公开(公告)号：DE102008063325A1

公开(公告)日：2010-07-01

申请号：DE102008063325

申请日：2008-12-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GROETSCH STEFAN ,  MUELLER KLAUS

IPC: H01L33/00 ,  H01L21/58 ,  H01L23/34

Abstract: Ein Verfahren zur Fertigung von Leuchtmitteln schlägt ein Bereitstellen eines als Wärmesenke dienenden Trägers vor, der einen flächigen Chipmontagebereich umfasst. Der flächige Chipmontagebereich wird zur Erzeugung eines ersten Teilbereichs und wenigstens eines zweiten Teilbereichs strukturiert. Hierbei weist der erste Teilbereich nach dem Strukturieren eine lotabweisende Eigenschaft auf. Anschließend wird ein Lot auf den flächigen Chipmontagebereich aufgebracht, sodass dieses den wenigstens einen zweiten Teilbereich benetzt. Wenigstens ein optoelektronischer Körper wird in den wenigstens einen zweiten Teilbereich mit dem Lot am Träger befestigt. Schließlich werden zur Zuführung elektrischer Energie an den optoelektronischen Leuchtkörper Kontaktierungen ausgebildet.

公开(公告)号：DE102004064150B4

公开(公告)日：2010-04-29

申请号：DE102004064150

申请日：2004-06-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： ARNDT KARLHEINZ ,  HIEGLER MICHAEL ,  GROETSCH STEFAN ,  ENGL MORITZ ,  SCHNEIDER MARKUS ,  SCHMID JOSEF ,  BOGNER GEORG

IPC: H01L23/60 ,  H01L23/06 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022

公开(公告)号：DE502004010451D1

公开(公告)日：2010-01-14

申请号：DE502004010451

申请日：2004-05-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： FERSTL CHRISTIAN ,  GROETSCH STEFAN ,  ZEILER MARKUS

IPC: H01S5/022 ,  H01S3/00 ,  H01S5/00 ,  H01S5/024

Abstract: A method for producing a laser diode component having an electrically insulating housing basic body and electrical connecting conductors, which are led out from the housing basic body and are accessible from outside the housing basic body. The housing basic body is produced from a material which is transmissive to a laser radiation emitted by the laser diode component. The housing basic body includes a chip mounting region. A beam axis of the laser diode component runs through the housing basic body. A housing that can be produced in this way and laser diode component having a housing of this type are also disclosed.

公开(公告)号：DE102008039147A1

公开(公告)日：2009-12-03

申请号：DE102008039147

申请日：2008-08-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SINGER FRANK ,  GROETSCH STEFAN

IPC: F21S8/12 ,  F21Y101/02 ,  H01L23/13 ,  H01L25/075 ,  H01L33/58

Abstract: An optoelectronic module comprising: at least one light-emitting diode chip arranged on a carrier, and a mounting attachment fastened to the carrier and at least partly covering the light-emitting diode chip, and having a structured top which allows positioning of an optical element.

公开(公告)号：DE102008025160A1

公开(公告)日：2009-12-03

申请号：DE102008025160

申请日：2008-05-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GROETSCH STEFAN ,  WILM ALEXANDER ,  GUENTHER EWALD KARL MICHAEL ,  HERRMANN SIEGFRIED

IPC: G02B27/18

Abstract: A multicolour LED, in which layers for generating light of different colors are arranged one above the other, is used as the light source in a projector.

公开(公告)号：DE102007052821A1

公开(公告)日：2009-05-14

申请号：DE102007052821

申请日：2007-11-06

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SINGER FRANK ,  BARCHMANN BERND ,  GROETSCH STEFAN

IPC: H01L23/367 ,  H01L31/024 ,  H01L33/64

Abstract: The sub-carrier has a conductive block (3) made of electrically conductive semiconductor material. An insulating block (4) is arranged between the conductive blocks, and is stably connected with the conductive block. A metallization (5) is provided for each conductive block separately on two upper sides of the conductive blocks that are oppositively lying to each other. The insulating block is a glass. Independent claims are included for the following: (1) an arrangement for an optoelectrical component of a sub-carrier; and (2) a method for manufacturing sub-carrier.

公开(公告)号：DE102006062066A1

公开(公告)日：2008-07-03

申请号：DE102006062066

申请日：2006-12-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GROETSCH STEFAN ,  ENGL MORITZ ,  KOEHLER STEFFEN ,  BLUEMEL SIMON ,  HIEGLER MICHAEL ,  ZEILER THOMAS

IPC: H01L33/58

Abstract: The lens arrangement (6) has a lens (8) with a lens surface and an optical axis, which penetrates the lens surface of the lens. The lens arrangement has a transparent transitional body (10), which is firmly coupled to the lens on the lens surface, which is more temperature-resistant than the lens, and which has an optical axis that is parallel to the optical axis of the lens. An independent claim is also included for a light emitting diode display device with a housing and an opening.

公开(公告)号：DE102006059702A1

公开(公告)日：2008-04-03

申请号：DE102006059702

申请日：2006-12-18

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GROETSCH STEFAN ,  PETRACEK KRISTIN

IPC: H01L33/48

Abstract: The opto-electronic element has a metal core plate (5), a metal core (6), a dielectric layer (7) applied on the metal core and an electrically conductive layer (8) applied on the dielectric layer. The element also has a chip carrier (1) connected with the metal core plate and the chip carrier has a main surface (2) and another main surface (3). The chip carrier at the latter main surface is connected by a solder joint with the metal core of the metal core plate, where the dielectric layer and the electrically conductive layer are distant in the area of the solder joint from the metal core.

公开(公告)号：DE102006045692A1

公开(公告)日：2008-04-03

申请号：DE102006045692

申请日：2006-09-27

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  PATENT TREUHAND GES FUER ELEKTRISCHE GLUEHLAMPEN MBH

Inventor： BLUEMEL SIMON ,  BREIDENASSEL NICOLE ,  GROETSCH STEFAN ,  HUETTNER JOSEF ,  KUHN GERHARD ,  REHN HENNING ,  WILM ALEXANDER

IPC: G03B21/28 ,  G02B27/18

Abstract: The optical projection device has two light sources (1,2) with light-emitting diode chip. A number of micro mirrors (3) are arranged to a micro mirror field (4). The former light source illuminates the micro mirror field from one direction (11) and another light source illuminates the micro mirror field from another direction (12), where both directions are different.

公开(公告)号：DE102006045440A1

公开(公告)日：2008-03-27

申请号：DE102006045440

申请日：2006-09-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GROETSCH STEFAN ,  STRAUS UWE ,  BOGNER GEORG ,  KUHN GERHARD

IPC: G02B27/18 ,  G03B21/12

Abstract: The optical projection device comprises a light source (1) provided with two light-emitting diode chips. The light source has an illumination surface formed by the radiation emission surfaces of the light-emitting diode chips, which are energized when the light source is in operation and by the optical distances between the radiation emission surfaces of the energized light-emitting diode chip. The illumination surface has an aspect ratio formed by the ratio of the length of the illumination surface to the width of the illumination surface. The projection device is provided for representing an image (200) having another aspect ratio formed by the ratio of the length (L2) of the image to the width (B2) of the image, and the two aspect ratios are adapted to each other.