公开(公告)号：US6011693A

公开(公告)日：2000-01-04

申请号：US977247

申请日：1997-11-24

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01L41/053

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A surface mounting stress relief system for mounting a surface mount package such as a leadless ceramic chip carrier on a printed circuit board includes a printed circuit board having a top layer attached to a bottom layer. The top layer includes cavities for exposing top surface portion of the bottom layer which carry a plurality of solder pads. The surface mount package is positioned on the printed circuit board for placing the package bottom surface on a top surface of the printed circuit board between the cavities while positioning package contact pads in spaced relation above corresponding preselected solder pads. A solder column extends between each of the plurality of corresponding solder pads and the selected contact pads for providing an electrical connection. The solder column is formed by applying a solder paste to the solder pads on the printed circuit board, screening a low temperature solder paste onto each of the contact pads of the surface mount package, placing a solder ball onto each pad, and attaching the solder ball to each of the contact pads of the package by passing the package through a reflow oven for reflowing the low temperature solder paste without reflowing the high temperature solder ball.

Abstract translation: 用于将诸如无引线陶瓷芯片载体的表面贴装封装安装在印刷电路板上的表面安装应力消除系统包括具有连接到底层的顶层的印刷电路板。 顶层包括用于暴露底层的顶表面部分的空腔，其承载多个焊盘。 表面安装封装位于印刷电路板上，用于将封装底表面放置在印刷电路板的上表面之间，同时将封装接触焊盘定位在相应的预选焊盘上方。 焊料柱在多个对应的焊盘和所选择的接触焊盘中的每一个之间延伸以提供电连接。 焊料柱通过将焊膏涂布到印刷电路板上的焊盘上而形成，将低温焊膏筛选到表面贴装封装的每个接触焊盘上，将焊球放置在每个焊盘上，并将焊料 通过使包装通过回流炉以回流低温焊膏而不回流高温焊球，从而将其包裹到每个接触焊盘。

公开(公告)号：US5982626A

公开(公告)日：1999-11-09

申请号：US868256

申请日：1997-06-03

Applicant: Masahiro Kodama

Inventor： Masahiro Kodama

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01R12/61 ,  H05K1/118 ,  H05K3/363 ,  H05K1/0393 ,  H05K1/14 ,  H05K2201/048 ,  H05K2201/091 ,  H05K2201/09181 ,  H05K2201/0939 ,  H05K2203/167

Abstract: A flexible printed circuit board assembly comprising a first flexible printed circuit board and a second flexible printed circuit board, wherein each of the first and second flexible printed circuit boards is provided with a position fixing coupling to determine the position of the second flexible printed circuit board relative to the first flexible printed circuit board.

Abstract translation: 一种柔性印刷电路板组件，包括第一柔性印刷电路板和第二柔性印刷电路板，其中第一和第二柔性印刷电路板中的每一个设置有位置固定联接器，以确定第二柔性印刷电路板的位置 相对于第一柔性印刷电路板。

公开(公告)号：US5764117A

公开(公告)日：1998-06-09

申请号：US677925

申请日：1996-07-10

Applicant: Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

Inventor： Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

IPC: H01P1/205 ,  H01P1/213 ,  H01P5/08 ,  H01P7/04 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01P1/202

CPC classification number: H05K1/0243 ,  H01P1/2056 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10969 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/368

Abstract: A method of manufacturing a dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

Abstract translation: 一种制造介质谐振元件的方法包括至少一个电介质多级谐振器，其包括一个介电块，形成在一个介质块中的多个内导体形成孔，形成在每个内导体形成孔的内表面上的内导体 以及覆盖所述一个介质块的大致整个外表面的外导体，所述介质多级谐振器在所述一个介质块中构成多个介质谐振器; 以及固定安装在电介质多级谐振器上的安装基板，用于在电介质多级谐振器的每个介质谐振器和外部电路板之间传输信号，当介质谐振元件安装在外部电路板上时。 电介质多级谐振器还包括一对输入/输出电极，并且安装基板包括用于将电介质多级谐振器的输入/输出电极连接到形成在电路板上的一对输入/输出电极的单元。

