中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

646 records (took 0.022 seconds)

    PRINTED CIRCUIT BOARD ASSEMBLY
    81.
    发明申请
    PRINTED CIRCUIT BOARD ASSEMBLY 审中-公开
    印刷电路板组装

    公开(公告)号：WO01078199A2

    公开(公告)日：2001-10-18

    申请号：PCT/US2001/011840

    申请日：2001-04-11

    IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01R43/02

    CPC classification number: H05K3/368 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/10666

    Abstract: In printed circuit board fabrication, processing steps for components on one section of the board are sometimes incompatible with processing steps for components on another section of the board. The method of the invention provides for physically separate printed circuit board sections that are processed separately and joined together following processing. To provide electrical connection between a first component on a first printed circuit board section and a second component on a second printed circuit board section, the method of the invention includes the steps of connecting the first and second components to conducting regions disposed on edges of their respective printed circuit board sections. The two printed circuit board sections are then joined together so that the two conducting regions contact each other.

    Abstract translation: 在印刷电路板制造中，板的一个部分上的部件的处理步骤有时与板的另一部分上的部件的处理步骤不兼容。 本发明的方法提供了物理上分开的印刷电路板部分，它们在处理之后分开处理并连接在一起。 为了在第一印刷电路板部分上的第一部件和第二印刷电路板部分上的第二部件之间提供电连接，本发明的方法包括将第一和第二部件连接到设置在它们的边缘上的导电区域的步骤 各个印刷电路板部分。 然后将两个印刷电路板部分接合在一起，使得两个导电区域彼此接触。

    ELECTRICAL DEVICES
    83.
    发明申请
    ELECTRICAL DEVICES 审中-公开
    电气设备

    公开(公告)号：WO1994001876A1

    公开(公告)日：1994-01-20

    申请号：PCT/US1993006480

    申请日：1993-07-08

    Applicant: RAYCHEM CORPORATION

    Inventor： RAYCHEM CORPORATION ,  GRAVES, Gregory, A. ,  ZHANG, Michael ,  CHANDLER, Daniel ,  CHANG, Chi-Ming ,  FANG, Shou-Mean

    IPC: H01C01/14

    CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

    Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

    Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，该装置包括：（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分和 电阻元件的主要部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 与电阻元件的主要部分。 这样的装置可以以各种方式固定到电路板，并且可弹性变形的端子。

    MULTI-LAYER CIRCUIT CONSTRUCTION METHODS AND STRUCTURES WITH CUSTOMIZATION FEATURES AND COMPONENTS FOR USE THEREIN
    85.
    发明申请
    MULTI-LAYER CIRCUIT CONSTRUCTION METHODS AND STRUCTURES WITH CUSTOMIZATION FEATURES AND COMPONENTS FOR USE THEREIN 审中-公开
    多层电路构造方法和结构与自定义特征及组件的使用

    公开(公告)号：WO1993013637A1

    公开(公告)日：1993-07-08

    申请号：PCT/US1992011395

    申请日：1992-12-30

    Applicant: TESSERA, INC.

    Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  KHANDROS, Igor ,  GRUBE, Gary, W. ,  EHRENBERG, Scott, G.

    IPC: H05K01/00

    CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0298 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2203/175 ,  H01L2924/00

    Abstract: A multi-layer circuit panel assembly is formed by laminating circuit panels (10) with interposers (12) incorporating flowable conductive material (48) at interconnect locations and a flowable dielectric material (30, 38) at other locations. Excess materials are captured in reservoirs (20) in the circuit panels. The flowable materials and reservoirs allow the interposers to compress and take up tolerances in the components. The stacked panels may have contacts (538) on their top surfaces, through conductors (527) extending between top and bottom and terminals (530) connected to the bottom end of each through conductor. The terminals and contacts are nonselectively connected to one another at each interface so that wherever a terminal and contact an adjacent panels are aligned with one another, these are connected to one another. This forms composite vertical conductors extending through a plurality of the panels. The selective treatment of the panel top and bottom surfaces provides selective interruptions in the vertical conductors.

    Abstract translation: 多层电路板组件通过层叠具有在互连位置处包含可流动导电材料（48）的插入件（12）的电路板（10）和在其它位置处的可流动电介质材料（30,38）形成。 多余的材料被捕获在电路板中的储存器（20）中。 可流动的材料和储存器允许内插器压缩并占据部件中的公差。 堆叠的板可以在其顶表面上具有通过在顶部和底部之间延伸的导体（527）和连接到每个贯通导体的底端的端子（530）之间的触点（538）。 端子和触头在每个接口处彼此非选择性地连接，使得当端子和邻近的面板彼此对准时，它们彼此连接。 这形成延伸穿过多个面板的复合垂直导体。 面板顶部和底部表面的选择性处理在垂直导体中提供选择性的中断。

    Single block rf resonator / filter
    87.
    发明专利
    Single block rf resonator / filter 审中-公开

    公开(公告)号：JP2010507984A

    公开(公告)日：2010-03-11

    申请号：JP2009534635

    申请日：2007-10-24

    Applicant: シーティーエス・コーポレーションCts Corporation

    Inventor： ロゴザイン，アレクサンドル

    IPC: H01P1/205

    CPC classification number: H01P1/2056 ,  H01P1/2136 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10666

    Abstract: 印刷回路基盤の表面への直接表面実装に適合した共振器／フィルター（１００）。 共振器／フィルター（１００）は、それ自身を貫通して延びるスルーホール（１０１〜１０４）と、導電材料で覆われたそれぞれの誘電材料の領域を規定するそれぞれの頂部（１１２）、底部（１１３）及び側部表面（１１４〜１１７）を含む誘電材料のブロック（１１０）を有する。 頂部のブロック表面は、第１の導電領域を規定する。 ブロックの底部表面上の第２の導電領域は、底部のフィルター表面を基盤上に接地した状態でフィルターを基盤に実装することを可能にする入／出力接点を規定する。 複数の伝送線の実施形態（１３１，１５６）が第１、第２の導電領域を電気的に相互に接続する。
    【選択図】 図１

    Connection structure of multilayer printed wiring board
    90.
    发明专利
    Connection structure of multilayer printed wiring board 有权

    公开(公告)号：JP2004335550A

    公开(公告)日：2004-11-25

    申请号：JP2003125679

    申请日：2003-04-30

    Applicant: Jst Mfg Co Ltd ,  日本圧着端子製造株式会社

    Inventor： UCHIDA SHINJI ,  YAMANE HIROSHI ,  SUGIHARA WATARU

    IPC: H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K3/46

    CPC classification number: H05K3/363 ,  H05K2201/09163 ,  H05K2201/10666

    Abstract: PROBLEM TO BE SOLVED: To provide the connection structure of a multilayer printed wiring board suitable for high density packaging.
    SOLUTION: An FPC 2 has an exposed conductor part 2A composed of a foil-like conductor 21 forming an external exposure surface, and an insulating substrate 22 arranged tightly to the surface of the conductor 21 opposite to the exposure surface. The FPC 2 has a multilayer structure where a reinforcing plate 23 is arranged tightly on the substrate 22 at the exposed conductor part 2A. A multilayer printed wiring board 1 is formed, in the board thickness surface thereof, with an opening 10B for inserting the exposed conductor part 2A of the FPC 2. The insertion opening 10B is provided with a plurality of through terminals 11A at positions where the conductors 21 of the FPC 2 are coupled when the FPC 2 is inserted. The conductors 21 of the FPC 2 are connected electrically when they are soldered to the through terminals 11A.
    COPYRIGHT: (C)2005,JPO&NCIPI

Patent Agency Ranking