公开(公告)号：US20140104799A1

公开(公告)日：2014-04-17

申请号：US13783161

申请日：2013-03-01

Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. ,  UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.

Inventor： JENCHUN CHEN ,  HSIN CHIN CHANG

IPC: H05K1/02

CPC classification number: H05K1/0284 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/5389 ,  H01L25/105 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/2018 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: A 3D stacked package structure includes a first unit, a molding unit, a conductive unit and a second unit. The first unit includes a first substrate and at least one first electronic component, and the first substrate has at least one runner and at least one first conductive pad. The molding unit includes a top portion, a frame, and at least one connection connected between the top portion and the frame. The conductive unit includes at least one conductor passing through the frame and electrically connected to the first conductive pad. Therefore, the first unit can be stacked on the second unit through the frame of the molding unit, and the first unit can be electrically connected to the second unit through the conductor of the conductive unit.

Abstract translation: 3D堆叠封装结构包括第一单元，模制单元，导电单元和第二单元。 第一单元包括第一基板和至少一个第一电子部件，并且第一基板具有至少一个流道和至少一个第一导电垫。 模制单元包括顶部，框架和连接在顶部和框架之间的至少一个连接。 导电单元包括至少一个穿过框架并且电连接到第一导电垫的导体。 因此，第一单元可以通过模制单元的框架堆叠在第二单元上，并且第一单元可以通过导电单元的导体与第二单元电连接。

公开(公告)号：US20140063768A1

公开(公告)日：2014-03-06

申请号：US13968620

申请日：2013-08-16

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Koichi Tanaka ,  Nobuyuki KURASHIMA ,  Hajime IIZUKA ,  Tetsuya KOYAMA

IPC: H05K1/18 ,  H05K3/36

CPC classification number: H05K1/185 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H05K1/186 ,  H05K3/36 ,  H05K2201/042 ,  H05K2201/10674 ,  Y10T29/49126 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L24/81 ,  H01L24/83 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/81

Abstract: An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate.

Abstract translation: 电子元件结合基板包括通过间隔单元彼此电连接的第一基板和第二基板。 电子部件安装在第一基板上并且布置在第一基板和第二基板之间。 第一封装树脂形成在第一基板和第二基板之间以封装电子部件。 在第一封装树脂的第一表面上形成第二封装树脂以填充第一封装树脂和第二基板之间的空间。 间隔单元包括沿第一基板和第二基板的堆叠方向堆叠的第一焊球，金属柱和第二焊球的堆叠结构。

公开(公告)号：US20140028161A1

公开(公告)日：2014-01-30

申请号：US13821872

申请日：2012-07-23

Applicant: Yutaka Kamogi

Inventor： Yutaka Kamogi

IPC: H02K11/00 ,  H05K1/14

CPC classification number: H02K11/0073 ,  H01R12/523 ,  H01R12/712 ,  H02K5/225 ,  H02K11/33 ,  H02K29/08 ,  H02K2211/03 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10356 ,  H05K2201/10424

Abstract: A motor control unit includes two circuit boards accommodated in a board housing, and a connection holder placed on an outer face of the board housing. The connection holder includes external connection terminals and connection pins. Each one of the circuit boards is provided with multiple through-holes for receiving the connection pins, each of which is formed of an external connection pin and an internal connection pin. The connection holder and the circuit boards are placed such that the connection pins penetrate the through-holes of the circuit boards respectively.

Abstract translation: 电机控制单元包括容纳在电路板壳体中的两个电路板和放置在电路板外壳的外表面上的连接保持架。 连接支架包括外部连接端子和连接引脚。 每个电路板设有多个用于接收连接销的通孔，每个连接销由外部连接销和内部连接销形成。 连接支架和电路板被放置成使得连接销分别穿过电路板的通孔。

公开(公告)号：US20140022751A1

公开(公告)日：2014-01-23

申请号：US13901631

申请日：2013-05-24

Applicant: FUJITSU LIMITED

Inventor： Mamoru Kurashina ,  Daisuke Mizutani ,  Taiga Fukumori

IPC: H05K1/14 ,  H05K3/46

CPC classification number: H05K1/144 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/147 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4697 ,  H05K2201/0154 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126

Abstract: An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.

