Abstract:
PROBLEM TO BE SOLVED: To provide various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions.SOLUTION: One system includes a set of processor nodes 20 coupled to a detector 10 of an inspection system. Each of the processor nodes 20 is configured to receive a portion of image data generated by the detector 10 during scanning of a wafer 12. The system also includes an array 22 of storage media separately coupled to each of the processor nodes 20. The processor nodes 20 are configured to send all of the image data or a selected portion of the image data received by the processor nodes 20 to the arrays 22 of storage media such that all of the image data or the selected portion of the image data generated by the detector 10 during the scanning of the wafer 12 is stored in the arrays 22 of the storage media.
Abstract:
Die Erfindung betrifft die Verwendung der Photoreflexions-Spektroskopie, um die Deformation an oder in der Nähe der Kante eines Wafers in einem Fertigungsprozess zu messen. Die Messung der Deformation wird verwendet, um Mängel zu antizipieren und in den nachfolgenden Schritten des Fertigungsprozesses vorausblickend Korrekturen zu machen. Messungen der Deformation werden verwendet, um verschiedene Produktionsschritte mit Defekten zu verbessern, um dem nachfolgenden Herstellungsprozess zuzuordnen.
Abstract:
Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
Abstract:
Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.
Abstract:
Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.