公开(公告)号：US5754411A

公开(公告)日：1998-05-19

申请号：US806461

申请日：1997-02-26

Applicant: Gerard A. Woychik

Inventor： Gerard A. Woychik

IPC: H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K1/11 ,  H01R9/09

CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K3/3442 ,  H05K3/403

Abstract: A mounting for a solderable component module (SCM.TM.) interconnect module includes an elongated trench or blind via for receiving an edge of the module. The module may be a circuit board or other electrical device and preferably includes edge finger connectors. The elongated trench preferably includes hemicylinders located about the periphery. The hemicylinders provide plated through conductors for connecting to the finger connectors of the module. The trench is made according to an advantageous method in which the aperture is etched in order to remove barbs or extra copper material caused by milling the aperture. Preferably, the module fits into the trench with an interference or size-on-size fit. The trench may include strain relief areas. Additionally, the mounting can include apertures for receiving legs on the mounted board.

Abstract translation: 用于可焊接部件模块（SCM TM）互连模块的安装件包括用于接收模块边缘的细长沟槽或盲孔。 该模块可以是电路板或其他电气设备，并且优选地包括边缘指状连接器。 细长沟槽优选地包括位于周边周围的半圆柱体。 半圆柱体提供用于连接到模块的手指连接器的电镀通孔导体。 根据有利的方法制造沟槽，其中蚀刻孔径以便去除通过铣削孔而引起的倒钩或额外的铜材料。 优选地，模块以干涉或尺寸尺寸配合装配到沟槽中。 沟槽可以包括应变消除区域。 此外，安装件可以包括用于在安装的板上接收腿的孔。

公开(公告)号：US5625935A

公开(公告)日：1997-05-06

申请号：US227022

申请日：1994-04-13

Applicant: Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

Inventor： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

IPC: H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/58 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01R43/00

CPC classification number: H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/10 ,  H01L23/49805 ,  H05K3/403 ,  H01L2924/014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

公开(公告)号：US5488765A

公开(公告)日：1996-02-06

申请号：US226935

申请日：1994-04-13

Applicant: Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

Inventor： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

IPC: H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/58 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01R43/00

CPC classification number: H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/10 ,  H01L23/49805 ,  H05K3/403 ,  H01L2924/014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Abstract translation: 为了提供能够减小外部电极的配置间距的多层电子部件，在母层叠体中设置有填充有导电材料的通孔，该母层叠体通过在分开的位置层叠多个具有导体膜的绝缘片而获得 通过切割。 导电材料限定通过切割母层压板而获得的各个多层电子部件的外部电极。 不需要形成外部电极的特定步骤，并且可以在母体层叠体的状态下有效地测量每个多层电子部件的特性。

公开(公告)号：US5484965A

公开(公告)日：1996-01-16

申请号：US316667

申请日：1994-09-30

Applicant: Gerard A. Woychik

Inventor： Gerard A. Woychik

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K1/14

CPC classification number: H05K3/366 ,  H05K3/3452 ,  H05K1/117 ,  H05K2201/0373 ,  H05K2201/048 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/099 ,  H05K2203/044 ,  H05K2203/0769 ,  H05K2203/081 ,  H05K2203/087 ,  H05K3/3468 ,  H05K3/3494

Abstract: A mounting for a single in-line package (SIP) module includes an elongated slot aperture for receiving an edge of the module. The module may be a circuit board or other electrical device and preferably includes edge finger connectors. The elongated slot aperture preferably includes hemicylinders located about the periphery. The hemicylinders provide plated through conductors for connecting to the finger connectors of the module. The aperture is made according to an advantageous method in which the aperture is etched in order to remove barbs or extra copper material caused by milling the aperture. Preferably, the module fits into the aperture with an interference or size-on-size fit. The aperture may include strain relief areas.