Abstract translation: 电路装置包括：第一电路板，包括第一通孔，第一电极设置在第一电路板的正面上; 布置在所述第一电路板背面的第二电路板，所述第二电路板在所述第二电路板的前侧包括与所述第一电路板相关联的第二电极， 孔; 设置在所述第一电路板的前侧的半导体器件，所述半导体器件在背面包括与所述第一电极相关联的第三电极，以及与所述第二电极相关联的第四电极 ; 键合第一电极和第三电极的第一键合材料; 第二接合材料，其在通过所述第一通孔时接合所述第二电极和所述第四电极; 以及支撑体，其设置在所述第一电极和所述第二电路板之间并且支撑所述第一电路板。

公开(公告)号：US20130330966A1

公开(公告)日：2013-12-12

申请号：US14000851

申请日：2011-02-25

Applicant: Igor Perez-Uria ,  Ola Arvidsson

Inventor： Igor Perez-Uria ,  Ola Arvidsson

IPC: H01R13/516

CPC classification number: H01R13/516 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10871

Abstract: A connection pin for mounting in a through-hole provided in a component carrier of an electronic assembly, the connection pin comprising an anchoring part adapted for insertion into said through-hole, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The connection pin is provided with an internal cavity, which is provided with an outer opening at a free end of the anchoring part. The contact part is provided with a protruding elongated interconnection member at a free end thereof, and the respective shapes of the interconnection member and the internal cavity are such that the interconnection member is adapted for insertion into a corresponding internal cavity of another similar connection pin. A method for producing an electronic assembly with stackable modules is also disclosed.

Abstract translation: 一种用于安装在设置在电子组件的部件托架中的通孔中的连接销，所述连接销包括适于插入所述通孔的锚固部分，适于延伸到所述通孔外部的接触部分，以及 凸缘部分适于抵靠所述部件载体并且位于所述锚定部分和所述接触部分之间。 连接销设置有内部空腔，其在锚定部分的自由端处设置有外部开口。 接触部分在其自由端处设置有突出的细长互连构件，并且互连构件和内部空腔的相应形状使得互连构件适于插入到另一相似连接销的相应内部空腔中。 还公开了一种用于制造具有可堆叠模块的电子组件的方法。

公开(公告)号：US20130329352A1

公开(公告)日：2013-12-12

申请号：US13683955

申请日：2012-11-21

Applicant: APPLE INC.

Inventor： Jay S. Nigen ,  Ron A. Hopkinson ,  Derek J. Yap ,  Eric A. Knopf ,  William F. Leggett ,  Richard H. Tan

IPC: H05K7/20 ,  F28F21/00 ,  G06F1/20

CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。

公开(公告)号：US08552300B2

公开(公告)日：2013-10-08

申请号：US13223824

申请日：2011-09-01

Applicant: Atsushi Kozato

Inventor： Atsushi Kozato

IPC: H05K1/00

CPC classification number: H05K3/4691 ,  H05K2201/042 ,  H05K2201/055 ,  H05K2201/10409

Abstract: To provide a printed board fixing device capable of reducing the thickness and size with a simple structure. The printed board fixing device includes a coupling member which two-folds a flex rigid printed board that includes one and the other rigid printed boards via a flexible part and mutually couples and fixes the one and the other boards. The length of the coupling member is set to be within a range of entire thickness including the one and the other rigid printed boards. The coupling member is provided at two points on the one and the other rigid printed boards.

