capacity data. CONSTITUTION: A target layer(200) is formed on a substrate(100) A metal oxide layer(300) is formed on the substrate. A metal oxide pattern is formed by etching the metal oxide layer. A buried material is formed on the substrate. A second hard mask pattern is formed on the buried material layer.