Abstract translation: 用于单个在线封装（SIP）模块的安装件包括用于接收模块的边缘的细长的槽孔。 该模块可以是电路板或其他电气设备，并且优选地包括边缘指状连接器。 细长狭缝孔优选地包括位于周边周围的半圆柱体。 半圆柱体提供用于连接到模块的手指连接器的电镀通孔导体。 孔径是根据一种有利的方法制造的，其中孔被蚀刻以便去除通过铣削孔而引起的倒钩或额外的铜材料。 优选地，模块以干涉或尺寸尺寸配合装配到孔中。 孔可以包括应变消除区域。

公开(公告)号：US5383095A

公开(公告)日：1995-01-17

申请号：US145017

申请日：1993-10-29

Applicant: Iosif Korsunsky ,  Dimitry G. Grabbe ,  Robert C. Klotz

Inventor： Iosif Korsunsky ,  Dimitry G. Grabbe ,  Robert C. Klotz

IPC: H01R12/50 ,  H01R12/72 ,  H01R31/06 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H01R23/68 ,  H01R29/00 ,  H05K3/30

CPC classification number: H01R12/721 ,  H01R23/6873 ,  H05K3/3405 ,  H05K2201/09181 ,  H05K2201/10189 ,  H05K3/403 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49153

Abstract: A circuit board (12) and electrical connector (10) mounted to an edge (18) thereof is disclosed. The circuit board (12) includes an edge (18) and two major surfaces (14, 16) extending therefrom having circuitry (20). Plated through holes (24) are arranged adjacent the edge and are interconnected to circuitry on the circuit board. Each plated through hole (24) is associated with an opening such as a slot (26) or partial slot (27) that is formed in the edge (18) of the board so that it intersects the hole. The posts (32) of the connector (10) extend into the openings (26, 27) preferably in interference fit therewith whereafter soldering completes the electrical connections of the posts to the through holes.

Abstract translation: 公开了安装到其边缘（18）的电路板（12）和电连接器（10）。 电路板（12）包括边缘（18）和从其延伸的两个主表面（14,16），具有电路（20）。 电镀通孔（24）布置成与边缘相邻并且与电路板上的电路互连。 每个电镀通孔（24）与诸如形成在板的边缘（18）中的槽（26）或部分槽（27）的开口相关联，使得其与孔相交。 连接器（10）的柱（32）延伸到开口（26,27）中，优选地与其过度配合，然后焊接完成柱与通孔的电连接。

公开(公告)号：US5309326A

公开(公告)日：1994-05-03

申请号：US983895

申请日：1992-12-01

Applicant: Hirai Minoru

Inventor： Hirai Minoru

IPC: H01L23/12 ,  H01L23/498 ,  H05K1/14 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H01R23/68

CPC classification number: H05K1/141 ,  H01L23/49805 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/368

Abstract: A circuit module has a first circuit board, an IC chip mounted on the first circuit board, an electrode of the IC chip being connected to a wiring pattern of the first circuit board by a metal wire and the IC chip and the metal wire being coated with resin, and a second circuit board on which at least one unit of the first circuit board and the IC chip is mounted. The first circuit board is a double-side wired circuit board and the second circuit board is a single-side wired circuit board.

Abstract translation: 电路模块具有第一电路板，安装在第一电路板上的IC芯片，IC芯片的电极通过金属线连接到第一电路板的布线图案，并且IC芯片和金属线被涂覆 和第二电路板，其上安装有第一电路板和IC芯片的至少一个单元。 第一电路板是双面布线电路板，第二电路板是单面布线电路板。

公开(公告)号：US4994938A

公开(公告)日：1991-02-19

申请号：US290972

申请日：1988-12-28

Applicant: Daniel A. Baudouin

Inventor： Daniel A. Baudouin

IPC: H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09981 ,  H05K2201/10636 ,  H05K3/403 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A printed circuit board or other substrate mounts electrical components substantially coplanar with the median plane or thickness of the board or substrate. The board furnishes an opening having bonding pads plated through the opening and fixed on the opposite sidewalls of the opening. The electrical component becomes placed in the the opening with solder paste between the bonding pads and end terminals of the electrical component. Reflow soldering techniques melt the solder paste into solder filets that solidify to fasten the electrical component within the opening in coplanar with the median plane or thickness of the board.

Abstract translation: 印刷电路板或其它基板安装与基板或基板的中间平面或厚度基本上共面的电气部件。 板提供开口，其具有通过开口电镀并且固定在开口的相对侧壁上的焊盘。 电气部件通过在焊接焊盘和电气部件的端子之间的焊膏放置在开口中。 回流焊接技术将焊膏熔化成焊料，其固化，以将开口内的电气部件与板的中间平面或厚度共面紧固。