Abstract translation: 提供能够以简单结构减小厚度和尺寸的印刷板固定装置。 印刷电路板固定装置包括一个耦合构件，其通过柔性部分将包括一个和另一个刚性印刷电路板的柔性刚性印刷电路板折叠并相互耦合并固定在一个和另一个电路板上。 联接构件的长度被设定在包括一个和另一个刚性印刷板的整个厚度的范围内。 联接构件设置在一个和另一个刚性印刷板上的两个点处。

公开(公告)号：US20130230991A1

公开(公告)日：2013-09-05

申请号：US13866557

申请日：2013-04-19

Applicant: LEAR CORPORATION

Inventor： Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

IPC: H01R12/71

CPC classification number: H01R12/71 ,  H01R12/718 ,  H05K1/0262 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10303

Abstract: In at least one embodiment, a vehicle power module comprises a first printed circuit board (PCB) including a first plurality of electrical components for providing a first voltage and a second voltage. The vehicle power module further comprises a second PCB including a second plurality of electrical components, the second PCB being spaced away from the first printed circuit board and a first connector assembly being coupled to the first PCB and to the second PCB for providing the first voltage to the second PCB. The vehicle power module further comprises a second connector assembly being coupled to the first PCB and to the second PCB for providing the second voltage to the second PCB. The first connector assembly provides the first voltage of up to 14V and the second connector assembly provides the second voltage of 200V or greater.

Abstract translation: 在至少一个实施例中，车辆功率模块包括第一印刷电路板（PCB），其包括用于提供第一电压和第二电压的第一多个电气部件。 所述车辆动力模块还包括包括第二多个电气部件的第二PCB，所述第二PCB与所述第一印刷电路板间隔开;以及第一连接器组件，其耦合到所述第一PCB和所述第二PCB，以提供所述第一电压 到第二个PCB。 车辆动力模块还包括耦合到第一PCB和第二PCB的第二连接器组件，用于向第二PCB提供第二电压。 第一连接器组件提供高达14V的第一电压，并且第二连接器组件提供200V或更大的第二电压。

公开(公告)号：US20130228804A1

公开(公告)日：2013-09-05

申请号：US13781095

申请日：2013-02-28

Applicant: LEDENGIN, INC.

Inventor： Xiantao YAN

IPC: H01L33/08 ,  H01L33/48 ,  H01L33/58

CPC classification number: F21V19/003 ,  F21K9/90 ,  F21V5/007 ,  F21V5/04 ,  F21V9/30 ,  F21V21/14 ,  F21V23/005 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/58 ,  H01L33/647 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/0143 ,  H05K2203/171 ,  H01L2924/00

Abstract: A method for forming a flexible sheet of LED light emitters includes forming a micro lens sheet having a plurality of micro lenses, forming a phosphor sheet including a wave-length converting material, forming a flexible circuit sheet, forming a ceramic substrate sheet including a plurality of LED light emitters, and forming a support substrate including a thermally conductive material. The method also includes attaching the above sheets to form a stack including, from top to bottom, the micro lens sheet, the phosphor sheet, the flexible circuit sheet, the ceramic substrate sheet, and the support substrate.

Abstract translation: 一种用于形成LED发光体的柔性片的方法包括：形成具有多个微透镜的微透镜片，形成包括波长转换材料的荧光体片，形成柔性电路片，形成包括多个微透镜的陶瓷基片; 的LED发光体，并且形成包括导热材料的支撑基板。 该方法还包括连接上述片材以形成从顶部到底部的微透镜片，荧光片，柔性电路片，陶瓷基片和支撑基片的叠层。

公开(公告)号：US20130223035A1

公开(公告)日：2013-08-29

申请号：US13708768

申请日：2012-12-07

Applicant: PEGATRON CORPORATION

Inventor： Wei-Ting JHOU ,  Shih-Yi YANG

IPC: H05K1/14

CPC classification number: H05K1/141 ,  G06F1/185 ,  H05K3/366 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A motherboard is disclosed, which allows an expansion circuit board to be electrically connected to it. The motherboard includes a primary circuit board and an adapter component. The primary circuit board includes an expansion slot. The adapter component is connected to the expansion slot. The adapter component is used for being electrically connected to the expansion circuit board, such that the primary circuit board and the expansion circuit board can perform signal transmission via the adapter component. The expansion circuit board and the primary circuit board are not located on the same plane.

Abstract translation: 公开了一种主板，其允许扩展电路板与其电连接。 主板包括主电路板和适配器组件。 主电路板包括一个扩展槽。 适配器组件连接到扩展槽。 适配器部件用于电连接到扩展电路板，使得主电路板和扩展电路板可以经由适配器部件执行信号传输。 扩展电路板和主电路板不在同一平面上。