쇼트키 배리어 다이오드 및 그 제조 방법
    1.
    发明公开
    쇼트키 배리어 다이오드 및 그 제조 방법 无效
    肖特彼勒二极管及其制造方法

    公开(公告)号:KR1020090127035A

    公开(公告)日:2009-12-09

    申请号:KR1020087027687

    申请日:2008-03-19

    CPC classification number: H01L29/872 H01L29/2003 H01L29/66143 H01L29/66204

    Abstract: A Schottky barrier diode is provided with an epitaxially grown layer, which is formed on a substrate and has a mesa section, and a Schottky electrode formed on the mesa section. A distance between an end section of the Schottky electrode and an upper surface end section of the mesa section is 2μm or shorter. With a distance (x) of 2μm or shorter, the Schottky barrier diode having a remarkably reduced leak current, an improved breakdown voltage and excellent withstand voltage characteristics is provided.

    Abstract translation: 肖特基势垒二极管设置有形成在基板上并具有台面部分的外延生长层和形成在台面部分上的肖特基电极。 肖特基电极的端部与台面部的上表面端部之间的距离为2μm以下。 在距离(x)为2μm或更短的范围内,肖特基势垒二极管具有显着降低的漏电流,提高了击穿电压和优异的耐电压特性。

    Ⅲ족 질화물 반도체 소자 및 에피택셜 기판
    4.
    发明公开
    Ⅲ족 질화물 반도체 소자 및 에피택셜 기판 无效
    第III族氮化物半导体器件和外延衬底

    公开(公告)号:KR1020070113094A

    公开(公告)日:2007-11-28

    申请号:KR1020067024397

    申请日:2006-03-06

    Abstract: Disclosed is a group III nitride semiconductor device wherein leakage current from a Schottky electrode is reduced. In a high-electron-mobility transistor (11), a supporting substrate (13) is specifically composed of AlN, AlGaN and GaN. An AlYGa1-YN epitaxial layer (15) has a full width at half maximum of the (0002) plane XRD of not more than 150 sec. A GaN epitaxial layer (17) is formed between the gallium nitride supporting substrate and the AlYGa1-YN epitaxial layer (0

    Abstract translation: 公开了一种III族氮化物半导体器件,其中来自肖特基电极的漏电流减小。 在高电子迁移率晶体管(11)中,支撑衬底(13)特别地由AlN,AlGaN和GaN构成。 AlYGa1-YN外延层(15)的(0002)面XRD的半峰全宽不超过150秒。 在氮化镓支撑衬底和AlYGa1-YN外延层(0

    고전자 이동도 트랜지스터, 전계 효과 트랜지스터,에피택셜 기판, 에피택셜 기판을 제작하는 방법 및III족 질화물계 트랜지스터를 제작하는 방법
    10.
    发明公开
    고전자 이동도 트랜지스터, 전계 효과 트랜지스터,에피택셜 기판, 에피택셜 기판을 제작하는 방법 및III족 질화물계 트랜지스터를 제작하는 방법 无效
    高电子移动性晶体管,场效应晶体管,外延基板,制造外延基板的方法和制造III族氮化物晶体管的方法

    公开(公告)号:KR1020080011264A

    公开(公告)日:2008-02-01

    申请号:KR1020067027121

    申请日:2006-03-03

    Abstract: Disclosed is a high-electron-mobility transistor having a high-purity channel layer and a high-resistance buffer layer. Specifically disclosed is a high-electron-mobility transistor (11) comprising a supporting base (13) composed of a gallium nitride, a buffer layer (15) composed of a first gallium nitride semiconductor, a channel layer (17) composed of a second gallium nitride semiconductor, a semiconductor layer (19) composed of a third gallium nitride semiconductor, and an electrode structure (a gate electrode (21), a source electrode (23) and a drain electrode (25)) for the transistor (11). The band gap of the third gallium nitride semiconductor is larger than that of the second gallium nitride semiconductor. The carbon concentration Nc1 in the first gallium nitride semiconductor is not less than 4 X 10^17 cm-3, and the carbon concentration Nc2 in the second gallium nitride semiconductor is less than 4 X 10^16 cm-3.

    Abstract translation: 公开了具有高纯度沟道层和高电阻缓冲层的高电子迁移率晶体管。 具体公开了一种高电子迁移率晶体管(11),包括由氮化镓构成的支撑基底(13),由第一氮化镓半导体构成的缓冲层(15),由第二氮化镓构成的沟道层(17) 氮化镓半导体,由第三氮化镓半导体构成的半导体层(19)和用于晶体管(11)的电极结构(栅电极(21),源电极(23)和漏电极(25)), 。 第三氮化镓半导体的带隙大于第二氮化镓半导体的带隙。 第一氮化镓半导体中的碳浓度Nc1为4×10 ^ 17cm -3以上,第二氮化镓半导体中的碳浓度Nc2小于4×10 ^ 16cm-3。

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